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Texas Instruments LM3S1937-IBZ50-A2
- Part No.:
- LM3S1937-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1937-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,023
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Product details
Overview
LM3S1937-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated hibernation module, 12-bit ADC (8-channel), dual UARTs, I²C, SSI, PWM, and analog comparator - deployed in industrial motor control and embedded automation systems requiring low-power operation and real-time responsiveness.
For engineers reviewing the LM3S1937-IBZ50-A2 datasheet, LM3S1937-IBZ50-A2 pinout, LM3S1937-IBZ50-A2 application, or LM3S1937-IBZ50-A2 equivalent, key selection criteria include hibernation support, 50 MHz CPU clock rating, 100-pin LQFP package, integrated RTC, and peripheral set compatibility with StellarisWare firmware.
Technical Context
The LM3S1937-IBZ50-A2 implements the ARM Cortex-M3 core with NVIC, SysTick, MPU, and debug interfaces (JTAG/SWD). It integrates a hibernation module with battery-backed RTC and SRAM, enabling sub-μA sleep current and wake-on-external-event capability.
Peripherals include two UARTs supporting IrDA/SIR, one I²C master/slave interface, two SSI modules, eight PWM outputs, an 8-channel 12-bit ADC with hardware averaging, and a dual analog comparator with internal reference - all clocked from a configurable PLL-driven system clock up to 50 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, supports Thumb-2 instruction set and hardware divide |
| Max Clock Speed | 50 MHz - enables deterministic real-time execution for motor control loops and sensor sampling |
| Flash Memory | 256 KB - sufficient for complex firmware with bootloader, communication stacks, and safety monitoring code |
| SRAM | 64 KB - supports large buffers for UART/SSI data, PID computation, and hibernation context retention |
| Hibernation Current | 1.7 μA typical - allows multi-year battery operation in remote sensors or metering applications |
| ADC Resolution | 12-bit with hardware averaging - delivers effective resolution >13 bits for precision analog sensing |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard PCB assembly and thermal management |
Pinout & Package
LM3S1937-IBZ50-A2 is housed in a 100-pin LQFP package (Pb-free, RoHS-compliant) with exposed thermal pad. Pin functions are multiplexed across GPIO banks A–G and dedicated peripheral pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Separate digital, analog, and core rails enable noise isolation and precise ADC reference stability |
| GND, GNDA, GNDC | Ground returns | Dedicated analog/digital/core ground planes reduce coupling and improve signal integrity |
| PD0–PD7, PE0–PE5, PF0–PF4, PG0–PG7 | GPIO pins | Configurable as digital I/O, UART, SSI, I²C, PWM, or ADC inputs with slew-rate control and pull-up/down |
| PA0–PA7, PB0–PB7 | Peripheral function pins | Support UART0/1, SSI0/1, I²C0, PWM0/1, ADC0/1, and analog comparator inputs |
| HIB, RTCCLK, HIBRTCA, HIBRTCD | Hibernation module signals | Enable battery-backed RTC operation, wake-on-RTC match, and external wake events during deep sleep |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module | Retains RTC, 2 KB battery-backed SRAM, and wake-on-RTC/external-interrupt - eliminates need for external RTC + backup controller |
| Integrated Analog Subsystem | 8-channel 12-bit ADC with programmable sample averaging + dual analog comparators with internal 1.65 V reference - reduces BOM count in sensor interface designs |
| Motor Control Peripherals | 8 PWM outputs with dead-band generation, fault protection inputs, and synchronous update - supports 3-phase BLDC and stepper motor drives |
| Communication Flexibility | Dual UARTs (one with IrDA/SIR), I²C, and dual SSI - enables simultaneous serial sensor networks, display interfaces, and host connectivity |
| Debug & Trace Support | JTAG and SWD interfaces with TPIU trace output - enables real-time code profiling and fault analysis in production firmware |
Applications
| Industrial Motor Control | Smart Energy Metering |
|---|---|
Use Scenario: Closed-loop control of 3-phase brushless DC motors in HVAC blowers and pump drives. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM waveform generation, and ADC-based current/voltage feedback sampling. Use Value: Integrated hibernation and 50 MHz Cortex-M3 deliver fast loop response (<10 μs) while maintaining <2 μA standby current during idle periods. | Use Scenario: Tamper-resistant electricity meter with time-of-use billing, pulse output, and secure communication. IC Role / Device Role / Timing Role: System controller managing metrology ADC interface, RTC-based tariff switching, and isolated RS-485/IrDA communication. Use Value: Battery-backed hibernation module retains accurate time and critical registers during power loss, eliminating external RTC and backup capacitor. |
| Building Automation Sensor Hub | Programmable Logic Controller (PLC) I/O Module |
