Texas Instruments LM3S2110-EQC25-A2T
- Part No.:
- LM3S2110-EQC25-A2T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
LM3S2110-EQC25-A2T.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LM3S2110-EQC25-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 32 KB SRAM, and integrated CAN, UART, I2C, SSI, PWM, analog comparators, and GPIOs. It operates at up to 50 MHz and supports industrial motor control, sensor interfacing, and embedded automation systems requiring deterministic real-time response.
For engineers reviewing the LM3S2110-EQC25-A2T datasheet, LM3S2110-EQC25-A2T pinout, LM3S2110-EQC25-A2T application, or LM3S2110-EQC25-A2T equivalent, key selection criteria include its 50 MHz Cortex-M3 core, on-chip CAN 2.0B controller, 256 KB flash with error correction, 32 KB SRAM, and QFP-100 package with 80 GPIOs - all validated for industrial temperature operation (–40°C to +105°C).
Technical Context
The LM3S2110-EQC25-A2T implements the ARMv7-M architecture with nested vectored interrupt controller (NVIC), SysTick timer, and memory protection unit (MPU). It integrates a single CAN 2.0B controller supporting bit rates up to 1 Mbps and 32 message objects with programmable acceptance filtering.
Its peripheral set includes three UARTs (one with IrDA/SIR), two SSI modules (SPI/SSI/Microwire), one I2C master/slave interface, eight 16-bit general-purpose timers (with RTC and PWM capability), four analog comparators, and a 100-pin LQFP package with dedicated JTAG/SWD debug pins and 80 GPIOs mapped across six ports.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs at up to 50 MHz - enables deterministic real-time execution with <12-cycle interrupt latency. |
| Flash Memory | 256 KB with ECC and 128-bit wide interface - supports reliable firmware storage and over-the-air updates in harsh environments. |
| SRAM | 32 KB, zero-wait-state access - sufficient for real-time control stacks, communication buffers, and sensor data processing. |
| CAN Interface | One CAN 2.0B controller with 32 message objects and programmable acceptance filtering - enables robust fieldbus communication in industrial networks. |
| GPIO Count | 80 GPIOs across six ports (A–F), with configurable pull-up/down, slew rate, and drive strength - supports flexible peripheral interfacing and board-level signal routing. |
| Operating Temp | –40°C to +105°C - qualified for extended industrial and motor control applications without derating. |
| Package | 100-pin LQFP (EQC), 14 mm × 14 mm, 0.5 mm pitch - compatible with standard surface-mount assembly and thermal management in dense PCB layouts. |
Pinout & Package
LM3S2110-EQC25-A2T is housed in a 100-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, designed for industrial-grade thermal dissipation and mechanical reliability. Pinout follows TI's standardized Stellaris LM3S2110 pin mapping for full compatibility with evaluation boards and reference designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Dedicated digital (VDD), analog (VDDA), and core (VDDC) rails - enable clean power separation for mixed-signal operation and noise immunity. |
| GND, GNDA, GNDC | Ground returns | Independent analog (GNDA), core (GNDC), and digital (GND) grounds - reduce coupling between sensitive analog and noisy digital domains. |
| PA0–PA7, PB0–PB7, etc. | General-purpose I/O | 80 total GPIOs with alternate function mapping - support UART, CAN, SSI, I2C, PWM, and timer capture/compare on shared pins. |
| TDI, TDO, TCK, TMS, nSRST | JTAG/SWD debug interface | Fully compliant ARM CoreSight debug interface - enables non-intrusive real-time debugging, flash programming, and boundary scan testing. |
| CAN0RX, CAN0TX | CAN physical layer interface | Dedicated differential CAN transceiver pins - connect directly to external CAN bus transceiver (e.g., SN65HVD230) without level-shifting. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0B Controller | Supports 1 Mbps bit rate and 32 message objects with hardware acceptance filtering - eliminates need for external CAN protocol IC in motor drives and PLC nodes. |
| ARM Cortex-M3 with MPU | Memory Protection Unit enforces privilege separation between application and kernel code - improves system robustness in safety-critical embedded firmware. |
| Multiple Serial Interfaces | Three UARTs (one with IrDA), two SSI, one I2C - enables concurrent communication with sensors, displays, host controllers, and legacy peripherals without software bit-banging. |
