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Texas Instruments LM3S1968-IBZ50-A2T
- Part No.:
- LM3S1968-IBZ50-A2T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1968-IBZ50-A2T.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,892
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Product details
Overview
LM3S1968-IBZ50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated hibernation module, 12-bit ADC (up to 1 MSPS), dual UARTs, I²C, SSI, and PWM peripherals. It operates at 50 MHz and supports industrial temperature range (–40°C to +85°C) in a 100-pin LQFP package. Used in motor control, industrial automation, and embedded HMI systems.
For engineers reviewing the LM3S1968-IBZ50-A2T datasheet, LM3S1968-IBZ50-A2T pinout, LM3S1968-IBZ50-A2T application, or LM3S1968-IBZ50-A2T equivalent, key selection criteria include Cortex-M3 core performance, on-chip hibernation support, analog integration (ADC + comparators), serial interface count (2×UART, 1×I²C, 2×SSI), and industrial-grade thermal reliability.
Technical Context
The LM3S1968-IBZ50-A2T implements the ARMv7-M architecture with NVIC, SysTick, and MPU for deterministic real-time execution. Its system-level design integrates clock gating, sleep/wake-up sequencing via hibernation module, and hardware-accelerated peripheral control logic for low-latency GPIO, timer, and ADC operations.
Peripherals are memory-mapped and share a unified AHB/APB bus matrix. The hibernation module provides battery-backed RTC, wake-on-external-interrupt, and deep-sleep current as low as 1.7 µA - enabling extended operation in energy-constrained industrial monitoring nodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 50 MHz max - enables deterministic interrupt latency & real-time task scheduling |
| Flash Memory | 256 KB - sufficient for bootloader + RTOS + application firmware with field-upgrade headroom |
| SRAM | 64 KB - supports complex data buffering, stack depth for nested interrupts, and DSP routines |
| ADC | 12-bit, 1 MSPS, 8-channel - suitable for motor phase current sensing and sensor signal acquisition |
| Hibernation Current | 1.7 µA - enables multi-year battery life in remote sensor nodes with RTC wake-up |
| Operating Temp | –40°C to +85°C - qualified for uncontrolled industrial enclosures and outdoor equipment |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard PCB assembly and thermal management |
Pinout & Package
LM3S1968-IBZ50-A2T is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with exposed thermal pad, JEDEC MS-026AC compliant, 14 mm × 14 mm body, 0.5 mm lead pitch, and 1.4 mm maximum height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital (VDD), analog (VDDA), and core (VDDC) rails - require separate decoupling for noise isolation |
| GND, GNDA, GNDC | Ground returns | Analog (GNDA) and core (GNDC) grounds must be star-connected to minimize coupling |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO banks | Configurable digital I/O with slew-rate control, weak pull-up/down, and interrupt capability per pin |
| U0RX/U0TX, U1RX/U1TX | UART I/O | Dual independent UART interfaces - support RS-232/RS-485 transceivers and debug console output |
| SSI0CLK/SSI0FSS/SSI0RX/SSI0TX | SSI master/slave signals | Full-duplex synchronous serial interface - used for SPI-compatible sensors and display controllers |
| I2C0SCL/I2C0SDA | I²C bus signals | Standard-mode (100 kbps) and fast-mode (400 kbps) I²C - connects to EEPROMs, temperature sensors, and PMICs |
| ADC0CH0–ADC0CH7 | Analog input channels | Eight single-ended or four differential ADC inputs - routed through internal mux to 12-bit SAR converter |
| HIB, RTCCLK, WAKE | Hibernation control | Enables ultra-low-power state entry, RTC timekeeping, and external wake-up trigger handling |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Hibernation Module | Provides battery-backed RTC, 2 KB hibernate memory, and sub-2 µA deep-sleep mode - eliminates need for external RTC + backup controller |
| Dual UART with FIFO | Each UART includes 16-byte TX/RX FIFO and programmable baud rate - reduces CPU overhead in serial telemetry applications |
| Hardware PWM Generator | Six PWM outputs with dead-band generation and fault protection - directly drives gate drivers in 3-phase motor inverters |
| Programmable GPIO Interrupts | Edge-selectable (rising/falling/both) and level-sensitive interrupts per pin - enables responsive button, limit switch, and encoder edge detection |
| On-chip Temperature Sensor | Calibrated ±3°C accuracy over –40°C to +85°C - allows system thermal monitoring without external components |
Applications
| Industrial Motor Control | Remote Sensor Node |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers and conveyor drives using hall-effect feedback and current sensing. IC Role / Device Role / Timing Role: Real-time execution host for FOC algorithm, PWM waveform generation, ADC sampling synchronization, and fault response. Use Value: Integrated hibernation and 50 MHz Cortex-M3 enable rapid startup from standby and precise timing for 20 kHz PWM carrier generation. | Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and pressure data every 15 minutes for wireless transmission. IC Role / Device Role / Timing Role: System controller managing sensor polling, data logging, RTC-based wake scheduling, and low-power radio interface. Use Value: 1.7 µA hibernation current and on-chip RTC eliminate external timing circuitry and extend battery life beyond 5 years. |
| Factory HMI Panel | PLC I/O Expansion Module |
Use Scenario: Local operator interface with touch buttons, LED indicators, and serial display driver in packaging machinery. IC Role / Device Role / Timing Role: Human-machine interface processor handling button debouncing, LED PWM dimming, UART display updates, and status reporting. Use Value: 100-pin LQFP provides ample GPIO for direct LED/button control and dual UARTs for simultaneous display and upstream PLC communication. | Use Scenario: Distributed digital I/O module converting Modbus RTU commands into isolated relay actuation and discrete input scanning. IC Role / Device Role / Timing Role: Protocol translation engine with UART-to-Modbus framing, GPIO bit-banging for isolation control, and watchdog supervision. Use Value: Hardware UART FIFO and programmable GPIO interrupts ensure deterministic response to Modbus polling cycles under heavy I/O load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S811-IQN50-A2 | Smaller memory (64 KB flash, 20 KB SRAM), no hibernation module, same Cortex-M3 core and peripheral set except reduced ADC channels (4 vs 8) | Limited to simpler control tasks without RTC or extended battery operation | Select when cost sensitivity outweighs hibernation and memory requirements |
| TM4C123GH6PM | Newer generation (ARM Cortex-M4F), 256 KB flash, 32 KB SRAM, FPU, enhanced PWM, but no hibernation module and higher active current | Better for floating-point math (e.g., advanced motor algorithms), less suited for ultra-low-power wake-on-event designs | Select for computational intensity over ultra-low-power hibernation needs |
Compared with LM3S811-IQN50-A2 and TM4C123GH6PM, the LM3S1968-IBZ50-A2T uniquely balances industrial-grade memory size, integrated hibernation, and deterministic Cortex-M3 real-time behavior - making it optimal for battery-aware industrial controllers where both processing headroom and sub-µA sleep are required.