Use Scenario: Multi-sensor node aggregating temperature, humidity, CO₂, and occupancy data for BMS integration. IC Role / Device Role / Timing Role: Central aggregator with ADC, analog comparators, and multiple UART/SSI interfaces for local sensor bus communication. Use Value: On-chip 12-bit ADC with hardware averaging and internal reference ensures ±0.5% measurement accuracy without external precision references. | Use Scenario: DIN-rail mounted digital I/O expansion module with isolated inputs/outputs and Modbus RTU over RS-485. IC Role / Device Role / Timing Role: Protocol handler and GPIO manager interfacing with optocoupled inputs, relay drivers, and RS-485 transceivers. Use Value: Dual UARTs with IrDA support allow simultaneous fieldbus communication and infrared configuration, reducing external UART bridge ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S1968-IBZ50-A2 | Same core and package, but includes Ethernet MAC and PHY interface; lacks hibernation module | Better suited for networked edge devices; not suitable where ultra-low-power sleep is required | Select LM3S1968 only if Ethernet connectivity is mandatory and hibernation is unnecessary |
| TM4C123GH6PM | Successor part with enhanced peripherals (USB, CAN), higher flash (256 KB), same 100-pin LQFP, but no hibernation module | Designed for broader industrial connectivity; requires firmware migration due to register-level differences | Choose TM4C123GH6PM for new designs needing USB/CAN; retain LM3S1937-IBZ50-A2 for legacy hibernation-critical deployments |
Compared with LM3S1968-IBZ50-A2 and TM4C123GH6PM, the LM3S1937-IBZ50-A2 uniquely provides hibernation-mode RTC and battery-backed SRAM in a mature, production-qualified 50 MHz Cortex-M3 platform - making it irreplaceable in battery-powered, time-aware embedded systems where sub-2 μA sleep current is non-negotiable.
Availability
LM3S1937-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, building automation sensor hubs, and PLC I/O modules requiring stable component supply and long-term lifecycle support.
Supply support for LM3S1937-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of industrial and automotive qualification expertise.
The Stellaris LM3S series was designed specifically for cost-sensitive, real-time embedded applications demanding low power, rich analog integration, and deterministic interrupt latency - targeting industrial automation, motor control, and intelligent sensing.
FAQ
What is the maximum operating frequency of the LM3S1937-IBZ50-A2?
The LM3S1937-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz, achieved via its on-chip PLL that accepts input from an external crystal or internal oscillator. This speed is fully supported across all voltage and temperature ranges specified in the datasheet, enabling deterministic real-time performance for motor control and sensor processing tasks within the LM3S1937-IBZ50-A2.
Does the LM3S1937-IBZ50-A2 support hibernation mode with battery backup?
Yes, the LM3S1937-IBZ50-A2 includes a dedicated hibernation module that supports battery-backed operation of the real-time clock and 2 KB of SRAM. When powered from a coin cell via the HIB pin, the device draws as little as 1.7 μA while retaining timekeeping and critical state - a feature confirmed in Section 6 of the official TI datasheet and central to the LM3S1937-IBZ50-A2's role in energy-constrained applications.
What communication interfaces are integrated into the LM3S1937-IBZ50-A2?
The LM3S1937-IBZ50-A2 integrates dual UARTs (one supporting IrDA and SIR), one I²C master/slave interface, and two SSI modules compatible with SPI, Microwire, and TI synchronous serial protocols. These interfaces are mapped to specific GPIO pins and support full-duplex operation, FIFO buffering, and interrupt-driven transfers - all documented in Sections 12–14 of the LM3S1937-IBZ50-A2 datasheet.
Is the LM3S1937-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
No, the LM3S1937-IBZ50-A2 is not universally pin-compatible across the LM3S family. While it shares the 100-pin LQFP package with several variants (e.g., LM3S1968), pin functions differ significantly - especially for hibernation-specific signals (HIB, RTCCLK) and peripheral mappings. The LM3S1937-IBZ50-A2 pinout must be verified against its specific datasheet table; substitution requires board-level validation.
What development tools and software support are available for the LM3S1937-IBZ50-A2?
Texas Instruments provides full support for the LM3S1937-IBZ50-A2 through StellarisWare Peripheral Driver Library, Code Composer Studio IDE, and IAR Embedded Workbench. Hardware tools include the Stellaris DK-LM3S9B96 development kit and In-Circuit Debug Interface (ICDI) programmers. All drivers, examples, and documentation remain publicly archived by TI and are directly applicable to the LM3S1937-IBZ50-A2.
LM3S1937-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 56
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1937-IBZ50-A2 FAQ
1.How can I place an order for LM3S1937-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1937-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1937-IBZ50-A2 reliable?
The price and inventory of LM3S1937-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1937-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1937-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1937-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1937-IBZ50-A2?
LM3S1937-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1937-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1937-IBZ50-A2?
For technical support, including LM3S1937-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1937-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S1937-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1937-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1937-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1937-IBZ50-A2?
All LM3S1937-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1937-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1937-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S1937-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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