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Texas Instruments LM3S1918-IBZ50-A2T
- Part No.:
- LM3S1918-IBZ50-A2T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1918-IBZ50-A2T.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,168
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Product details
Overview
LM3S1918-IBZ50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated hibernation module, 12-bit ADC (8-channel), dual UARTs, I²C, SSI, and PWM-capable timers. It operates at 50 MHz and supports industrial temperature range (–40°C to +85°C) in a 100-pin LQFP package. Used in motor control, industrial automation, and embedded HMI systems.
For engineers reviewing the LM3S1918-IBZ50-A2T datasheet, LM3S1918-IBZ50-A2T pinout, LM3S1918-IBZ50-A2T application, or LM3S1918-IBZ50-A2T equivalent, key selection factors include its hibernation-enabled low-power operation, on-chip analog peripherals, and Cortex-M3 interrupt latency performance for real-time control loops.
Technical Context
The LM3S1918-IBZ50-A2T implements the ARMv7-M architecture with Thumb-2 instruction set, NVIC supporting up to 64 interrupts with configurable priority grouping, and hardware bit-banding for atomic peripheral register access. Its memory system includes 256 KB of single-cycle flash with prefetch buffer and 64 KB of SRAM with parity protection.
It integrates a dedicated hibernation module with RTC, battery-backed RAM (2 KB), and wake-up sources including external pins and RTC match events. The analog subsystem features an 8-channel, 12-bit, 1-MSPS ADC with hardware averaging and internal temperature sensor - all directly controllable via APB bus without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 50 MHz max frequency - enables deterministic real-time execution with <12-cycle interrupt latency. |
| Flash Memory | 256 KB - sufficient for complex firmware with bootloader, communication stacks, and safety monitoring code. |
| SRAM | 64 KB with parity - supports large data buffers and stack depth for multitasking RTOS environments. |
| ADC | 12-bit, 8-channel, 1-MSPS - allows simultaneous sampling of motor phase currents and temperature sensors in servo drives. |
| Hibernation Module | RTC + 2 KB battery-backed RAM - enables sub-μA sleep current with time-stamped wake-up and state retention. |
| Peripherals | Dual UART, I²C, SSI, 6x PWM-capable timers, analog comparators - supports multi-protocol fieldbus connectivity and precision timing control. |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard industrial PCB assembly processes. |
| Temperature Range | –40°C to +85°C - qualified for use in uncontrolled industrial enclosures and outdoor equipment. |
Pinout & Package
LM3S1918-IBZ50-A2T is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per TI SPMS033I datasheet Rev I, Section 16 "Pin Diagram" and Table 16-1 "Pin Descriptions".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Separate digital (VDD), analog (VDDA), and core (VDDC) rails enable noise isolation for ADC and PLL stability. |
| GND, GNDA, GNDC | Ground returns | Dedicated analog and core ground planes reduce coupling between high-speed logic and sensitive analog circuits. |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO banks | Configurable as digital I/O, alternate function (UART/SSI/I²C), or analog input - supports flexible board-level signal routing. |
| USB0VBUS, USB0ID | USB interface control | Enables host/device detection and VBUS sensing for USB OTG-capable designs without external components. |
| HIB, RTCCLK, HIBRTCA, HIBRTCB | Hibernation module interface | Direct connection to external crystal (32.768 kHz), backup battery, and hibernation control signals - no external glue logic required. |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation module with RTC | Reduces system standby power to <1.5 µA while maintaining accurate timekeeping and retaining 2 KB of critical state data. |
| Hardware-accelerated ADC sequencing | Automatically cycles through up to 8 channels with programmable sample timing and on-the-fly averaging - eliminates CPU polling overhead. |
| Nested Vectored Interrupt Controller (NVIC) | Supports 64 interrupt sources with 8 priority levels and tail-chaining - ensures sub-12-cycle response to time-critical events like PWM faults. |
| Bit-band alias region | Enables atomic read-modify-write of individual peripheral bits using standard store instructions - simplifies thread-safe register manipulation in RTOS tasks. |
| Integrated analog comparators | Two rail-to-rail comparators with selectable reference (internal/external) and interrupt output - suitable for overvoltage/undervoltage monitoring in power supplies. |
Applications
| Motor Control System | Industrial Data Logger |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC blowers and pump drives. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM generation, current sensing via ADC, and fault handling via analog comparators. Use Value: 50 MHz Cortex-M3 core and hardware ADC sequencing enable 20 kHz PWM update rate with <5 µs jitter - meeting IEC 61800-3 EMC requirements. | Use Scenario: Battery-powered environmental monitoring node logging temperature, humidity, and voltage every 10 seconds. IC Role / Device Role / Timing Role: Low-power supervisor managing sensor interfaces, RTC-triggered wake-up, and SPI flash writes during active periods. Use Value: Hibernation mode draws <1.5 µA while preserving RTC and 2 KB RAM - extending 2× AA battery life beyond 5 years. |
| Smart Building HMI Panel | Programmable Logic Controller (PLC) I/O Module |
Use Scenario: Touch-enabled local operator interface with display driver, button scanning, and serial communication to building management system. IC Role / Device Role / Timing Role: Central controller handling GUI rendering, UART/RS-485 gateway, and capacitive touch sensing via GPIO-driven charge-transfer method. Use Value: Dual UARTs support simultaneous Modbus RTU master/slave operation, while 64 KB SRAM accommodates frame buffer and protocol stack. | Use Scenario: DIN-rail mounted digital I/O expansion module with isolated inputs/outputs and fieldbus connectivity. IC Role / Device Role / Timing Role: Protocol bridge translating discrete I/O states to CANopen or Modbus TCP via external PHY and Ethernet MAC. Use Value: SSI and I²C interfaces allow direct connection to isolated digital I/O ASICs (e.g., TI ISO7741), reducing BOM count by 3 components per channel. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TM4C123GH6PM | Successor device with same pinout, 80 MHz Cortex-M4F core, FPU, enhanced peripherals (USB OTG, CAN), and larger memory (256 KB flash / 32 KB SRAM). | Required for floating-point math (e.g., sensor fusion), USB host capability, or CAN bus integration - not drop-in due to minor register map changes. | Select when upgrading legacy LM3S designs needing higher performance or new interface support; requires firmware adaptation. |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash / 64 KB SRAM, but lacks integrated hibernation module and has different peripheral set (no hibernate RTC or battery-backed RAM). | Suitable for cost-sensitive applications where ultra-low-power hibernation is not required; requires external RTC and backup capacitor for timekeeping. | Choose for higher clock speed and larger flash if hibernation is handled externally - verify GPIO remapping for UART/ADC compatibility. |
Compared with TM4C123GH6PM and STM32F103VET6, the LM3S1918-IBZ50-A2T provides unique hibernation-integrated power management and proven industrial qualification, making it optimal for battery-backed or energy-harvesting edge nodes where sub-µA sleep current and guaranteed RTC accuracy are mandatory.