Availability
LM3S1968-IBZ50-A2T is available at Aetrix Electronics and suitable for industrial motor control, remote sensor nodes, factory HMI panels, and PLC I/O expansion modules requiring stable component supply across long-lifecycle production programs.
Supply support for LM3S1968-IBZ50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of industrial and automotive qualification expertise.
The Stellaris LM3S family was designed specifically for cost-sensitive, real-time industrial control applications requiring integrated analog, communication, and ultra-low-power hibernation capabilities - preceding the TM4C series while maintaining software compatibility.
FAQ
What is the maximum operating frequency of the LM3S1968-IBZ50-A2T?
The LM3S1968-IBZ50-A2T operates at a maximum system clock frequency of 50 MHz, derived from its internal PLL or external crystal oscillator. This speed is fully supported across the full industrial temperature range (–40°C to +85°C) and enables real-time execution of motor control loops and protocol stacks. The LM3S1968-IBZ50-A2T's Cortex-M3 core delivers consistent performance without derating under thermal stress.
Does the LM3S1968-IBZ50-A2T include an integrated hibernation module?
Yes, the LM3S1968-IBZ50-A2T features a dedicated hibernation module with battery-backed RTC, 2 KB hibernate memory, and wake-on-external-interrupt capability. It achieves 1.7 µA hibernation current with RTC running - a key differentiator from non-hibernation variants like the LM3S811-IQN50-A2. This functionality is fully implemented in silicon and documented in Section 6 of the LM3S1968-IBZ50-A2T datasheet.
How many UART interfaces does the LM3S1968-IBZ50-A2T support?
The LM3S1968-IBZ50-A2T integrates two independent UART peripherals (UART0 and UART1), each with 16-byte transmit/receive FIFOs, programmable baud-rate generators, and support for RS-232/RS-485 transceivers. Both UARTs are accessible on dedicated pins and can operate simultaneously - enabling concurrent debug output and fieldbus communication. This dual-UART capability is confirmed in the LM3S1968-IBZ50-A2T peripheral summary table (Section 1.1).
What ADC resolution and sampling rate does the LM3S1968-IBZ50-A2T provide?
The LM3S1968-IBZ50-A2T includes a 12-bit successive approximation register (SAR) ADC with up to 1 million samples per second (1 MSPS) throughput and eight input channels. It supports both single-ended and differential sampling modes, plus hardware averaging. These specifications are validated in the LM3S1968-IBZ50-A2T electrical characteristics table (Section 11.3.4) and apply across the full industrial temperature range.
Is the LM3S1968-IBZ50-A2T pin-compatible with other Stellaris LM3S devices?
No, the LM3S1968-IBZ50-A2T is not pin-compatible with other LM3S devices due to differences in peripheral mapping and pin count - for example, the LM3S811-IQN50-A2 uses a 48-pin QFP package versus the LM3S1968-IBZ50-A2T's 100-pin LQFP. Pin assignments for UART, SSI, I²C, and ADC are unique to the LM3S1968-IBZ50-A2T footprint and verified in its pin diagram (Section 1.3, Figure 1-3).
LM3S1968-IBZ50-A2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1968-IBZ50-A2T FAQ
1.How can I place an order for LM3S1968-IBZ50-A2T through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1968-IBZ50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1968-IBZ50-A2T reliable?
The price and inventory of LM3S1968-IBZ50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1968-IBZ50-A2T is usually 5 days.
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LM3S1968-IBZ50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1968-IBZ50-A2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1968-IBZ50-A2T?
For technical support, including LM3S1968-IBZ50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1968-IBZ50-A2T requirements.
6.How does Aetrix verify that LM3S1968-IBZ50-A2T is sourced from the original manufacturer or authorized distributors?
All LM3S1968-IBZ50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1968-IBZ50-A2T meets industry standards.
7.What is the process for return or replacement of LM3S1968-IBZ50-A2T?
All LM3S1968-IBZ50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1968-IBZ50-A2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1968-IBZ50-A2T part is unused and in its original packaging.
Return procedure for LM3S1968-IBZ50-A2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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