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Texas Instruments LM3S1968-IBZ50-A2
- Part No.:
- LM3S1968-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1968-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,382
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Product details
Overview
LM3S1968-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated hibernation module, 8-channel 12-bit ADC, dual UARTs, I²C, SSI, PWM, and analog comparators. It operates at 50 MHz and supports industrial temperature range (–40°C to +85°C) in a 100-pin LQFP package. Used in motor control, industrial automation, and embedded HMI systems.
For engineers reviewing the LM3S1968-IBZ50-A2 datasheet, LM3S1968-IBZ50-A2 pinout, LM3S1968-IBZ50-A2 application, or LM3S1968-IBZ50-A2 equivalent, key selection criteria include Cortex-M3 core performance, on-chip hibernation support, analog peripheral integration (ADC + comparators), and industrial-grade thermal reliability in LQFP-100 packaging.
Technical Context
The LM3S1968-IBZ50-A2 implements the ARMv7-M architecture with NVIC, SysTick, MPU, and debug interfaces including JTAG and SWD. Its system clock derives from an internal precision oscillator or external crystal, supporting programmable PLL multiplication up to 50 MHz.
Peripherals are memory-mapped and accessed via APB bus; the hibernation module provides RTC, battery-backed RAM, and wake-on-external-interrupt capability independent of main power domain. ADC supports hardware averaging across 8 sample sequencers with differential input mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, 50 MHz max operation |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface and erase/program protection |
| SRAM | 64 KB general-purpose SRAM with parity checking |
| ADC | 8-channel 12-bit SAR ADC with 1 MSPS sampling rate and hardware averaging |
| Hibernation Module | RTC, 2 KB battery-backed RAM, external wake-up pins, and low-power sleep states |
| Package | 100-pin LQFP (14 mm × 14 mm), RoHS-compliant, industrial temperature grade |
| Operating Temp | –40°C to +85°C ambient, qualified per TI's industrial reliability standards |
Pinout & Package
LM3S1968-IBZ50-A2 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, exposed thermal pad, and standard JEDEC MO-152AC footprint. Pin functions are defined per TI SPMS037I datasheet revision I.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Main, analog, and core power supplies | Separate 3.3 V domains enable noise isolation for ADC and digital logic |
| GND, GNDA, GNDC | Analog, digital, and core ground returns | Independent grounding paths reduce coupling between sensitive analog and noisy digital circuits |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO ports with alternate functions | Multi-function pins support UART, SSI, I²C, PWM, and timer capture/compare without external glue logic |
| XTAL, XTAL1 | External crystal oscillator inputs | Supports 1–25 MHz crystals for precise clock source; internal oscillator available as fallback |
| HIB, RTCCLK, HIBRST | Hibernation module control signals | Enable ultra-low-power RTC operation and wake-up from deep-sleep using battery backup |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Hibernation Module | Enables sub-µA sleep current with RTC and 2 KB battery-backed RAM retention |
| Dual UART with IrDA/SIR support | Allows serial communication with infrared remote control or legacy industrial protocols |
| 8-Channel 12-Bit ADC with Averaging | Reduces noise in sensor acquisition without external filtering or oversampling firmware |
| ARM Cortex-M3 with NVIC | Delivers deterministic interrupt latency (< 12 cycles) and priority-based nested handling for real-time control |
| Programmable GPIO with Commit Control | Prevents accidental reconfiguration during runtime by requiring write-to-commit sequence |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with position feedback and thermal monitoring. IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, managing PWM generation, ADC sampling, and fault detection. Use Value: Integrated 50 MHz Cortex-M3, dual PWM modules, and 12-bit ADC with hardware averaging enable precise torque control and fast response to load transients. | Use Scenario: Battery-powered environmental sensor hub collecting temperature, humidity, and pressure data. IC Role / Device Role / Timing Role: System-on-chip host managing sensor interfaces, local processing, and low-power wireless transmission scheduling. Use Value: Hibernation module reduces active time; 2 KB battery-backed RAM preserves calibration and state across power cycles without external EEPROM. |
| Human-Machine Interface (HMI) | Programmable Logic Controller (PLC) I/O Module |