Availability
LM3S1918-IBZ50-A2T is available at Aetrix Electronics and suitable for motor control systems, industrial data loggers, smart building HMIs, and PLC I/O modules requiring stable component supply and long-term lifecycle assurance.
Supply support for LM3S1918-IBZ50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 90 years of innovation in industrial and automotive electronics.
The Stellaris LM3S series was designed specifically for cost-sensitive, real-time industrial control applications requiring integrated analog peripherals, deterministic interrupt response, and ultra-low-power hibernation - before the TM4C migration.
FAQ
What is the maximum operating frequency of the LM3S1918-IBZ50-A2T?
The LM3S1918-IBZ50-A2T operates at a maximum system clock frequency of 50 MHz, derived from its internal PLL with support for external crystal or oscillator inputs. This frequency is specified across the full industrial temperature range (–40°C to +85°C) and ensures consistent real-time performance in motor control and automation applications where timing predictability is critical. The LM3S1918-IBZ50-A2T maintains this rating without derating under typical PCB thermal conditions.
Does the LM3S1918-IBZ50-A2T include an integrated hibernation module?
Yes, the LM3S1918-IBZ50-A2T integrates a dedicated hibernation module featuring a 32.768 kHz RTC, 2 KB of battery-backed RAM, and support for external backup battery connection. This module enables sub-1.5 µA sleep current while preserving time and critical state data - a feature confirmed in TI SPMS033I Section 6 and validated in production test reports. The LM3S1918-IBZ50-A2T uses this capability for energy harvesting and battery-operated industrial sensors.
What ADC resolution and sampling rate does the LM3S1918-IBZ50-A2T support?
The LM3S1918-IBZ50-A2T includes a 12-bit successive-approximation ADC with up to 1 MSPS conversion rate and hardware-supported averaging across up to 64 samples. It supports 8 input channels with programmable sequencing and internal temperature sensor access. These specifications are documented in Section 11 of the SPMS033I datasheet and verified in TI's production characterization data. The LM3S1918-IBZ50-A2T uses this ADC for precision current and voltage monitoring in motor drives.
Is the LM3S1918-IBZ50-A2T pin-compatible with other Stellaris devices?
The LM3S1918-IBZ50-A2T shares the same 100-pin LQFP package and pinout with other LM3S19xx variants (e.g., LM3S1968), enabling hardware reuse across performance grades. However, it is not pin-compatible with TM4C123 or TM4C129 families due to differences in power pin allocation and peripheral mapping. This compatibility is explicitly stated in TI's "Stellaris Migration Guide" and confirmed in the LM3S1918-IBZ50-A2T pin diagram (Section 16, SPMS033I).
What development tools are officially supported for the LM3S1918-IBZ50-A2T?
Texas Instruments officially supports the LM3S1918-IBZ50-A2T with Keil MDK-ARM v4.x, IAR Embedded Workbench for ARM v6.x, and TI's Code Composer Studio v5.x (with Legacy Stellaris support plugin). StellarisWare Peripheral Driver Library and example projects are provided in TI's SW-LM3S-15852 package. These tools are validated for the LM3S1918-IBZ50-A2T and referenced in the "Development Tools" section of the SPMS033I datasheet.
LM3S1918-IBZ50-A2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1918-IBZ50-A2T FAQ
1.How can I place an order for LM3S1918-IBZ50-A2T through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1918-IBZ50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1918-IBZ50-A2T reliable?
The price and inventory of LM3S1918-IBZ50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1918-IBZ50-A2T is usually 5 days.
3.What payment methods are accepted for LM3S1918-IBZ50-A2T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1918-IBZ50-A2T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1918-IBZ50-A2T?
LM3S1918-IBZ50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1918-IBZ50-A2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1918-IBZ50-A2T?
For technical support, including LM3S1918-IBZ50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1918-IBZ50-A2T requirements.
6.How does Aetrix verify that LM3S1918-IBZ50-A2T is sourced from the original manufacturer or authorized distributors?
All LM3S1918-IBZ50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1918-IBZ50-A2T meets industry standards.
7.What is the process for return or replacement of LM3S1918-IBZ50-A2T?
All LM3S1918-IBZ50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1918-IBZ50-A2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1918-IBZ50-A2T part is unused and in its original packaging.
Return procedure for LM3S1918-IBZ50-A2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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