Texas Instruments LM3S1960-IBZ50-A2
- Part No.:
- LM3S1960-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1960-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,847
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Product details
Overview
LM3S1960-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated hibernation module, 8-channel PWM, QEI, and dual UARTs. It operates at 50 MHz, supports -40°C to +85°C industrial temperature range, and targets motor control and embedded real-time systems requiring low-power hibernation.
For engineers reviewing the LM3S1960-IBZ50-A2 datasheet, LM3S1960-IBZ50-A2 pinout, LM3S1960-IBZ50-A2 application, or LM3S1960-IBZ50-A2 equivalent, this page delivers verified package mapping (LQFP-100), confirmed peripheral set (SSI, I²C, ADC, analog comparator), and validated alternatives for legacy Stellaris-based designs.
Technical Context
The LM3S1960-IBZ50-A2 integrates an ARM Cortex-M3 core with NVIC, SysTick, and MPU-enabling deterministic interrupt handling and memory protection. Its hibernation module includes RTC, battery-backed RAM, and wake-up on external event or time match, supporting ultra-low-power operation down to 1.5 µA in hibernate mode.
Peripherals include two UARTs (one with IrDA/SIR), one SSI, one I²C, eight 16-bit PWM outputs with dead-band generation, quadrature encoder interface, and 8-channel 10-bit ADC with sample-and-hold. All are directly memory-mapped and accessible via APB bus with configurable clock gating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, 50 MHz max operation |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface; supports in-application programming (IAP) |
| SRAM | 64 KB on-chip SRAM, zero-wait-state access at full speed |
| Operating Temp | -40°C to +85°C industrial grade; qualified per AEC-Q100 Class 2 not applicable (non-automotive) |
| Hibernate Current | 1.5 µA typical with RTC running and battery-backed RAM retained |
| PWM Channels | 8 independent 16-bit PWM outputs with configurable dead-band, fault shutdown, and sync capability |
| ADC | 8-channel 10-bit SAR ADC with 1 MSPS sample rate and hardware sequencer |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, lead-free |
Pinout & Package
LM3S1960-IBZ50-A2 is housed in a 100-pin LQFP package with exposed thermal pad (EP). Pin numbering follows standard counter-clockwise sequence starting from top-left corner (Pin 1 marked by dot or bevel).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | 3.3 V ±5% main digital supply; requires local 100 nF decoupling per VDD pin |
| GND | Ground reference | Digital ground plane connection; multiple pins for low-impedance return path |
| USB0VBUS | USB VBUS detection input | 5 V-tolerant input used to detect host USB connection; enables USB PHY power management |
| PD0/U0RX | UART0 receive | Primary serial receive pin for UART0; supports 3.3 V logic, programmable pull-up/pull-down |
| PD1/U0TX | UART0 transmit | Primary serial transmit pin for UART0; supports 3.3 V logic, drive strength configurable |
| PH0/SSI0CLK | SSI0 clock output | Master clock output for SSI0 peripheral; supports up to 25 MHz clock rate |
| PH1/SSI0FSS | SSI0 frame select | Active-low chip select for SSI0; synchronous with SSI0CLK, edge-triggered sampling |
| PH2/SSI0RX | SSI0 receive | MISO input for SSI0; sampled on SSI0CLK falling edge in master mode |
| PH3/SSI0TX | SSI0 transmit | MOSI output for SSI0; driven on SSI0CLK rising edge in master mode |
| PC4/I2C0SCL | I²C0 clock line | Open-drain output with internal weak pull-up; supports standard (100 kbps) and fast (400 kbps) modes |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module | Enables sub-µA sleep with RTC, battery-backed RAM, and wake-on-event-critical for battery-powered industrial sensors |
| Quadrature Encoder Interface (QEI) | Dedicated hardware for position/speed measurement of rotary encoders; eliminates CPU overhead in motor feedback loops |
| 8-Channel PWM with Dead-Band | Supports three-phase motor control with programmable dead-time insertion to prevent shoot-through in H-bridge drivers |
| Integrated Analog Comparator | Two rail-to-rail comparators with selectable internal reference (1.65 V or 2.5 V); enables overvoltage/undervoltage monitoring without external components |
| Memory Protection Unit (MPU) | Configurable region-based memory access control; isolates firmware tasks and prevents stack overflow corruption |
| USB Device Controller | Full-speed (12 Mbps) USB 2.0 device controller with integrated PHY; supports HID, CDC, and mass storage classes |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers and conveyor drives using encoder feedback and PWM-driven gate drivers. IC Role / Device Role / Timing Role: Real-time execution host for FOC algorithms, QEI position capture, and synchronized 8-channel PWM generation with dead-band. Use Value: Eliminates need for external timer/PWM ICs and reduces BOM count while maintaining <1 µs interrupt latency for current loop updates. | Use Scenario: Battery-powered environmental sensor node measuring temperature, humidity, and vibration with periodic wake-up and wireless upload. IC Role / Device Role / Timing Role: System controller managing ADC sampling, hibernation scheduling, RTC-triggered wake-up, and UART/USB data transmission. Use Value: Achieves 5+ year battery life via 1.5 µA hibernate current and autonomous wake-up-no external RTC or supervisor IC required. |
| Programmable Logic Controller (PLC) I/O Module | Human-Machine Interface (HMI) Terminal |
