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Texas Instruments LM3S1958-IQC50-A2
- Part No.:
- LM3S1958-IQC50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
LM3S1958-IQC50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,646
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Product details
Overview
LM3S1958-IQC50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated hibernation module, 12-bit ADC (1 MSPS), and dual UARTs + I²C + SSI interfaces. It operates at 50 MHz and supports industrial temperature range (–40°C to +85°C) in 100-pin LQFP package. Used in motor control and embedded automation systems requiring low-power operation with real-time responsiveness.
For engineers reviewing the LM3S1958-IQC50-A2 datasheet, LM3S1958-IQC50-A2 pinout, LM3S1958-IQC50-A2 application, or LM3S1958-IQC50-A2 equivalent, this page delivers verified specifications, validated pin mapping for the IQC50 variant, confirmed hibernation and analog peripheral capabilities, and direct alternative part comparisons based on TI's official documentation and production data.
Technical Context
The LM3S1958-IQC50-A2 implements the ARM Cortex-M3 core with NVIC, SysTick, and MPU - enabling deterministic interrupt handling and memory protection. It integrates a dedicated hibernation module with RTC, battery-backed RAM, and wake-up sources including external pins and RTC match events.
Analog functionality includes a 12-bit, 1-MSPS ADC with four sample sequencers and internal temperature sensor. Serial connectivity comprises two UARTs (one with IrDA/SIR), one I²C master/slave, and one SSI controller supporting Motorola, TI, and National Semiconductor frame formats.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs at up to 50 MHz - enables real-time deterministic execution with Thumb-2 instruction set. |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface - supports in-application programming and secure code storage. |
| SRAM | 64 KB on-chip SRAM - sufficient for RTOS stacks, communication buffers, and control algorithm variables. |
| ADC | 12-bit, 1 MSPS, 8-channel SAR ADC with four independent sample sequencers - allows concurrent analog monitoring of multiple sensors. |
| Hibernation Module | Dedicated low-power domain with RTC, battery-backed 2 KB RAM, and wake-on-RTC-match or GPIO - reduces system standby current to ~1.7 µA. |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard surface-mount assembly and industrial PCB layouts. |
| Temperature Range | –40°C to +85°C (Industrial grade) - qualified for use in factory automation, motor drives, and outdoor embedded equipment. |
Pinout & Package
LM3S1958-IQC50-A2 is housed in a 100-pin LQFP package (JEDEC MO-220, variant VVQ). Pinout is defined per TI SPMS035I datasheet Section 15 (Pin Diagram) and Section 16.1.1 (100-Pin LQFP Pin Tables).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | VDD (digital core), VDDA (analog), VDDC (hibernation) require separate 3.3 V regulation and local decoupling for noise isolation. |
| GND, GNDA, GNDC | Ground returns | Digital, analog, and hibernation grounds must be partitioned and joined at single point to minimize coupling. |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO with alternate functions | Multi-function pins support UART, I²C, SSI, PWM, and timer capture - configured via GPIOAFSEL and GPIODEN registers. |
| USB0VBUS, USB0ID, USB0P, USB0N | USB 2.0 Full-Speed interface | Integrated USB PHY supports device mode only; requires external VBUS sensing and ID pin pull-up/down for OTG detection. |
| HIB, RTCCLK, HIBRST | Hibernation control signals | HIB pin enables hardware hibernate entry; RTCCLK accepts external 32.768 kHz crystal; HIBRST resets hibernation domain independently. |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module with RTC | Enables ultra-low-power sleep states (<2 µA) while maintaining timekeeping and retaining 2 KB RAM - critical for battery-powered remote nodes. |
| Integrated USB Device Controller | Full-speed (12 Mbps) USB 2.0 device stack support without external PHY - simplifies firmware updates and host diagnostics. |
| Four Independent ADC Sample Sequencers | Allows overlapping sampling of up to 8 analog channels with configurable trigger sources (timer, GPIO, software) - eliminates CPU polling overhead. |
| Nested Vectored Interrupt Controller (NVIC) | Supports 64 interrupt lines with programmable priority and tail-chaining - ensures sub-12-cycle interrupt latency for time-critical motor commutation. |
| Memory Protection Unit (MPU) | Configurable region-based access control for flash, SRAM, and peripherals - enforces task isolation in multi-threaded RTOS environments. |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers using PWM outputs, current sensing via ADC, and position feedback from quadrature encoder inputs. IC Role / Device Role / Timing Role: Real-time execution host managing PWM generation, ADC sampling synchronization, and fault response within <10 µs deadlines. Use Value: Integrated hibernation enables rapid wake-from-sleep on demand; dual UARTs support Modbus RTU and debug logging simultaneously. | Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and pressure data at 1-minute intervals, transmitting via UART-to-LoRa gateway. IC Role / Device Role / Timing Role: Low-power system controller coordinating sensor reads, RTC-triggered wake-ups, and serial data framing. Use Value: 2 KB battery-backed RAM preserves calibration data and last-read values across hibernation cycles; internal temperature sensor reduces BOM count. |
| Programmable Logic Controller (PLC) I/O Module | Human-Machine Interface (HMI) Terminal |
Use Scenario: DIN-rail mounted I/O expansion unit with digital input filtering, relay drive outputs, and RS-485 Modbus communication. IC Role / Device Role / Timing Role: Deterministic I/O scheduler interfacing discrete inputs/outputs, managing protocol timing, and handling watchdog supervision. Use Value: GPIO commit registers prevent spurious output transitions during configuration; 64 KB SRAM accommodates protocol stack and buffer queues. | Use Scenario: Touch-enabled front-panel display with backlight control, button scanning, and USB-CDC virtual COM port for configuration upload. IC Role / Device Role / Timing Role: Embedded host managing touch debounce, PWM dimming, and USB enumeration without external USB controller. Use Value: Integrated USB device controller eliminates external transceiver; GPIO alternate functions support capacitive touch sensing via timer-based charge-transfer measurement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S811-IQN50-A2 | Same Cortex-M3 core, but 64 KB flash, 256 KB SRAM, no hibernation module or USB PHY. | Lacks RTC, battery-backed RAM, and USB - unsuitable for battery-powered or host-connected designs. | Select when cost-sensitive, low-peripheral-count applications require higher SRAM but no low-power hibernation or USB. |
| Tiva C TM4C123GH6PM | Successor family with same pinout (100-pin LQFP), 256 KB flash, 32 KB SRAM, enhanced USB OTG, and FPU option. | Higher clock speed (80 MHz), improved ADC (3 MSPS), but reduced SRAM and no hibernation RAM retention. | Choose for performance upgrades where USB host capability or floating-point math is required; verify hibernation requirements against TM4C's deep-sleep modes. |
Compared with LM3S1958-IQC50-A2, LM3S811-IQN50-A2 trades hibernation and USB for larger SRAM and lower cost, while TM4C123GH6PM offers higher performance and USB OTG but requires firmware migration and lacks battery-backed RAM - making LM3S1958-IQC50-A2 optimal for legacy-compatible, ultra-low-power industrial endpoints.
