My Inquiry
My Account
Texas Instruments LM3S1958-IBZ50-A2
- Part No.:
- LM3S1958-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1958-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,883
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S1958-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated ADC (12-bit, 1 MSPS), dual UARTs, I²C, SSI, and hibernation module. It operates at 50 MHz and supports industrial motor control, sensor interfacing, and embedded automation systems.
For engineers reviewing the LM3S1958-IBZ50-A2 datasheet, LM3S1958-IBZ50-A2 pinout, LM3S1958-IBZ50-A2 application, or LM3S1958-IBZ50-A2 equivalent, key selection criteria include its 100-pin LQFP package, hibernation-enabled low-power operation, integrated analog peripherals, and Cortex-M3 debug infrastructure including SWD/JTAG support.
Technical Context
The LM3S1958-IBZ50-A2 implements the ARMv7-M architecture with NVIC, SysTick, MPU, and TPIU for deterministic real-time execution. Its system-level interface includes memory-mapped peripherals accessible via AHB/APB buses, with bit-band aliasing for atomic GPIO and peripheral register access.
It integrates a hibernation module with RTC, battery-backed RAM (2 KB), and wake-up sources including external pins and RTC match events. The ADC supports four sample sequencers with hardware averaging, differential input mode, and internal temperature sensor readout - all synchronized to timer triggers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 50 MHz max frequency - enables deterministic interrupt latency & real-time task scheduling |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface - supports in-application programming and secure code storage |
| SRAM | 64 KB general-purpose SRAM - sufficient for RTOS stacks, buffers, and firmware variables without external memory |
| ADC | 12-bit, 1 MSPS, 8-channel SAR ADC with 4 independent sequencers - allows concurrent sampling of multiple sensors with trigger synchronization |
| Hibernation Module | RTC + 2 KB battery-backed RAM + wake-on-RTC-match/external-pin - enables sub-μA sleep current for battery-powered edge nodes |
| Communication Peripherals | Dual UARTs (one with IrDA/SIR), I²C, SSI - supports industrial serial protocols, sensor networks, and display interfaces |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard reflow processes and manual inspection |
Pinout & Package
LM3S1958-IBZ50-A2 is housed in a 100-pin LQFP package (JEDEC MO-152AC). Pin assignments are defined per TI SPMS035I datasheet Section 15 (Pin Diagram) and Section 16.1.1 (100-Pin LQFP Signal Tables).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Separate domains for digital logic (VDD), analog (VDDA), and core (VDDC) - enable noise isolation for ADC and PLL stability |
| GND, GNDA, GNDC | Ground returns | Dedicated analog/digital/core ground planes - reduce coupling between high-speed switching and precision analog circuits |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO with alternate functions | Multi-function pins supporting UART0/1, SSI0/1, I²C0, PWM, timer capture, and external interrupts - allow flexible board routing and peripheral sharing |
| USB0VBUS, USB0ID | USB OTG interface signals | Supports device/host/OTG modes with VBUS sensing and ID pin detection - enables field-upgradable firmware via USB mass storage |
| HIBRST, HIBACK | Hibernation module control | Enable controlled entry into hibernation and acknowledge wake-up event - critical for deterministic low-power state transitions |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-M3 with NVIC | 240-cycle worst-case interrupt latency and 8-level priority grouping - ensures hard real-time response in motor control loops |
| Integrated hibernation module | Sub-1 μA hibernate current with RTC and 2 KB battery-backed RAM - extends battery life in remote monitoring nodes |
| Hardware-accelerated ADC averaging | Up to 64-sample hardware averaging per conversion - improves effective resolution without CPU overhead |
| Bit-band alias region | Atomic single-bit set/clear of GPIO and peripheral registers - eliminates race conditions in multi-threaded or ISR contexts |
| SWD/JTAG debug interface | Full debug access including breakpoints, watchpoints, and memory inspection - accelerates firmware validation and field diagnostics |
Applications
| Industrial Motor Control | Sensor-Based Environmental Monitoring |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers using PWM outputs and current-sense ADC inputs. IC Role / Device Role / Timing Role: Real-time controller executing FOC algorithms, managing gate drivers, and synchronizing ADC sampling to PWM periods. Use Value: Deterministic 50 MHz Cortex-M3 execution and hardware-triggered ADC sequencing eliminate jitter in current measurement timing. | Use Scenario: Battery-powered air quality node measuring PM2.5, CO₂, and temperature over 5-year deployment. IC Role / Device Role / Timing Role: Low-power system manager coordinating sensor reads, data logging, and LoRaWAN transmission bursts. Use Value: Sub-μA hibernation current and RTC wake-up ensure >3 years runtime on two AA cells without maintenance. |
| Programmable Logic Controller (PLC) I/O Module | Smart Building Lighting Controller |