| Dedicated Analog Comparators | Four rail-to-rail comparators with internal voltage reference - provide fast overvoltage/undervoltage detection and zero-crossing sensing for motor phase monitoring. |
| PWM with Dead-Band Generation | Eight PWM outputs with programmable dead-band insertion - ensures safe complementary switching in H-bridge and inverter gate drivers. |
Applications
| Industrial Motor Control | Building Automation Node |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC blowers and pump drives using hall-effect feedback and space-vector modulation. IC Role / Device Role / Timing Role: Real-time execution engine managing PWM generation, current sensing ADC sampling (via external ADC), CAN-based command reception, and fault handling. Use Value: Deterministic 50 MHz Cortex-M3 timing ensures sub-microsecond PWM edge alignment and synchronized ADC trigger events critical for torque ripple reduction. | Use Scenario: Distributed sensor node aggregating temperature, occupancy, and CO₂ data across multiple zones and reporting via CAN bus to central BMS controller. IC Role / Device Role / Timing Role: System-on-chip controller handling multi-sensor polling, local decision logic, CAN message framing, and low-power sleep/wake scheduling. Use Value: Integrated CAN 2.0B and 80 GPIOs allow direct connection to analog sensors and discrete actuators - reducing BOM count and board area vs. MCU + CAN transceiver + GPIO expander solution. |
| Programmable Logic Controller (PLC) I/O Module | Industrial Data Logger |
Use Scenario: DIN-rail mounted digital I/O expansion module accepting 24 V DC inputs and driving relay outputs in factory automation lines. IC Role / Device Role / Timing Role: Central logic processor executing ladder logic scans, isolating input status, updating output states, and communicating status via CANopen or custom CAN protocol. Use Value: 32 KB SRAM provides buffer space for 100+ I/O points and 10+ ms scan cycles; 256 KB flash stores firmware plus configuration tables for field reprogramming. | Use Scenario: Standalone environmental monitor logging temperature, humidity, and vibration data at 1 Hz intervals onto microSD card while maintaining CAN network heartbeat. IC Role / Device Role / Timing Role: Host controller managing SD card SPI interface, real-time clock (RTC) timer, CAN status reporting, and low-power sleep mode transitions. Use Value: Built-in 32-bit RTC timer with battery-backed operation enables accurate timestamping without external RTC IC; dual SSI interfaces support simultaneous SD card and CAN transceiver control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TM4C123GH6PM | Successor part with 80 MHz Cortex-M4F core, 256 KB flash, 32 KB SRAM, FPU, and enhanced CAN/PWM - same pinout but higher performance and added floating-point capability. | Required for applications needing DSP math, advanced motor control algorithms, or higher throughput communication stacks. | Select TM4C123GH6PM when migrating from LM3S2110-EQC25-A2T for improved compute density and future-proofing; requires minor firmware adaptation due to peripheral register map differences. |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, USB, and CAN - different pinout (100-pin LQFP but incompatible signal mapping), no integrated analog comparators. | Suitable where USB device interface or larger memory is prioritized over analog comparator integration and CAN message object depth. | Choose STM32F103VET6 only if USB connectivity is mandatory and CAN requirements are basic (single instance, ≤16 message objects); board redesign required due to non-compatible pin mapping. |
Compared with LM3S2110-EQC25-A2T, TM4C123GH6PM offers higher clock speed and FPU for computationally intensive tasks, while STM32F103VET6 trades analog comparators and CAN flexibility for USB and larger memory - both require firmware and layout changes, making LM3S2110-EQC25-A2T optimal for cost-sensitive, CAN-centric industrial control where proven qualification and minimal BOM are critical.
Availability
LM3S2110-EQC25-A2T is available at Aetrix Electronics and suitable for industrial motor control, building automation nodes, PLC I/O modules, and environmental data loggers requiring stable component supply and long-term industrial temperature support.
Supply support for LM3S2110-EQC25-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and wireless technologies for industrial, automotive, and consumer markets since 1930.