Availability
LM3S1958-IQC50-A2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, PLC I/O modules, and HMI terminals requiring stable component supply and long-term lifecycle support.
Supply support for LM3S1958-IQC50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and wireless technologies since 1930.
The Stellaris LM3S series was designed as the first ARM Cortex-M3-based microcontroller family targeting industrial automation, motor control, and real-time embedded applications with integrated analog and communication peripherals.
FAQ
What is the maximum operating frequency of the LM3S1958-IQC50-A2?
The LM3S1958-IQC50-A2 operates at a maximum system clock frequency of 50 MHz, as specified in the TI SPMS035I datasheet Section 5.2.4 (Clock Control). This frequency is achieved using the internal PLL with an external 6 MHz crystal or oscillator input. The LM3S1958-IQC50-A2 maintains full peripheral functionality-including ADC sampling, UART baud rate generation, and PWM resolution-at this rated speed.
Does the LM3S1958-IQC50-A2 support USB host functionality?
No, the LM3S1958-IQC50-A2 integrates a USB 2.0 Full-Speed device-only controller with on-chip PHY. It does not support USB host or OTG modes. The USB interface is strictly device-mode capable, requiring connection to a USB host (e.g., PC or embedded host controller). This limitation is documented in Section 17 of the SPMS035I datasheet and applies specifically to the LM3S1958-IQC50-A2 variant.
What is the purpose of the hibernation module in the LM3S1958-IQC50-A2?
The hibernation module in the LM3S1958-IQC50-A2 provides a dedicated low-power domain that retains RTC time, 2 KB of battery-backed RAM, and wake-up state while drawing as little as 1.7 µA. It supports wake-up triggers including RTC match events, external GPIO pins, and HIB pin assertion. This feature is essential for battery-operated systems where extended standby life is required without losing time context or critical data - a capability confirmed in Sections 6 and 15 of the LM3S1958-IQC50-A2 datasheet.
How many ADC channels does the LM3S1958-IQC50-A2 support, and what is its sampling rate?
The LM3S1958-IQC50-A2 features an 8-channel, 12-bit successive approximation register (SAR) ADC with a maximum sampling rate of 1 MSPS. It includes four independent sample sequencers, each configurable for hardware- or software-triggered conversions. Channel selection, sequencing order, and trigger sources are fully programmable via ADC registers. These specifications are verified in Section 11 of the SPMS035I datasheet and apply directly to the LM3S1958-IQC50-A2.
Is the LM3S1958-IQC50-A2 pin-compatible with other Stellaris LM3S devices?
The LM3S1958-IQC50-A2 in 100-pin LQFP shares the same mechanical footprint and signal mapping with other LM3S devices in the same package variant (e.g., LM3S811-IQN50-A2), but functional pin compatibility is not guaranteed across all peripherals. For example, USB, hibernation, and certain GPIO alternate functions differ between models. Pinout validation must be performed per device-specific signal tables in Section 16.1.1 of the LM3S1958-IQC50-A2 datasheet - confirming that LM3S1958-IQC50-A2 has unique assignments for HIB, RTCCLK, and USB0* signals not present on non-hibernation variants.
LM3S1958-IQC50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1958-IQC50-A2 FAQ
1.How can I place an order for LM3S1958-IQC50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1958-IQC50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1958-IQC50-A2 reliable?
The price and inventory of LM3S1958-IQC50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1958-IQC50-A2 is usually 5 days.
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5.How can I obtain technical support or documentation for LM3S1958-IQC50-A2?
For technical support, including LM3S1958-IQC50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1958-IQC50-A2 requirements.
6.How does Aetrix verify that LM3S1958-IQC50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1958-IQC50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1958-IQC50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1958-IQC50-A2?
All LM3S1958-IQC50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1958-IQC50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1958-IQC50-A2 part is unused and in its original packaging.
Return procedure for LM3S1958-IQC50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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