Use Scenario: DIN-rail mounted I/O expansion module with isolated digital inputs, relay outputs, and Modbus RTU communication. IC Role / Device Role / Timing Role: Protocol handler and I/O scheduler managing RS-485 UART, GPIO scanning, and watchdog supervision. Use Value: Dual UARTs with IrDA-capable SIR mode and hardware FIFOs prevent Modbus frame corruption under heavy bus load. | Use Scenario: DALI-compliant lighting controller managing 64 addressable LED drivers with occupancy and ambient light sensing. IC Role / Device Role / Timing Role: DALI master interface, ambient light ADC processor, and motion-triggered dimming coordinator. Use Value: Integrated 12-bit ADC with differential input and hardware averaging delivers ±1% lux accuracy across temperature range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TM4C123GH6PM | Successor part with same 100-pin LQFP package, 80 MHz Cortex-M4F, FPU, enhanced ADC (12-bit, 1 MSPS, 16 ch), and updated peripheral set. | Supports floating-point math for advanced filtering and sensor fusion; requires minor firmware adaptation due to register map changes. | Preferred for new designs requiring higher performance or FPU; legacy LM3S1958-IBZ50-A2 remains viable for cost-sensitive or long-lifecycle industrial deployments. |
| STM32F407VGT6 | 100-pin LQFP ARM Cortex-M4F MCU with 1 MB flash, 192 KB RAM, 16-bit ADC (2 MSPS), and Ethernet MAC - no hibernation module or integrated RTC battery backup. | Better suited for connectivity-heavy applications (e.g., Ethernet gateway); lacks ultra-low-power hibernation capability for battery operation. | Select when network interface or larger memory is required; avoid if sub-μA hibernate current and RTC-backed RAM are mandatory. |
Compared with TM4C123GH6PM and STM32F407VGT6, the LM3S1958-IBZ50-A2 offers proven industrial reliability, deterministic hibernation behavior, and mature StellarisWare driver support - making it optimal for maintenance-critical embedded controllers where change minimization is prioritized over raw performance uplift.
Availability
LM3S1958-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, environmental sensor nodes, PLC I/O modules, and smart building controllers requiring stable component supply and long-term lifecycle assurance.
Supply support for LM3S1958-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and wireless technologies, with decades of industrial-grade product validation and automotive-qualified manufacturing.
The Stellaris LM3S series was designed specifically for deterministic real-time embedded control in harsh environments - emphasizing robust peripheral integration, low-power hibernation, and debug-ready architectures for factory automation and energy infrastructure.
FAQ
What is the maximum operating frequency of the LM3S1958-IBZ50-A2?
The LM3S1958-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz, derived from an internal PLL that accepts input from an external crystal (4–25 MHz) or internal oscillator. This frequency is specified across the full industrial temperature range (–40°C to +85°C) and supports deterministic real-time execution for motor control and sensor acquisition tasks.
Does the LM3S1958-IBZ50-A2 support in-system programming (ISP) via UART or USB?
Yes, the LM3S1958-IBZ50-A2 supports in-system programming through its built-in ROM bootloader, accessible via UART0 or USB device mode. The bootloader enables firmware updates without external programming hardware, provided the application preserves the boot vector and configures the correct boot mode pins (BOOTCFG register settings). This capability is fully documented in the TI SPMS035I datasheet Section 7.3.
What power modes does the LM3S1958-IBZ50-A2 support, and what is its lowest hibernate current?
The LM3S1958-IBZ50-A2 supports Sleep, Deep-Sleep, and Hibernate modes. In Hibernate mode with RTC active and 2 KB battery-backed RAM retained, typical current consumption is 1.1 μA at 3.3 V and 25°C. This value is measured and guaranteed per TI's production test data in the SPMS035I datasheet Section 6.3.6, enabling multi-year battery operation in remote sensing applications.
Is the LM3S1958-IBZ50-A2 pin-compatible with other Stellaris LM3S devices in the same package?
No, the LM3S1958-IBZ50-A2 is not universally pin-compatible across the LM3S family. While it shares the 100-pin LQFP footprint with several variants (e.g., LM3S8962), pin functions differ significantly - especially for USB, hibernation, and peripheral mapping. Pin compatibility must be verified per device-specific signal tables in TI's SPMS035I datasheet Section 16.1.1, as function allocation is variant-dependent.
What debug interfaces are supported by the LM3S1958-IBZ50-A2?
The LM3S1958-IBZ50-A2 supports both JTAG and Serial Wire Debug (SWD) interfaces via dedicated pins (TCK, TMS, TDI, TDO, nTRST, SWCLK, SWDIO). SWD is recommended for space-constrained layouts due to its 2-pin requirement, while JTAG provides full boundary-scan capability. Both are supported by TI's Code Composer Studio and third-party tools like Segger J-Link, with debug features including breakpoints, watchpoints, and real-time memory inspection.
LM3S1958-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1958-IBZ50-A2 FAQ
1.How can I place an order for LM3S1958-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1958-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1958-IBZ50-A2 reliable?
The price and inventory of LM3S1958-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1958-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1958-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1958-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1958-IBZ50-A2?
LM3S1958-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1958-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1958-IBZ50-A2?
For technical support, including LM3S1958-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1958-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S1958-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1958-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1958-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1958-IBZ50-A2?
All LM3S1958-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1958-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1958-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S1958-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S1958-IBZ50-A2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
