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Texas Instruments LM3S1937-IBZ50-A2T
- Part No.:
- LM3S1937-IBZ50-A2T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1937-IBZ50-A2T.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
LM3S1937-IBZ50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated hibernation module, 8-channel 12-bit ADC, dual UARTs, I²C, SSI, PWM, and GPIOs-designed for low-power industrial control and motor drive applications requiring real-time responsiveness and battery-backed RTC operation.
For engineers reviewing the LM3S1937-IBZ50-A2T datasheet, LM3S1937-IBZ50-A2T pinout, LM3S1937-IBZ50-A2T application, or LM3S1937-IBZ50-A2T equivalent, key selection criteria include hibernation current (2 µA), 50 MHz CPU clock, 12-bit ADC sampling rate (1 MSPS), integrated motor control peripherals, and QFP-100 package compatibility with industrial temperature range (-40°C to +85°C).
Technical Context
The LM3S1937-IBZ50-A2T implements the ARM Cortex-M3 core with Thumb-2 instruction set, NVIC interrupt controller, SysTick timer, and MPU-supporting deterministic real-time execution with sub-10 µs interrupt latency. It integrates a dedicated hibernation module with battery-backed RTC, 2 KB of hibernate memory, and wake-up on external pin or RTC match.
Peripherals include two UARTs with IrDA/SIR support, one I²C master/slave interface, two SSI modules (SPI-compatible), eight PWM generator blocks with fault protection, and an analog comparator with internal reference-enabling closed-loop motor control, sensor interfacing, and serial communication without external glue logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 50 MHz max - enables deterministic real-time task scheduling and efficient C/C++ code execution. |
| Flash Memory | 256 KB - sufficient for complex firmware with bootloader, communication stacks, and control algorithms. |
| SRAM | 64 KB - supports large data buffers, stack depth for nested interrupts, and real-time variable storage. |
| ADC | 12-bit, 8-channel, 1 MSPS - provides high-resolution analog sensing for motor current, voltage, and temperature monitoring. |
| Hibernate Current | 2 µA - enables multi-year battery operation in remote sensors or energy-harvesting systems. |
| Operating Temp | -40°C to +85°C - qualified for industrial environments including factory automation and outdoor equipment. |
| Package | 100-pin LQFP (14 × 14 mm) - standard surface-mount footprint compatible with automated PCB assembly. |
Pinout & Package
LM3S1937-IBZ50-A2T is housed in a 100-pin Low-Profile Quad Flat Package (LQFP) with 0.5 mm pitch, thermal pad exposed on underside for enhanced heat dissipation in continuous industrial operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Dedicated domains for digital core (VDD), analog (VDDA), and hibernate (VDDC) enable noise isolation and ultra-low-power retention. |
| GPIOA–GPIOE | Programmable I/O banks | Five 8-bit ports with alternate function mapping support UART, SSI, I²C, PWM, and ADC input routing. |
| HIB, RTCCLK, HIBRTCA | Hibernation module interface | Enables battery-backed RTC operation, wake-on-RTC-match, and 2 µA deep-sleep mode activation. |
| USB0VBUS, USB0ID | USB OTG detection | Supports host/peripheral role negotiation via VBUS sensing and ID pin-though USB PHY not integrated. |
| NMI, RESET, WAKE | System control signals | Non-maskable interrupt, hardware reset, and hibernate wake-up inputs ensure robust system recovery and power-state transitions. |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module | Integrated RTC with calendar, 2 KB battery-backed RAM, and 2 µA sleep current-eliminates need for external RTC and backup power management ICs. |
| Motor Control Peripherals | Dual PWM generators with dead-band insertion, fault inputs, and synchronous update-supports three-phase BLDC and stepper motor commutation without FPGA or external timers. |
| Analog Integration | 8-channel 12-bit ADC with hardware averaging, internal temperature sensor, and comparator with programmable reference-reduces BOM count for sensor signal conditioning. |
| Serial Interface Flexibility | Two UARTs (one with IrDA), one I²C, two SSI (SPI/SSI/Microwire)-enables simultaneous communication with displays, EEPROMs, sensors, and wireless modules. |
| Debug & Trace | SWD/JTAG interface with TPIU trace port-enables real-time instruction tracing and non-intrusive debugging in production firmware validation. |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop speed and position control of 3-phase brushless DC motors in HVAC blowers and conveyor drives. IC Role / Device Role / Timing Role: Real-time execution of FOC (Field-Oriented Control) algorithm, PWM generation with <100 ns dead-time precision, and ADC sampling synchronized to PWM period. Use Value: On-chip hibernation allows firmware updates during maintenance windows without full power-down; 2 µA sleep current extends uptime between service cycles. | Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and air quality with periodic wireless upload. IC Role / Device Role / Timing Role: System controller managing sensor polling, data logging, RTC-triggered wake-up, and UART-to-LoRaWAN bridge via external transceiver. Use Value: Integrated hibernate module with battery-backed RTC eliminates external timing IC and reduces standby power to 2 µA-enabling 5+ year battery life on CR2032. |
| Factory Automation I/O Module | Energy Metering Front-End |
