Texas Instruments LM3S1751-IBZ50-A2
- Part No.:
- LM3S1751-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1751-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 108BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,339
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S1751-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated hibernation module, 12-bit ADC (up to 1 MSPS), and dual UARTs. It operates at 50 MHz, supports 3.3 V supply, and targets low-power industrial control systems requiring real-time responsiveness and battery-backed operation.
For engineers reviewing the LM3S1751-IBZ50-A2 datasheet, LM3S1751-IBZ50-A2 pinout, LM3S1751-IBZ50-A2 application, or LM3S1751-IBZ50-A2 equivalent, key selection criteria include hibernation current (≤2 µA), RTC accuracy with external crystal, GPIO interrupt latency (<12 cycles), and UART FIFO depth (16-byte per channel).
Technical Context
The LM3S1751-IBZ50-A2 implements the ARMv7-M architecture with NVIC supporting up to 48 configurable interrupts and 8 priority levels. Its hibernation module integrates a 32.768 kHz RTC, battery-backed RAM (2 KB), and wake-up sources including GPIO, RTC match, and external signal.
Analog subsystem includes one 12-bit ADC with four sample sequencers, hardware averaging (up to 64 samples), and internal temperature sensor. Serial interfaces comprise two UARTs (with IrDA/SIR support), one SSI, and one I²C master/slave controller - all clocked from a programmable PLL-based system clock.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 @ 50 MHz - deterministic interrupt latency and Thumb-2 instruction set for compact, high-efficiency firmware. |
| Flash Memory | 256 KB - sufficient for bootloader + application + field-upgrade image in embedded control firmware. |
| SRAM | 64 KB - supports real-time task stacks, buffers for UART/SSI/I²C, and ADC data acquisition without external memory. |
| Hibernate Current | ≤2 µA - enables multi-year battery life in remote sensors or metering devices using coin-cell backup. |
| ADC Resolution & Speed | 12-bit, up to 1 MSPS - resolves 0.024% of full-scale range with sub-microsecond conversion for motor current sensing. |
| UART FIFO Depth | 16 bytes per channel - reduces CPU polling overhead and prevents overrun during burst serial communication. |
| RTC Accuracy | ±5 ppm with 32.768 kHz crystal - maintains timekeeping within ±2.6 seconds per day for timestamping and scheduled wake-up. |
Pinout & Package
LM3S1751-IBZ50-A2 is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions are defined across eight GPIO ports (Port A–H), each supporting multiple peripheral alternate functions and individual digital enable control.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Separate analog/digital/clock domain supplies enable noise isolation for ADC and PLL stability. |
| GND, GNDA, GNDC | Ground returns | Dedicated analog and clock ground pins minimize coupling into sensitive reference paths. |
| PF0–PF3 | GPIO / NMI / CAN0RX / CAN0TX | Configurable as general-purpose I/O or dedicated CAN physical layer interface - no external transceiver required for basic CAN node. |
| PA0–PA7 | GPIO / UART0 / SSI0 / I²C0 | Shared peripheral mapping allows flexible board routing; software-selectable function avoids fixed pin conflicts. |
| PD0–PD7 | GPIO / UART1 / PWM / ADC0 | Simultaneous UART1 receive and ADC0 sampling supported via DMA-triggered sequencing - eliminates CPU bottlenecks. |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module with RTC | Enables ultra-low-power sleep mode with precise wake-up timing and battery-backed 2 KB RAM retention - critical for energy-harvesting nodes. |
| Integrated CAN 2.0B Controller | On-chip CAN protocol engine with message objects and FIFO buffering - reduces BOM count and simplifies automotive/industrial bus node design. |
| Dual UART with IrDA/SIR Support | Hardware-level infrared modulation/demodulation eliminates external encoder/decoder ICs for remote control or diagnostic interfaces. |
| Programmable Clock System | Multiple PLL/divider paths allow independent clock domains for CPU, peripherals, and USB (if enabled) - improves power/performance trade-off. |
| GPIO Interrupt on Change | Each pin supports edge-triggered interrupt with individual mask and priority - enables responsive button, switch, or sensor event handling without polling. |
Applications
| Industrial Sensor Node | Smart Energy Meter |
|---|---|
Use Scenario: Battery-powered temperature/humidity/pressure sensor transmitting data hourly over RS-485 or LoRaWAN gateway. IC Role / Device Role / Timing Role: Main system controller managing ADC sampling, RTC-scheduled transmission, hibernation entry/exit, and UART-to-gateway interface. Use Value: 2 µA hibernate current extends 2× AA battery life beyond 5 years; integrated RTC eliminates need for external timekeeping IC. | Use Scenario: Residential electricity meter with tamper detection, load profiling, and optical port communication. IC Role / Device Role / Timing Role: Real-time energy calculation engine with pulse counting, temperature-compensated ADC, and secure time-stamped logging. Use Value: 12-bit ADC with hardware averaging achieves <0.5% measurement error across -25°C to +85°C; hibernation retains metering history during power outage. |
| Motor Control Interface | Building Automation Controller |
