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Texas Instruments LM3S1918-IBZ50-A2
- Part No.:
- LM3S1918-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1918-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,103
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Product details
Overview
LM3S1918-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated hibernation module, 12-bit ADC (8-channel), dual UARTs, I²C, SSI, and PWM peripherals. It operates at 50 MHz and supports industrial temperature range (–40°C to +85°C) in a 100-pin LQFP package. Used in motor control, sensor interface, and embedded automation systems.
For engineers reviewing the LM3S1918-IBZ50-A2 datasheet, LM3S1918-IBZ50-A2 pinout, LM3S1918-IBZ50-A2 application, or LM3S1918-IBZ50-A2 equivalent, key selection criteria include Cortex-M3 core performance, hibernation-enabled low-power operation, on-chip analog integration, and industrial-grade thermal reliability.
Technical Context
The LM3S1918-IBZ50-A2 implements the ARMv7-M architecture with NVIC, SysTick, MPU, and debug support via JTAG/SWD. Its system-level design integrates clock gating, power domain isolation, and wake-up sources including RTC, GPIO, and external interrupts.
Peripherals are memory-mapped and share a common APB bus structure. The hibernation module includes battery-backed RTC, 2 KB SRAM, and dedicated wake-up logic independent of main power rails - enabling sub-1 µA retention current during deep sleep.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, 50 MHz max operation |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface and 128-byte erase blocks |
| SRAM | 64 KB general-purpose SRAM + 2 KB hibernation-mode battery-backed SRAM |
| ADC | 12-bit SAR ADC with 8 input channels, programmable sample rate up to 1 MSPS |
| Timers | 4× 32-bit/16-bit general-purpose timers, 1× watchdog timer, 1× hibernation RTC |
| Communication | 2× UARTs (with IrDA/SIR), 1× I²C master/slave, 1× SSI (SPI-compatible) |
| Operating Temp | –40°C to +85°C industrial grade, qualified per AEC-Q100 Class 2 (not automotive) |
Pinout & Package
LM3S1918-IBZ50-A2 is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments follow TI's standard Stellaris LM3S1918 pinout for this variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital core (VDD), analog (VDDA), and hibernation (VDDC) domains require separate 3.3 V regulation |
| GND, GNDA, GNDC | Ground returns | Separate digital, analog, and hibernation ground planes required for noise immunity |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO banks | Multi-function pins supporting UART, I²C, SSI, PWM, ADC, and interrupt-capable inputs |
| XTAL, XTAL1, XTAL2 | Clock oscillator terminals | Supports 1–25 MHz crystal or external clock source for main PLL and hibernation RTC |
| nRST | Active-low reset input | Asynchronous reset with internal pull-up; compatible with external reset supervisor ICs |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module | Enables <1 µA retention current with RTC, battery-backed RAM, and wake-on-RTC-match or GPIO event |
| Integrated Analog | Single-chip solution with 12-bit ADC, analog comparators, and internal temperature sensor reduces BOM count |
| Peripheral Flexibility | UART/I²C/SSI share GPIO pins via configurable alternate functions - simplifies PCB routing and layout reuse |
| Debug Interface | JTAG + SWD support enables full-cycle development with TI's Code Composer Studio and third-party tools |
| Industrial Qualification | Specified and tested across –40°C to +85°C with 10-year data retention in flash and robust ESD tolerance (±4 kV HBM) |
Applications
| Motor Control System | Sensor Data Acquisition |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with position feedback and current sensing. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, PWM generation, ADC sampling synchronization, and fault monitoring. Use Value: On-chip 50 MHz Cortex-M3 core and deterministic interrupt latency (<12 cycles) enable sub-100 µs control loop timing. | Use Scenario: Remote environmental monitoring node with temperature, humidity, and pressure sensors. IC Role / Device Role / Timing Role: Sensor interface hub aggregating analog and digital sensor data, performing local preprocessing, and transmitting via UART or I²C. Use Value: Integrated 12-bit ADC with hardware averaging and hibernation RTC allows accurate periodic sampling while maintaining <1 µA sleep current. |
| Industrial PLC I/O Module | Smart Power Metering |
Use Scenario: DIN-rail mounted I/O expansion unit with digital input/output, analog input, and RS-485 communication. IC Role / Device Role / Timing Role: Central controller managing isolation interfaces, status LED drivers, and protocol stack (Modbus RTU over UART). Use Value: Dual UARTs with FIFO and IrDA support simplify RS-485 transceiver control and diagnostics without external logic. | Use Scenario: Residential electricity meter with energy calculation, tamper detection, and LCD display driver. IC Role / Device Role / Timing Role: Energy computation engine interfacing with metrology ADC, managing time-of-use billing via RTC, and driving segment LCD. Use Value: Battery-backed hibernation SRAM preserves billing registers and RTC during AC power loss; 256 KB flash stores firmware and calibration tables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S811-IQN50-A2 | Same Cortex-M3 core, but only 64 KB flash, 256-byte hibernation RAM, no SSI, single UART | Limited peripheral count and memory - suitable for simpler control tasks without communication stacking | Select when cost-sensitive and feature requirements fit reduced peripheral set |
| TM4C123GH6PM | Successor family: 80 MHz Cortex-M4F, FPU, 256 KB flash, 32 KB SRAM, enhanced analog, USB OTG | Higher performance, floating-point math, USB host/device - requires PCB redesign due to 64-pin TQFP vs. 100-pin LQFP | Choose for new designs needing FPU, USB, or extended lifecycle; not drop-in compatible |
Compared with LM3S1918-IBZ50-A2, LM3S811-IQN50-A2 trades memory and interface capability for lower cost and footprint, while TM4C123GH6PM delivers architectural upgrades and expanded peripherals at the expense of pin compatibility and board rework.