Use Scenario: DIN-rail mounted remote I/O unit collecting digital inputs, analog process signals, and controlling solenoids/relays across Modbus RTU network. IC Role / Device Role / Timing Role: Protocol stack processor (Modbus RTU over UART), analog signal acquisition (12-bit ADC), and GPIO-driven output drivers with configurable debounce and edge detection. Use Value: Dual UARTs allow simultaneous Modbus master/slave operation; 64 KB SRAM accommodates protocol buffers and configuration tables without external memory. | Use Scenario: Residential smart meter measuring AC voltage/current via shunt or CT sensors, computing kWh, and reporting via PLC or RF mesh. IC Role / Device Role / Timing Role: Precision analog front-end controller performing RMS calculation, zero-crossing detection, and tamper event logging with time-stamp from battery-backed RTC. Use Value: Hardware-averaged 12-bit ADC achieves ±0.5% measurement accuracy at 1 MSPS; hibernate memory retains last valid reading during brown-out events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Tiva C TM4C123GH6PM | Successor part with same pinout, 80 MHz Cortex-M4F core, floating-point unit, and enhanced peripheral set; requires firmware recompilation but no PCB change. | Supports higher computational load (e.g., FFT-based power analysis) and advanced motor control (e.g., observer-based FOC); lacks hibernation-specific registers but offers deeper sleep modes. | Select when upgrading legacy LM3S designs for performance headroom or FPU-dependent algorithms; verify hibernation migration path using TI's Stellaris-to-Tiva migration guide. |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, but no integrated hibernation module or battery-backed RTC; requires external RTC for calendar functions. | Suitable for cost-sensitive industrial controllers where hibernation is not required; offers more USB and CAN interfaces but less analog integration (10-bit ADC, no internal temp sensor). | Select when prioritizing USB-CDC or CAN bus connectivity over ultra-low-power RTC functionality; add external RTC (e.g., DS3231) if calendar timekeeping is needed. |
Compared with LM3S1937-IBZ50-A2T, TM4C123GH6PM delivers higher compute throughput and FPU support while maintaining mechanical compatibility, whereas STM32F103VET6 trades hibernation capability for broader interface options and lower unit cost-making it suitable only where battery-backed RTC is handled externally.
Availability
LM3S1937-IBZ50-A2T is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, factory automation I/O modules, and energy metering front-ends requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.
Supply support for LM3S1937-IBZ50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience delivering high-reliability components for industrial, automotive, and aerospace applications.
The Stellaris LM3S family was designed specifically for deterministic real-time control in resource-constrained industrial systems-emphasizing low-power hibernation, integrated motor peripherals, and robust debug infrastructure for rapid firmware development and field deployment.
FAQ
What is the maximum operating frequency of the LM3S1937-IBZ50-A2T?
The LM3S1937-IBZ50-A2T operates at a maximum CPU clock frequency of 50 MHz, derived from its internal PLL or external crystal oscillator. This frequency is fully supported across the full industrial temperature range (-40°C to +85°C) and enables real-time execution of control loops with sub-10 µs interrupt latency. The LM3S1937-IBZ50-A2T maintains timing compliance under worst-case voltage and temperature conditions per TI's SPMS034I datasheet revision.
Does the LM3S1937-IBZ50-A2T include an integrated USB physical layer?
No, the LM3S1937-IBZ50-A2T does not integrate a USB transceiver or PHY. It provides USB-related signals (USB0VBUS, USB0ID) for OTG role detection and enumeration control, but requires an external USB transceiver (e.g., TUSB3210) to implement full USB device or host functionality. The LM3S1937-IBZ50-A2T relies on UART, I²C, or SSI for primary serial communication.
What is the hibernation current specification for the LM3S1937-IBZ50-A2T?
The LM3S1937-IBZ50-A2T achieves a typical hibernation current of 2 µA when the hibernation module is active, VDDC is powered by a coin cell, and all other power domains are disabled. This value is measured at 25°C with RTC running and 2 KB hibernate RAM retained. The LM3S1937-IBZ50-A2T maintains this ultra-low current across the full industrial temperature range per Section 6.3.6 of the SPMS034I datasheet.
How many ADC channels does the LM3S1937-IBZ50-A2T support, and what is their resolution?
The LM3S1937-IBZ50-A2T integrates a single 12-bit successive-approximation ADC with up to 8 external input channels and one internal temperature sensor channel. It supports hardware sample averaging across 2–64 samples to improve effective resolution and noise immunity. The LM3S1937-IBZ50-A2T ADC achieves 1 MSPS aggregate sampling rate with programmable trigger sources including PWM events and timer matches.
Is the LM3S1937-IBZ50-A2T pin-compatible with other Stellaris LM3S devices?
The LM3S1937-IBZ50-A2T uses a 100-pin LQFP package shared with several LM3S variants (e.g., LM3S1968, LM3S8962), but pin assignments differ significantly across the family due to varying peripheral sets and signal multiplexing. The LM3S1937-IBZ50-A2T has unique GPIO mappings for hibernation control (HIB, RTCCLK), motor PWM outputs, and analog inputs-requiring board-level verification before substitution.
LM3S1937-IBZ50-A2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 56
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1937-IBZ50-A2T FAQ
1.How can I place an order for LM3S1937-IBZ50-A2T through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1937-IBZ50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1937-IBZ50-A2T reliable?
The price and inventory of LM3S1937-IBZ50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1937-IBZ50-A2T is usually 5 days.
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LM3S1937-IBZ50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1937-IBZ50-A2T?
For technical support, including LM3S1937-IBZ50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1937-IBZ50-A2T requirements.
6.How does Aetrix verify that LM3S1937-IBZ50-A2T is sourced from the original manufacturer or authorized distributors?
All LM3S1937-IBZ50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1937-IBZ50-A2T meets industry standards.
7.What is the process for return or replacement of LM3S1937-IBZ50-A2T?
All LM3S1937-IBZ50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1937-IBZ50-A2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1937-IBZ50-A2T part is unused and in its original packaging.
Return procedure for LM3S1937-IBZ50-A2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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