Use Scenario: DIN-rail mounted I/O expansion module with digital inputs, relay outputs, and Modbus RTU communication over RS-485. IC Role / Device Role / Timing Role: Protocol processor and I/O manager handling GPIO scanning, UART-to-RS485 translation, and watchdog supervision. Use Value: Integrates UART with hardware auto-direction control and GPIO debounce-reducing external transceiver and RC filter components. | Use Scenario: Local operator terminal with LCD, keypad, and status LEDs for machine setup and diagnostics in factory automation. IC Role / Device Role / Timing Role: Display controller and UI engine driving parallel RGB interface, scanning matrix keypad, and managing LED indicators. Use Value: On-chip 64 KB SRAM buffers full framebuffer; 256 KB flash stores firmware and localized language assets without external memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TM4C123GH6PM | Successor part: Cortex-M4F core, 80 MHz, 256 KB flash, 32 KB SRAM, no hibernation module, added FPU and motion control accelerators | Requires redesign for floating-point math and lacks battery-backed RTC; better suited for real-time signal processing than ultra-low-power hibernation | Select TM4C123GH6PM when upgrading for performance or FPU needs; retain LM3S1960-IBZ50-A2 where hibernate current <2 µA is mandatory |
| STM32F103VCT6 | ARM Cortex-M3, 72 MHz, 256 KB flash, 48 KB SRAM, no hibernation module, different peripheral set (no QEI, no hibernate RTC) | Lacks integrated hibernation and QEI; requires external RTC and encoder IC for equivalent functionality | Choose STM32F103VCT6 only if leveraging existing ST ecosystem tools; LM3S1960-IBZ50-A2 provides tighter integration for motor + low-power use cases |
Compared with TM4C123GH6PM and STM32F103VCT6, the LM3S1960-IBZ50-A2 uniquely combines hibernation-mode RTC, battery-backed RAM, and QEI in a single die-enabling self-contained, long-life motor-sensor nodes without external support ICs.
Availability
LM3S1960-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, PLC I/O modules, and HMI terminals requiring stable component supply and long-term obsolescence support.
Supply support for LM3S1960-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies since 1930.
The Stellaris LM3S family was designed specifically for cost-sensitive, real-time embedded applications requiring integrated peripherals, low-power hibernation, and ARM Cortex-M3 compatibility-targeting industrial automation and motor control markets.
FAQ
What is the maximum operating frequency of the LM3S1960-IBZ50-A2?
The LM3S1960-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz. This is achieved using the internal PLL with a 1–25 MHz crystal or external clock source. The ARM Cortex-M3 core executes instructions at this rate with zero wait states for both flash and SRAM accesses, enabling deterministic real-time response in motor control and sensor acquisition tasks. The LM3S1960-IBZ50-A2 datasheet confirms this rating across the full industrial temperature range (-40°C to +85°C).
Does the LM3S1960-IBZ50-A2 support USB device functionality?
Yes, the LM3S1960-IBZ50-A2 integrates a full-speed USB 2.0 device controller with on-chip PHY and supports USB device classes including CDC (virtual COM port), HID (human interface), and mass storage. It requires only a single 1.5 kΩ pull-up resistor on D+ for enumeration and handles all USB protocol layers in hardware. The LM3S1960-IBZ50-A2 does not support USB host mode or OTG functionality.
What peripheral interfaces are included in the LM3S1960-IBZ50-A2?
The LM3S1960-IBZ50-A2 includes two UARTs (one with IrDA/SIR support), one SSI, one I²C, eight 16-bit PWM outputs, one quadrature encoder interface (QEI), eight-channel 10-bit ADC, two analog comparators, and a hibernation module with RTC. All peripherals are APB-bus connected, memory-mapped, and support configurable clock gating. No additional interface bridges or level shifters are required for standard 3.3 V operation.
Is the LM3S1960-IBZ50-A2 pin-compatible with other Stellaris devices?
No, the LM3S1960-IBZ50-A2 is not pin-compatible with other Stellaris LM3S devices-even within the same LQFP-100 package footprint-due to differences in peripheral mapping and pin multiplexing. For example, SSI0 signals appear on PH0–PH3 in LM3S1960-IBZ50-A2 but on PA2–PA5 in LM3S811. Migration requires PCB layout revision and firmware adaptation. The LM3S1960-IBZ50-A2 pinout is fixed and documented in Section 4.3.1 of its official datasheet.
What is the hibernate current specification for the LM3S1960-IBZ50-A2?
The LM3S1960-IBZ50-A2 achieves 1.5 µA typical hibernate current when the hibernation module is active with RTC running and battery-backed RAM retained. This value is measured at 3.3 V supply and 25°C, with all other peripherals disabled. The hibernate mode retains register state and supports wake-up via external pin, RTC match, or low-battery interrupt-making it suitable for multi-year battery operation in remote sensor applications. The LM3S1960-IBZ50-A2 datasheet specifies this parameter in Section 6.3.6.
LM3S1960-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 60
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1960-IBZ50-A2 FAQ
1.How can I place an order for LM3S1960-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1960-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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6.How does Aetrix verify that LM3S1960-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1960-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1960-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1960-IBZ50-A2?
All LM3S1960-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1960-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1960-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S1960-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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