Use Scenario: Touch-enabled panel with LED indicators, button inputs, and serial display interface. IC Role / Device Role / Timing Role: Central MCU handling touch scanning, LED/PWM dimming, UART display updates, and user input debouncing. Use Value: Multi-function GPIOs eliminate external level shifters; integrated comparators detect analog button thresholds directly. | Use Scenario: DIN-rail mounted I/O expansion module with digital input conditioning and relay output control. IC Role / Device Role / Timing Role: Real-time I/O manager interfacing with optocoupled inputs, driving solid-state relays, and communicating via Modbus RTU over UART. Use Value: Dual UARTs support isolated master/slave communication; watchdog timer ensures fail-safe recovery during field deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S811-IQN50-A2 | Smaller memory (64 KB flash, 8 KB SRAM), no hibernation module, same Cortex-M3 core and peripheral set except ADC channels reduced to 4 | Limited to simpler control tasks without RTC or battery-backed storage requirements | Select when cost sensitivity outweighs need for hibernation or larger memory |
| TM4C123GH6PM | Newer generation with enhanced peripherals (USB, CAN), higher flash (256 KB), same 100-pin LQFP but different pinout and voltage tolerance (3.3 V only vs. LM3S1968's 5-V-tolerant GPIOs) | Better suited for USB-connected devices or CAN-based industrial networks; requires PCB redesign | Choose for future-proofing and expanded connectivity where layout change is acceptable |
Compared with LM3S1968-IBZ50-A2, LM3S811-IQN50-A2 offers lower cost and footprint but sacrifices hibernation capability and memory headroom, while TM4C123GH6PM delivers modern features like USB and CAN at the expense of pin compatibility and 5-V-tolerant I/O - making it unsuitable as a drop-in replacement.
Availability
LM3S1968-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, HMI panels, and PLC I/O modules requiring stable component supply and long-term industrial qualification.
Supply support for LM3S1968-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of industrial and automotive qualification experience.
The Stellaris LM3S series was designed as TI's first ARM Cortex-M3-based microcontroller family targeting cost-sensitive, real-time industrial and consumer embedded applications with integrated analog and control peripherals.
FAQ
What is the maximum operating frequency of the LM3S1968-IBZ50-A2?
The LM3S1968-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz, achieved via its internal PLL configured from either the internal precision oscillator or an external crystal. This frequency is specified across the full industrial temperature range (–40°C to +85°C) and supported by the ARM Cortex-M3 core's timing closure under worst-case voltage and process corners.
Does the LM3S1968-IBZ50-A2 support hibernation mode with battery backup?
Yes, the LM3S1968-IBZ50-A2 includes a dedicated hibernation module that supports RTC operation, wake-up from external interrupts, and retention of 2 KB of SRAM using a coin-cell battery. The module maintains timekeeping and critical state during main power removal, enabling rapid system resume without full reinitialization.
What are the analog input capabilities of the LM3S1968-IBZ50-A2?
The LM3S1968-IBZ50-A2 integrates an 8-channel, 12-bit successive approximation register (SAR) ADC with up to 1 MSPS sampling rate. It supports hardware sample averaging across multiple conversions, differential input mode on selected channels, and direct connection to the internal temperature sensor - all accessible without external signal conditioning components.
Is the LM3S1968-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
No, the LM3S1968-IBZ50-A2 is not pin-compatible with most other LM3S devices due to differences in peripheral mapping and pin function assignment. For example, LM3S811 uses a 64-pin QFP package and lacks hibernation-related pins, while LM3S9B92 uses a 128-pin TQFP. Always verify pinout against SPMS037I datasheet revision I for LM3S1968-IBZ50-A2 specifically.
What debug interfaces does the LM3S1968-IBZ50-A2 support?
The LM3S1968-IBZ50-A2 supports both JTAG and Serial Wire Debug (SWD) interfaces for programming and real-time debugging. It includes full NVIC-integrated debug features such as breakpoints, watchpoints, and halt-mode debugging, compatible with TI's Code Composer Studio and third-party ARM-compliant tools like Segger J-Link.
LM3S1968-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1968-IBZ50-A2 FAQ
1.How can I place an order for LM3S1968-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1968-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1968-IBZ50-A2 reliable?
The price and inventory of LM3S1968-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1968-IBZ50-A2 is usually 5 days.
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5.How can I obtain technical support or documentation for LM3S1968-IBZ50-A2?
For technical support, including LM3S1968-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1968-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S1968-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1968-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1968-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1968-IBZ50-A2?
All LM3S1968-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1968-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1968-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S1968-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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