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Texas Instruments LM3S1918-IQC50-A2

Part No.:
LM3S1918-IQC50-A2
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixLM3S1918-IQC50-A2.pdf
Description:
IC MCU 32BIT 256KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,788

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Product details

Overview

LM3S1918-IQC50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated hibernation module, 12-bit ADC (8-channel), dual UARTs, I²C, SSI, and PWM-capable timers. It operates at up to 50 MHz and supports industrial motor control and sensor interface applications.

For engineers reviewing the LM3S1918-IQC50-A2 datasheet, LM3S1918-IQC50-A2 pinout, LM3S1918-IQC50-A2 application, or LM3S1918-IQC50-A2 equivalent, key selection criteria include hibernation-enabled low-power operation, on-chip RTC with battery-backed memory, and peripheral integration for real-time embedded control without external timing or power management ICs.

Technical Context

The LM3S1918-IQC50-A2 implements the ARMv7-M architecture with NVIC, SysTick, and MPU for deterministic real-time execution. Its hibernation module includes a 32.768-kHz RTC, battery-backed 256-byte RAM, and wake-up capability via GPIO or RTC match.

Peripherals are clock-gated and configurable via system control registers; ADC supports hardware averaging and temperature sensing; UARTs include IrDA/SIR support and 16-byte FIFOs; all timers support one-shot, periodic, PWM, and input capture modes with flexible prescaling.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, 50 MHz max operation
Memory256 KB on-chip flash (programmable in 1 KB sectors), 64 KB SRAM
ADC12-bit SAR ADC with 8 single-ended or 4 differential inputs, 1 MSPS sample rate, internal temperature sensor
TimersTwo 32-bit or four 16-bit general-purpose timers; one 32-bit RTC timer with hibernation support
CommunicationDual UARTs (IrDA/SIR capable), one I²C master/slave, one SSI (SPI/SSI/Microwire)
HibernationDedicated hibernation module with 32.768 kHz RTC, battery-backed 256 B RAM, GPIO/RTC wake-up sources
Package100-pin LQFP (14 mm × 14 mm), 0.5 mm pitch, RoHS-compliant

Pinout & Package

LM3S1918-IQC50-A2 is housed in a 100-pin LQFP package (JEDEC MO-152AC) with exposed thermal pad. Pin functions are organized into GPIO banks (A–G), analog inputs (AIN0–AIN7), crystal oscillator (XIN/XOUT), JTAG debug (TCK/TMS/TDI/TDO/nTRST), and power/ground rails.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDCPower supply inputsSeparate digital (VDD), analog (VDDA), and core (VDDC) rails enable noise isolation for ADC and PLL stability
GND, GNDA, GNDCGround returnsDedicated analog (GNDA) and core (GNDC) grounds reduce coupling between signal domains
XIN / XOUTCrystal oscillator terminalsSupports 1–25 MHz crystal or external clock; enables precise timing for RTC and system clock generation
PA0–PA7, PB0–PB7, etc.GPIO bank pinsConfigurable as digital I/O, alternate function (UART, SSI, I²C), or analog input (AIN0–AIN7)
TCK / TMS / TDI / TDO / nTRSTJTAG debug interfaceFull IEEE 1149.1 boundary-scan and SWD-compatible debug access for firmware development and validation

Key Features

FeatureDesign Value
Hibernation ModuleEnables sub-μA sleep current with RTC and 256 B battery-backed RAM retention-critical for battery-powered remote sensors
Integrated Temperature SensorOn-die sensor calibrated to ±3°C accuracy over –40°C to +85°C, eliminating need for external thermal monitoring ICs
Dual UART with IrDA/SIRSupports infrared communication and serial protocol bridging without external transceivers or level shifters
Hardware ADC AveragingConfigurable 2–64-sample hardware averaging reduces software overhead and improves SNR for noisy industrial analog signals
Peripheral Clock GatingIndividual enable/disable control per peripheral reduces dynamic power by disabling unused blocks-essential for energy-constrained designs

Applications

Industrial Motor ControlSmart Sensor Node

Use Scenario: Closed-loop BLDC motor drive with current sensing, commutation logic, and fault protection.

IC Role / Device Role / Timing Role: Real-time controller executing FOC algorithms, managing PWM outputs, sampling ADC channels, and handling overcurrent interrupts.

Use Value: Integrated hibernation and RTC allow scheduled wake-up for periodic diagnostics; 50 MHz CPU ensures <1 μs interrupt latency for safety-critical fault response.

Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and pressure with wireless upload.

IC Role / Device Role / Timing Role: System-on-chip host managing sensor interfaces, data logging, low-power scheduling, and UART-based RF module control.

Use Value: Sub-10 μA hibernation current extends battery life to >5 years; on-chip temperature sensor eliminates calibration drift from external components.

Programmable Logic Controller (PLC) I/O ModuleMedical Diagnostic Equipment

Use Scenario: DIN-rail mounted I/O expansion unit with isolated digital inputs, analog inputs, and RS-485 communication.

IC Role / Device Role / Timing Role: Central processor for signal conditioning, protocol translation (Modbus RTU over UART), and watchdog-managed firmware updates.

Use Value: Dual UARTs support simultaneous host communication and fieldbus interface; hardware CRC engine offloads checksum computation from CPU.

Use Scenario: Portable ECG or pulse oximeter requiring precise analog front-end timing and low-noise signal acquisition.

IC Role / Device Role / Timing Role: Signal acquisition controller synchronizing ADC sampling, filtering, and secure data export via UART or USB (with external PHY).

