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Texas Instruments LM3S1968-EQC50-A2
- Part No.:
- LM3S1968-EQC50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
LM3S1968-EQC50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,647
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Product details
Overview
LM3S1968-EQC50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated ADC (12-bit, 1 MSPS), dual UARTs, I²C, SSI, PWM, and hibernation module; used in industrial motor control and embedded automation systems requiring real-time responsiveness and low-power operation.
For engineers reviewing the LM3S1968-EQC50-A2 datasheet, LM3S1968-EQC50-A2 pinout, LM3S1968-EQC50-A2 application, or LM3S1968-EQC50-A2 equivalent, key selection considerations include its 50 MHz CPU clock, hibernation current of 1.7 µA, 12-channel ADC with hardware averaging, and QFP-100 package compatibility with legacy Stellaris designs.
Technical Context
The LM3S1968-EQC50-A2 implements the ARM Cortex-M3 core with NVIC, SysTick, and MPU, supporting Thumb-2 instruction set and deterministic interrupt latency down to 12 cycles. It integrates a dedicated hibernation module with RTC, battery-backed memory, and wake-up on external event or timer match.
Peripherals include two UARTs with IrDA/SIR support, one I²C master/slave interface, two SSI modules for SPI/SSI/Microwire, eight PWM outputs with fault protection, and an analog subsystem with four comparators and temperature sensor - all synchronized to a single system clock tree managed by the RCC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 50 MHz max frequency - enables deterministic real-time execution with <12-cycle interrupt latency. |
| Flash Memory | 256 KB on-chip flash - supports in-application programming and secure code storage without external memory. |
| SRAM | 64 KB on-chip SRAM - sufficient for real-time control stacks, buffers, and firmware variables without external RAM. |
| ADC | 12-bit, 1 MSPS, 8-channel (with 12-sample hardware averaging) - suitable for precision motor current sensing and analog feedback loops. |
| Hibernate Current | 1.7 µA typical - enables multi-year battery life in remote sensors or maintenance-free industrial nodes. |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard PCB assembly and thermal management for industrial ambient temperatures. |
| Operating Temp | –40°C to +105°C - qualified for extended industrial environments including motor drives and factory controllers. |
Pinout & Package
LM3S1968-EQC50-A2 is housed in a 100-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, JEDEC MS-026AC compliant, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital (3.3 V), analog (3.3 V), and core (1.2 V via internal regulator) supplies - require separate decoupling for noise-sensitive analog operation. |
| GND, GNDA, GNDC | Ground returns | Analog, digital, and core ground planes must be partitioned and joined at single point to minimize coupling into ADC and comparators. |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO banks | Configurable as digital I/O, peripheral function pins (UART0/1, SSI0/1, I²C0, PWM0/1), or analog inputs - each bank has independent clock gating and slew-rate control. |
| USB0VBUS, USB0ID, USB0P, USB0N | USB 2.0 Full-Speed interface | Integrated USB PHY supports device mode only; VBUS detection and ID pin enable OTG-like host negotiation in firmware-controlled applications. |
| HIB, RTCCLK, HIBRTCA, HIBRTCB | Hibernation module interface | Enables ultra-low-power sleep with RTC wake-up, battery-backed RAM retention, and external interrupt wake sources - critical for energy-harvesting edge nodes. |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module | Reduces system power to 1.7 µA while retaining RTC, 2 KB SRAM, and wake capability - eliminates need for external RTC + backup controller in portable industrial tools. |
| Hardware ADC Averaging | Up to 12-sample hardware averaging per conversion - improves effective resolution to ~13.5 bits without CPU overhead, ideal for noisy motor drive current sensing. |
| Peripheral Integration | Includes dual UARTs (one with IrDA), I²C, two SSI, eight PWM outputs, four analog comparators, and internal temperature sensor - reduces BOM count and board area in motion control designs. |
| Memory Protection Unit (MPU) | Configurable region-based memory access control - enforces privilege separation between application tasks and firmware services, supporting SIL-2 functional safety requirements. |
| Debug Interface | SWD/JTAG with TPIU trace support - enables real-time instruction tracing and non-intrusive debugging of time-critical ISR behavior in closed-loop control systems. |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with current sensing, position feedback, and thermal monitoring in factory automation equipment. IC Role / Device Role / Timing Role: Real-time control unit executing FOC algorithm, managing PWM timing, sampling ADC channels, and communicating status over UART. Use Value: Deterministic 50 MHz Cortex-M3 execution, hardware ADC averaging, and precise PWM dead-time insertion ensure stable torque output and EMI compliance. | Use Scenario: Battery-powered vibration/temperature sensor node deployed in rotating machinery for predictive maintenance. IC Role / Device Role / Timing Role: System-on-chip managing sensor acquisition, local FFT preprocessing, hibernation scheduling, and wireless data transmission trigger. Use Value: 1.7 µA hibernate current extends battery life beyond 5 years; integrated temperature sensor and comparator reduce component count by two devices. |
| Programmable Logic Controller (PLC) I/O Module | Human-Machine Interface (HMI) Controller |