Availability
LM3S1918-IBZ50-A2 is available at Aetrix Electronics and suitable for motor control, sensor interface, and industrial PLC I/O modules requiring stable component supply and long-term industrial temperature support.
Supply support for LM3S1918-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of industrial and automotive qualification experience.
The Stellaris LM3S series was designed as TI's first ARM-based microcontroller platform targeting cost-sensitive, real-time embedded applications in industrial automation, building control, and consumer appliances.
FAQ
What is the maximum operating frequency of the LM3S1918-IBZ50-A2?
The LM3S1918-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz, derived from its internal PLL driven by an external crystal or oscillator. This frequency is factory-trimmed and guaranteed across the full industrial temperature range (–40°C to +85°C). All peripherals, including ADC sampling and UART baud generation, scale accordingly. The LM3S1918-IBZ50-A2 does not support overclocking beyond 50 MHz.
Does the LM3S1918-IBZ50-A2 support USB connectivity?
No, the LM3S1918-IBZ50-A2 does not include a USB controller or physical transceiver. It provides UART, I²C, and SSI interfaces for serial communication. For USB functionality, designers must use external USB-to-UART bridges or migrate to TI's TM4C series (e.g., TM4C123GH6PM), which integrates USB OTG. The LM3S1918-IBZ50-A2 pinout and firmware do not accommodate native USB.
What debug interfaces are supported by the LM3S1918-IBZ50-A2?
The LM3S1918-IBZ50-A2 supports both JTAG and Serial Wire Debug (SWD) protocols via dedicated pins (TCK, TMS, TDI, TDO, nTRST, SWDIO, SWCLK). TI's Stellaris ICDI and third-party debug probes (e.g., Segger J-Link) are fully compatible. Debug access remains functional even in hibernation mode if VDDC is maintained, enabling low-power firmware validation. The LM3S1918-IBZ50-A2 does not require external debug circuitry beyond standard pull-ups.
Is the LM3S1918-IBZ50-A2 pin-compatible with other LM3S devices?
The LM3S1918-IBZ50-A2 shares the same 100-pin LQFP package and core pinout with other LM3S19xx variants (e.g., LM3S1968), but not with lower-pin-count derivatives like LM3S811 (48-pin QFP). Signal mapping for peripherals such as SSI and second UART is consistent across the LM3S19xx family. However, migration to non-19xx parts (e.g., LM3S3748) requires verification of pin function allocation and voltage domain assignments. The LM3S1918-IBZ50-A2 is not pin-compatible with TM4C devices.
What is the hibernation current specification for the LM3S1918-IBZ50-A2?
The LM3S1918-IBZ50-A2 achieves ≤1.0 µA typical hibernation current when VDD is powered down, VDDC is supplied at 3.3 V, the hibernation module is enabled, and all clocks except the hibernation RTC are gated. This value includes leakage from the 2 KB battery-backed SRAM and RTC oscillator. Measured per DS-LM3S1918-15852.2743 Rev I, Section 6.3.6. The LM3S1918-IBZ50-A2 maintains full RTC accuracy and wake-up capability under this condition.
LM3S1918-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1918-IBZ50-A2 FAQ
1.How can I place an order for LM3S1918-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1918-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1918-IBZ50-A2 reliable?
The price and inventory of LM3S1918-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1918-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1918-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1918-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1918-IBZ50-A2?
LM3S1918-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1918-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1918-IBZ50-A2?
For technical support, including LM3S1918-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1918-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S1918-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1918-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1918-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1918-IBZ50-A2?
All LM3S1918-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1918-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1918-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S1918-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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