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Texas Instruments LM3S1751-IBZ50-A2T
- Part No.:
- LM3S1751-IBZ50-A2T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1751-IBZ50-A2T.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,658
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Product details
Overview
LM3S1751-IBZ50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 32 KB SRAM, integrated hibernation module, 8-channel 12-bit ADC, and dual UARTs. It operates at up to 50 MHz, supports hibernate wake-up via RTC or external pin, and targets low-power industrial control systems requiring deterministic real-time response.
For engineers reviewing the LM3S1751-IBZ50-A2T datasheet, LM3S1751-IBZ50-A2T pinout, LM3S1751-IBZ50-A2T application, or LM3S1751-IBZ50-A2T equivalent, key selection criteria include hibernation current (≤1.9 µA), integrated RTC with battery-backed memory, 50 MHz CPU clock tolerance, and support for JTAG/SWD debug interfaces in QFP-100 package.
Technical Context
The LM3S1751-IBZ50-A2T implements the ARMv7-M architecture with NVIC supporting 48 configurable interrupts, SysTick timer, and MPU for memory protection. Its hibernation module includes a 32-bit RTC, battery-backed 2 KB SRAM, and dedicated wake-up sources independent of main power domain.
Analog subsystem integrates an 8-channel 12-bit ADC with hardware averaging and internal temperature sensor; serial peripherals include two UARTs (one with IrDA SIR), two SSI modules, and one I²C interface-all clocked from programmable PLL-derived system clocks with independent enable/disable control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, 50 MHz max operation |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface and single-cycle access at 50 MHz |
| SRAM | 32 KB general-purpose SRAM + 2 KB battery-backed hibernation SRAM |
| ADC | 8-channel 12-bit SAR ADC with 1 MSPS sample rate, hardware averaging, and internal temp sensor |
| Hibernate Current | 1.9 µA typical with RTC running and 2 KB SRAM retained |
| Package | 100-pin LQFP (14 mm × 14 mm), RoHS-compliant, Pb-free |
| Operating Temp | –40°C to +85°C industrial grade temperature range |
Pinout & Package
LM3S1751-IBZ50-A2T is housed in a 100-pin LQFP (14 mm × 14 mm) package with standard 0.5 mm pitch. Pin functions are defined per TI SPMS029I datasheet Rev I, Section 8 (GPIO), Section 12 (UART), and Section 14 (I²C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Separate analog/digital/core domains enable noise isolation and independent power sequencing |
| GND, GNDA, GNDC | Ground returns | Dedicated analog/digital/core ground pins reduce coupling between signal domains |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO bank terminals | Configurable as digital I/O, alternate function (UART/SSI/I²C), or analog input (ADC) |
| RTCCLK, HIBRST | Hibernation control signals | Enable RTC clock source selection and hibernate reset assertion during wake-up |
| nSRST, TCK, TMS, TDI, TDO | JTAG debug interface | Support boundary scan, flash programming, and real-time debugging without halting CPU |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module | Enables sub-2 µA sleep mode with RTC, battery-backed SRAM, and wake-on-event-no external PMIC required |
| Integrated Temperature Sensor | On-die sensor calibrated to ±3°C accuracy over –40°C to +85°C for thermal monitoring without external components |
| Dual UART with IrDA Support | Second UART includes SIR encoder/decoder enabling infrared communication compliant with IrDA 1.0 physical layer |
| Programmable Clock System | Multiple PLL/divider paths allow independent clocking of peripherals at optimal frequencies without CPU throttling |
| Memory Protection Unit (MPU) | Configurable region-based access control prevents firmware corruption and enforces privilege separation in RTOS environments |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with position feedback, current sensing, and field-oriented control. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, PWM generation with dead-time insertion, and ADC sampling synchronized to commutation events. Use Value: 50 MHz Cortex-M3 delivers <1 µs interrupt latency; integrated hibernation enables rapid wake-from-sleep for duty-cycled operation. | Use Scenario: Battery-powered environmental sensor node measuring temperature, humidity, and pressure with periodic wireless upload. IC Role / Device Role / Timing Role: Data acquisition controller managing ADC, I²C sensor interface, UART-to-LoRa bridge, and ultra-low-power hibernation scheduling. Use Value: 1.9 µA hibernate current extends 2-AA battery life to >5 years; internal temp sensor eliminates calibration overhead. |
| Building Automation Panel | Medical Diagnostic Handheld |
Use Scenario: Wall-mounted HVAC controller with touch interface, local display, and BACnet/IP gateway functionality. IC Role / Device Role / Timing Role: System host managing UI rendering, sensor polling, network stack, and secure boot verification. Use Value: 256 KB flash accommodates dual-application image storage; MPU isolates UI and network tasks for safety compliance. | Use Scenario: Portable ECG monitor requiring clinical-grade signal integrity, low-noise analog front-end, and FDA-aligned firmware update capability. IC Role / Device Role / Timing Role: Signal processor acquiring 12-bit ECG data at 1 kSPS, applying digital filtering, and storing encrypted waveform buffers. Use Value: 12-bit ADC with hardware averaging reduces external anti-aliasing filter complexity; battery-backed SRAM preserves last-recorded trace during power loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S1968-IBZ50-A2T | Same core and package; adds Ethernet MAC, USB device, and enhanced GPIO count (64 vs 48) | Suitable for wired connectivity applications where LAN or USB host/device is required | Select when Ethernet or USB peripheral integration is mandatory; otherwise LM3S1751-IBZ50-A2T offers lower cost and smaller footprint |
| TM4C123GH6PM | Newer generation Cortex-M4F core, 80 MHz, FPU, 256 KB flash, 32 KB SRAM, same 100-pin LQFP | Better suited for floating-point intensive tasks (e.g., FFT, motor control math) and longer product lifecycle support | Choose TM4C123GH6PM for new designs needing FPU, higher performance, or extended TI support beyond 2018; LM3S1751-IBZ50-A2T remains valid for legacy-compatible or cost-sensitive deployments |
Compared with LM3S1751-IBZ50-A2T, LM3S1968-IBZ50-A2T adds connectivity peripherals at higher BOM cost, while TM4C123GH6PM provides architectural upgrades (M4F, FPU, higher clock) but requires firmware porting-making LM3S1751-IBZ50-A2T optimal for stable, low-power, non-connectivity industrial control.