Use Scenario: Brushless DC motor driver with Hall-effect feedback, current sensing, and CAN bus command interface. IC Role / Device Role / Timing Role: Motion controller executing commutation logic, reading ADC current samples, generating PWM outputs, and reporting status via CAN. Use Value: Dual PWM modules with dead-time insertion and fault shutdown protect MOSFET bridges; CAN 2.0B compliance ensures interoperability with HVAC or elevator networks. | Use Scenario: DIN-rail mounted HVAC controller coordinating thermostats, dampers, and chillers via BACnet MS/TP or Modbus RTU. IC Role / Device Role / Timing Role: Protocol gateway translating between wired fieldbus and local sensor/actuator interfaces. Use Value: Dual UARTs support simultaneous Modbus master (to sensors) and slave (to BACnet router); GPIOs drive relay drivers and read limit switches directly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S1968-IBZ50-A2 | Same core and package but adds USB 2.0 device controller and increases SRAM to 96 KB. | Required when host-side USB connectivity (e.g., firmware update via virtual COM port) is mandatory. | Select LM3S1968-IBZ50-A2 only if USB functionality is needed; otherwise LM3S1751-IBZ50-A2 offers lower cost and identical peripheral set for non-USB designs. |
| TM4C123GH6PM | Newer generation with enhanced ADC (1 MSPS, 12-bit, 16-channel), FPU, and updated power management (deep-sleep current <1 µA). | Better suited for designs requiring floating-point math or tighter power budgets than legacy Stellaris platform allows. | TM4C123GH6PM is recommended for new designs targeting long-term availability and extended feature set; LM3S1751-IBZ50-A2 remains viable for cost-sensitive, volume production of existing Stellaris-based products. |
Compared with LM3S1968-IBZ50-A2, LM3S1751-IBZ50-A2 removes USB hardware to reduce die size and cost while retaining identical hibernation, CAN, and analog capabilities. Against TM4C123GH6PM, it lacks FPU and has higher hibernate current but maintains full register compatibility for legacy code migration where USB and extreme low-power are not required.
Availability
LM3S1751-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart energy meters, motor control interfaces, and building automation controllers requiring stable component supply and long-lifecycle support.
Supply support for LM3S1751-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 90 years of innovation in industrial, automotive, and consumer electronics.
The Stellaris LM3S series was designed as TI's first ARM Cortex-M3-based microcontroller family targeting cost-sensitive, real-time industrial control applications with integrated analog, communication, and ultra-low-power hibernation features.
FAQ
What is the maximum operating frequency of the LM3S1751-IBZ50-A2?
The LM3S1751-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz, derived from an internal PLL that accepts input from either the main oscillator (4–25 MHz) or precision internal oscillator (precision trimmed to ±1.5%). This frequency is specified under industrial temperature range (-40°C to +85°C) and 3.3 V supply conditions. The LM3S1751-IBZ50-A2 delivers consistent 50 MHz performance without requiring external clock conditioning circuitry.
Does the LM3S1751-IBZ50-A2 support CAN bus communication?
Yes, the LM3S1751-IBZ50-A2 integrates a full CAN 2.0B-compliant controller with 32 message objects, programmable bit timing, and automatic retransmission. Pins PF0 and PF3 are dedicated to CAN0RX and CAN0TX functions in the 100-pin LQFP package. The LM3S1751-IBZ50-A2 requires only an external CAN transceiver (e.g., SN65HVD230) to complete the physical layer - no additional protocol firmware is needed.
What is the hibernation current specification for the LM3S1751-IBZ50-A2?
The LM3S1751-IBZ50-A2 achieves ≤2 µA hibernation current when the hibernation module is active, RTC is running from a 32.768 kHz crystal, and 2 KB of battery-backed RAM is retained. This value is measured at 3.3 V and 25°C with all other peripherals disabled. The LM3S1751-IBZ50-A2 maintains this ultra-low current while supporting wake-up via GPIO, RTC alarm, or external signal - enabling multi-year operation on primary batteries.
How many UART interfaces does the LM3S1751-IBZ50-A2 provide?
The LM3S1751-IBZ50-A2 provides two independent UART modules (UART0 and UART1), each with 16-byte transmit and receive FIFOs, programmable baud-rate generation, and support for IrDA and SIR protocols. UART0 is mapped to PA0/PA1, and UART1 to PD0/PD1 in the default configuration. The LM3S1751-IBZ50-A2 supports simultaneous full-duplex operation on both channels with DMA-triggered transfers to minimize CPU load.
Is the LM3S1751-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
The LM3S1751-IBZ50-A2 uses a 100-pin LQFP package with a specific pinout defined in the SPMS029I datasheet. While several LM3S devices share the same 100-pin footprint (e.g., LM3S1968-IBZ50-A2), pin functions differ across variants - particularly for USB, Ethernet, and additional PWM channels. The LM3S1751-IBZ50-A2 is not pin-compatible with those parts due to differing peripheral mappings and missing USB signals; PCB layout must be verified against its exact pin assignment table.
LM3S1751-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 56
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1751-IBZ50-A2 FAQ
1.How can I place an order for LM3S1751-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1751-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1751-IBZ50-A2 reliable?
The price and inventory of LM3S1751-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1751-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1751-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1751-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1751-IBZ50-A2?
LM3S1751-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1751-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1751-IBZ50-A2?
For technical support, including LM3S1751-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1751-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S1751-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1751-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1751-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1751-IBZ50-A2?
All LM3S1751-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1751-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1751-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S1751-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S1751-IBZ50-A2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