Use Value: 12-bit ADC with hardware averaging achieves >10-bit effective resolution at 1 kSPS; separate VDDA/GNDA rails minimize digital switching noise on analog measurements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM3S811-IQN50-A2Same Cortex-M3 core, but only 64 KB flash, 256 KB SRAM, no hibernation module or RTCLacks battery-backed RTC and low-power hibernation-unsuitable for long-term unattended operationSelect LM3S1918-IQC50-A2 when hibernation, RTC, and larger flash are required for firmware updates and time-stamped logging
TM4C123GH6PMSuccessor family with enhanced peripherals (USB, CAN), 80 MHz CPU, 256 KB flash, same 100-pin LQFP packageIncludes USB OTG and CAN FD; requires updated BSP and toolchain; not drop-in compatible due to register map changesChoose TM4C123GH6PM for new designs needing USB connectivity or automotive-grade CAN; LM3S1918-IQC50-A2 remains optimal for legacy hibernation-critical deployments

Compared with LM3S811-IQN50-A2, the LM3S1918-IQC50-A2 adds hibernation and doubles flash capacity-enabling secure OTA updates and extended data buffering. Against TM4C123GH6PM, it trades newer features for proven low-power reliability in field-deployed sensor nodes where USB/CAN are unnecessary.

Availability

LM3S1918-IQC50-A2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, PLC I/O modules, and portable medical diagnostic equipment requiring stable component supply and long-term lifecycle support.

Supply support for LM3S1918-IQC50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in industrial and automotive microcontrollers.

The Stellaris LM3S series was designed specifically for cost-sensitive, real-time embedded applications demanding integrated analog, low-power hibernation, and deterministic interrupt response-targeting industrial automation and sensor edge nodes.

FAQ

What is the maximum operating frequency of the LM3S1918-IQC50-A2?

The LM3S1918-IQC50-A2 operates at a maximum system clock frequency of 50 MHz. This is achieved using an internal PLL that multiplies the input crystal or external clock source. The device maintains full specification compliance-including ADC performance, UART baud accuracy, and GPIO toggle speed-at this rated frequency across the industrial temperature range (–40°C to +85°C). The LM3S1918-IQC50-A2 does not support overclocking beyond 50 MHz.

Does the LM3S1918-IQC50-A2 support hardware debugging via JTAG?

Yes, the LM3S1918-IQC50-A2 includes a full IEEE 1149.1-compliant JTAG interface with five dedicated pins (TCK, TMS, TDI, TDO, and nTRST). It supports boundary-scan testing, flash programming, and real-time debugging via TI's Code Composer Studio and third-party tools like Segger J-Link. The LM3S1918-IQC50-A2 also supports Serial Wire Debug (SWD) mode using the same physical pins, enabling compact debug probe connections without sacrificing functionality.

What power-saving features does the LM3S1918-IQC50-A2 offer?

The LM3S1918-IQC50-A2 integrates a dedicated hibernation module that achieves sub-10 µA sleep current while retaining RTC operation and 256 bytes of battery-backed RAM. It supports multiple low-power modes including sleep, deep-sleep, and hibernate-with wake-up sources including GPIO edges, RTC alarm, and external interrupts. The LM3S1918-IQC50-A2 uses clock gating per peripheral and voltage scaling to minimize active power, making it suitable for battery-operated field instruments where runtime exceeds one year.

Can the LM3S1918-IQC50-A2's ADC measure temperature directly?

Yes, the LM3S1918-IQC50-A2 includes an internal temperature sensor connected to ADC channel AIN6. When enabled, it provides calibrated readings across –40°C to +85°C with ±3°C typical accuracy, requiring no external components. The LM3S1918-IQC50-A2 firmware can read this channel alongside other analog inputs using the same ADC sequencer and hardware averaging-enabling system-level thermal monitoring without adding BOM cost or board space.

Is the LM3S1918-IQC50-A2 pin-compatible with other Stellaris devices?

No, the LM3S1918-IQC50-A2 is not universally pin-compatible across the Stellaris family. While it shares the 100-pin LQFP package with some variants (e.g., LM3S811-IQN50-A2), pin functions differ significantly-especially for analog inputs, hibernation signals, and peripheral mappings. The LM3S1918-IQC50-A2 reserves specific pins for hibernation control (HIBRST, HIBACK) and RTC crystal (XRTCO), which are absent or repurposed in non-hibernation variants. PCB layout must be verified against the LM3S1918-IQC50-A2-specific pin diagram.

LM3S1918-IQC50-A2 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
100-LQFP
Series:
Stellaris® ARM® Cortex®-M3S 1000
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S1918-IQC50-A2 FAQ

1.How can I place an order for LM3S1918-IQC50-A2 through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S1918-IQC50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S1918-IQC50-A2 reliable?

The price and inventory of LM3S1918-IQC50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1918-IQC50-A2 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1918-IQC50-A2 transactions.

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LM3S1918-IQC50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S1918-IQC50-A2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S1918-IQC50-A2?

For technical support, including LM3S1918-IQC50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1918-IQC50-A2 requirements.

6.How does Aetrix verify that LM3S1918-IQC50-A2 is sourced from the original manufacturer or authorized distributors?

All LM3S1918-IQC50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1918-IQC50-A2 meets industry standards.

7.What is the process for return or replacement of LM3S1918-IQC50-A2?

All LM3S1918-IQC50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1918-IQC50-A2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S1918-IQC50-A2 part is unused and in its original packaging.

Return procedure for LM3S1918-IQC50-A2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LM3S1918-IQC50-A2 Tags

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