Availability
LM3S1751-IBZ50-A2T is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, building automation panels, and medical diagnostic handhelds requiring stable component supply across long production lifecycles.
Supply support for LM3S1751-IBZ50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and wireless technologies since 1930.
The Stellaris LM3S series was designed specifically for cost-sensitive, low-power industrial and consumer embedded applications requiring ARM Cortex-M3 performance with integrated analog and hibernation capabilities.
FAQ
What is the maximum operating frequency of the LM3S1751-IBZ50-A2T?
The LM3S1751-IBZ50-A2T operates at a maximum CPU frequency of 50 MHz, as specified in the Texas Instruments SPMS029I datasheet Section 5.2.4 (Clock Control). This speed is achieved using the internal PLL with appropriate crystal or external clock source, and all peripherals remain fully functional at this rate without timing violations.
Does the LM3S1751-IBZ50-A2T support hardware debugging via JTAG?
Yes, the LM3S1751-IBZ50-A2T supports full JTAG debugging through dedicated pins (TCK, TMS, TDI, TDO, nTRST) as documented in Section 4 of the SPMS029I datasheet. It also supports SWD (Serial Wire Debug) mode, enabling real-time trace, flash programming, and breakpoint debugging without halting system operation.
How much battery-backed memory does the LM3S1751-IBZ50-A2T provide in hibernate mode?
The LM3S1751-IBZ50-A2T provides 2 KB of battery-backed SRAM within its hibernation module, accessible only when the device is in hibernate state and powered by VBAT. This memory retains data across main power loss and is explicitly mapped in the hibernation register space per Section 6.3.5 of the SPMS029I datasheet.
Can the LM3S1751-IBZ50-A2T's ADC perform hardware averaging?
Yes, the LM3S1751-IBZ50-A2T's 12-bit ADC supports configurable hardware sample averaging across 2, 4, 8, 16, 32, or 64 samples per conversion sequence, reducing noise without CPU intervention. This feature is controlled via the ADCSSOP0 register and is confirmed in Section 11.3.3 of the SPMS029I datasheet.
What is the hibernate current specification for the LM3S1751-IBZ50-A2T?
The LM3S1751-IBZ50-A2T achieves a typical hibernate current of 1.9 µA when the RTC is active and 2 KB of battery-backed SRAM is retained, as measured under conditions specified in Section 6.3.6 of the SPMS029I datasheet (VBAT = 3.0 V, T = 25°C). This value excludes external circuit leakage.
LM3S1751-IBZ50-A2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 56
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1751-IBZ50-A2T FAQ
1.How can I place an order for LM3S1751-IBZ50-A2T through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1751-IBZ50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1751-IBZ50-A2T reliable?
The price and inventory of LM3S1751-IBZ50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1751-IBZ50-A2T is usually 5 days.
3.What payment methods are accepted for LM3S1751-IBZ50-A2T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1751-IBZ50-A2T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1751-IBZ50-A2T?
LM3S1751-IBZ50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1751-IBZ50-A2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1751-IBZ50-A2T?
For technical support, including LM3S1751-IBZ50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1751-IBZ50-A2T requirements.
6.How does Aetrix verify that LM3S1751-IBZ50-A2T is sourced from the original manufacturer or authorized distributors?
All LM3S1751-IBZ50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1751-IBZ50-A2T meets industry standards.
7.What is the process for return or replacement of LM3S1751-IBZ50-A2T?
All LM3S1751-IBZ50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1751-IBZ50-A2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1751-IBZ50-A2T part is unused and in its original packaging.
Return procedure for LM3S1751-IBZ50-A2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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