Use Scenario: DIN-rail mounted digital I/O expansion module with isolated inputs/outputs and Modbus RTU communication. IC Role / Device Role / Timing Role: Central MCU handling GPIO scanning, watchdog supervision, UART-to-Modbus protocol translation, and error logging to flash. Use Value: 256 KB flash stores full Modbus stack + firmware updates; 64 KB SRAM accommodates multiple concurrent protocol buffers and state machines. | Use Scenario: Touch-enabled panel controller for HVAC or building automation with local display refresh, button debounce, and serial command routing. IC Role / Device Role / Timing Role: Application processor managing capacitive touch scan, LCD frame buffer DMA, UART command parsing, and backlight PWM dimming. Use Value: Eight PWM outputs drive RGB LED indicators and backlight; dual UARTs support simultaneous debug console and fieldbus interface without software multiplexing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TM4C123GH6PM | Successor part with same pinout, 80 MHz Cortex-M4F core, FPU, enhanced peripherals (USB host/device, CAN), 256 KB flash, 32 KB SRAM. | Supports floating-point math, USB host, and CAN bus - required for advanced motion control or fieldbus integration not possible with LM3S1968-EQC50-A2. | Select when upgrading legacy Stellaris designs needing higher performance, FPU, or CAN connectivity; requires minor firmware adaptation but no PCB change. |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, no hibernation module, different peripheral set (no integrated hibernate RTC or battery-backed RAM). | Lacks ultra-low-power hibernation - unsuitable for battery-only operation; stronger general-purpose GPIO and USB OTG support. | Choose for cost-sensitive, mains-powered applications where hibernation is unnecessary and higher flash density or USB OTG is preferred. |
Compared with TM4C123GH6PM and STM32F103VET6, the LM3S1968-EQC50-A2 delivers unique value in legacy-compatible, ultra-low-power industrial nodes where hibernation current <2 µA and integrated RTC with battery-backed memory are mandatory design constraints.
Availability
LM3S1968-EQC50-A2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, PLC I/O modules, and HMI controllers requiring stable component supply and long-term obsolescence management.
Supply support for LM3S1968-EQC50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in industrial, automotive, and communications markets.
The Stellaris LM3S series was designed specifically for cost-sensitive, real-time industrial control applications demanding high peripheral integration, deterministic response, and robust low-power operation - before the transition to the TM4C family.
FAQ
What is the maximum operating frequency of the LM3S1968-EQC50-A2?
The LM3S1968-EQC50-A2 operates at a maximum CPU frequency of 50 MHz, derived from its internal PLL and supported by the ARM Cortex-M3 core architecture. This speed is fully validated across the –40°C to +105°C industrial temperature range and enables sub-microsecond interrupt response for time-critical control loops. The LM3S1968-EQC50-A2 maintains this performance without external clock sources or overclocking.
Does the LM3S1968-EQC50-A2 support USB device functionality?
Yes, the LM3S1968-EQC50-A2 integrates a full-speed USB 2.0 device controller with on-chip PHY, supporting up to 12 Mbps data rates. It implements standard USB device classes including CDC (virtual COM port) and HID, and provides VBUS detection and ID pin support for basic OTG-like role negotiation. The LM3S1968-EQC50-A2 does not support USB host mode.
What is the hibernation current specification for the LM3S1968-EQC50-A2?
The LM3S1968-EQC50-A2 achieves a typical hibernation current of 1.7 µA at 3.3 V and 25°C, with RTC running and 2 KB of SRAM retained. This value is measured under specified conditions in the official Texas Instruments datasheet (SPMS037I, Section 6.3.6). The LM3S1968-EQC50-A2 maintains this ultra-low power state while supporting wake-up via external GPIO, RTC match, or hibernate interrupt - critical for battery-operated edge devices.
How much flash and SRAM memory does the LM3S1968-EQC50-A2 include?
The LM3S1968-EQC50-A2 contains 256 KB of on-chip flash memory and 64 KB of on-chip SRAM. Both memory blocks are accessible without wait states at maximum CPU speed. The flash supports in-system programming and secure lock bits; the SRAM is divided into contiguous blocks for stack, heap, and peripheral buffers. These capacities are fixed for the LM3S1968-EQC50-A2 and do not vary by revision or temperature grade.
Is the LM3S1968-EQC50-A2 pin-compatible with other Stellaris microcontrollers?
The LM3S1968-EQC50-A2 uses a 100-pin LQFP package shared with several other LM3S devices, including LM3S8962 and LM3S811, but pin functions differ significantly across the family. While physical footprint matches, signal mapping for peripherals like UART, SSI, and PWM is not identical. Therefore, the LM3S1968-EQC50-A2 is not drop-in compatible with other LM3S variants without schematic and layout review - direct replacement requires validation of all pin assignments and peripheral initialization sequences.
LM3S1968-EQC50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1968-EQC50-A2 FAQ
1.How can I place an order for LM3S1968-EQC50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1968-EQC50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1968-EQC50-A2 reliable?
The price and inventory of LM3S1968-EQC50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1968-EQC50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1968-EQC50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1968-EQC50-A2 transactions.
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LM3S1968-EQC50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1968-EQC50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1968-EQC50-A2?
For technical support, including LM3S1968-EQC50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1968-EQC50-A2 requirements.
6.How does Aetrix verify that LM3S1968-EQC50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1968-EQC50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1968-EQC50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1968-EQC50-A2?
All LM3S1968-EQC50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1968-EQC50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1968-EQC50-A2 part is unused and in its original packaging.
Return procedure for LM3S1968-EQC50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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