The Stellaris LM3S series was designed specifically for cost-sensitive, real-time industrial control applications requiring integrated CAN, deterministic timing, and robust mixed-signal peripheral sets - positioning LM3S2110-EQC25-A2T as a purpose-built solution for factory automation and motor drive subsystems.
FAQ
What is the maximum operating frequency of the LM3S2110-EQC25-A2T?
The LM3S2110-EQC25-A2T operates at a maximum system clock frequency of 50 MHz, derived from an internal PLL that multiplies the crystal oscillator input. This frequency is fully supported across the entire industrial temperature range (–40°C to +105°C) and enables deterministic interrupt response times under real-time constraints. The LM3S2110-EQC25-A2T achieves this performance while maintaining low dynamic power consumption typical of the ARM Cortex-M3 architecture.
Does the LM3S2110-EQC25-A2T include an integrated CAN controller?
Yes, the LM3S2110-EQC25-A2T integrates a single CAN 2.0B-compliant controller supporting bit rates up to 1 Mbps and 32 message objects with hardware-based acceptance filtering. It includes dedicated CAN0RX and CAN0TX pins for direct connection to an external CAN transceiver. The LM3S2110-EQC25-A2T's CAN module is fully functional without external protocol assistance and is validated for use in industrial fieldbus networks per ISO 11898-1.
What package type and pin count does the LM3S2110-EQC25-A2T use?
The LM3S2110-EQC25-A2T uses a 100-pin Low-Profile Quad Flat Package (LQFP) with 0.5 mm pitch and an exposed thermal pad, designated by the "EQC" suffix. This package provides 80 GPIOs distributed across six I/O ports and maintains full pin compatibility with other LM3S2110 variants in the same EQC family. The LM3S2110-EQC25-A2T's LQFP footprint is optimized for automated assembly and thermal performance in industrial PCB layouts.
What is the flash and SRAM capacity of the LM3S2110-EQC25-A2T?
The LM3S2110-EQC25-A2T contains 256 KB of on-chip flash memory with built-in error correction coding (ECC) and 32 KB of zero-wait-state SRAM. The flash supports in-application programming (IAP) and sector erase operations, while the SRAM is partitioned to support stack, heap, and peripheral buffer usage in real-time embedded applications. Both memory blocks are accessible across the full industrial temperature range of the LM3S2110-EQC25-A2T.
Is the LM3S2110-EQC25-A2T supported by modern development tools?
Yes, the LM3S2110-EQC25-A2T is supported by TI's legacy StellarisWare Peripheral Driver Library and Code Composer Studio v6.x and earlier. While newer TI MCUs use the TivaWare library and CCS v7+, the LM3S2110-EQC25-A2T retains full toolchain compatibility for maintenance and legacy design reuse. Debugging is enabled via JTAG or SWD using XDS100v3 or compatible emulators - ensuring continued development viability for the LM3S2110-EQC25-A2T in sustaining engineering environments.
LM3S2110-EQC25-A2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- Stellaris® ARM® Cortex®-M3S 2000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S2110-EQC25-A2T FAQ
1.How can I place an order for LM3S2110-EQC25-A2T through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S2110-EQC25-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S2110-EQC25-A2T reliable?
The price and inventory of LM3S2110-EQC25-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2110-EQC25-A2T is usually 5 days.
3.What payment methods are accepted for LM3S2110-EQC25-A2T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2110-EQC25-A2T transactions.
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LM3S2110-EQC25-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S2110-EQC25-A2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S2110-EQC25-A2T?
For technical support, including LM3S2110-EQC25-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2110-EQC25-A2T requirements.
6.How does Aetrix verify that LM3S2110-EQC25-A2T is sourced from the original manufacturer or authorized distributors?
All LM3S2110-EQC25-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2110-EQC25-A2T meets industry standards.
7.What is the process for return or replacement of LM3S2110-EQC25-A2T?
All LM3S2110-EQC25-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2110-EQC25-A2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S2110-EQC25-A2T part is unused and in its original packaging.
Return procedure for LM3S2110-EQC25-A2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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