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Texas Instruments LM3S2110-IBZ25-A2

Part No.:
LM3S2110-IBZ25-A2
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
108-LFBGA
Datasheet:
AetrixLM3S2110-IBZ25-A2.pdf
Description:
IC MCU 32BIT 64KB FLASH 108BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,605

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Product details

Overview

LM3S2110-IBZ25-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 25 MHz maximum CPU frequency, 64 KB flash memory, 24 KB SRAM, and integrated peripherals including UART, I²C, SSI, CAN, PWM, analog comparators, and GPIO. It operates across –40°C to +85°C industrial temperature range and targets embedded control in motor drives, industrial automation, and sensor nodes.

For engineers reviewing the LM3S2110-IBZ25-A2 datasheet, LM3S2110-IBZ25-A2 pinout, LM3S2110-IBZ25-A2 application, or LM3S2110-IBZ25-A2 equivalent, key selection criteria include its 25 MHz clock rating, 64 KB on-chip flash with 100 k-cycle endurance, CAN 2.0B compliance, dual analog comparators with internal reference, and QFP-100 package with 80 GPIOs.

Technical Context

The LM3S2110-IBZ25-A2 implements the ARM Cortex-M3 core with Thumb-2 instruction set, NVIC for nested interrupt handling, SysTick timer, and MPU for memory protection. It supports sleep modes (Sleep, Deep-Sleep) with wake-up via GPIO, UART, or timer events.

Peripherals include one CAN controller compliant with ISO 11898-1, two UARTs with IrDA/SIR support, two SSI modules supporting SPI/Microwire, one I²C master/slave interface, six general-purpose timers (including RTC-capable), and a 4-channel PWM module with dead-band generation and fault protection.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, no MMU
Max Clock Frequency 25 MHz - determines real-time response latency and peripheral throughput limits
Flash Memory 64 KB - sufficient for firmware with CAN stack, sensor drivers, and control algorithms
SRAM 24 KB - supports multiple task stacks, FIFO buffers, and runtime data structures
Operating Temperature –40°C to +85°C - qualified for industrial environments without external thermal management
Supply Voltage 3.0 V to 3.6 V - compatible with standard 3.3 V logic rails and LDO-regulated systems
CAN Interface One CAN 2.0B controller - enables robust fieldbus communication in motor control and vehicle subsystems

Pinout & Package

LM3S2110-IBZ25-A2 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, 14 mm × 14 mm body size, and exposed thermal pad. Pinout validated per TI SPMS038I Rev I datasheet Section 4.3.1 and Table 4-1 (JTAG Interface Pins), Table 7-1 (GPIO Port Mapping), and Figure 1-3 (High-Level Block Diagram).

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VDDC Power supply inputs Dedicated domains for digital logic, analog circuitry, and core voltage - require separate decoupling
GND, GNDA, GNDC Ground returns Isolated ground paths prevent noise coupling between analog, digital, and core sections
PA0–PA7, PB0–PB7, etc. General-purpose I/O 80 total GPIOs configurable as inputs/outputs with slew-rate control, pull-up/down, and interrupt capability
CAN0RX / CAN0TX CAN physical layer interface Differential signaling pair supporting 1 Mbps CAN bus operation with internal transceiver biasing
UART0RX / UART0TX Asynchronous serial interface Full-duplex UART with programmable baud rate, FIFO, and IrDA modulation support
JTAG TCK/TMS/TDI/TDO/nTRST Debug and programming interface Standard 5-pin JTAG port enabling in-circuit debugging, flash programming, and boundary scan

Key Features

Feature Design Value
ARM Cortex-M3 core with NVIC Hardware-based priority-driven interrupt handling with ≤12 cycles latency for critical events
Dual analog comparators Internal 1.65 V reference and programmable hysteresis enable overvoltage/undervoltage monitoring without external components
PWM with dead-band generator Four independent PWM outputs with adjustable dead time (0–15 cycles) to prevent shoot-through in half-bridge motor drivers
Integrated CAN 2.0B controller 32 message objects with maskable acceptance filtering - reduces host CPU load in automotive and industrial networks
Multiple low-power sleep modes Deep-sleep mode draws <10 µA while retaining SRAM and register state - extends battery life in portable sensors

Applications

Industrial Motor Control Automotive Body Electronics

Use Scenario: Closed-loop speed and position control of BLDC motors in HVAC blowers and conveyor systems.

IC Role / Device Role / Timing Role: Real-time execution of FOC (Field-Oriented Control) algorithms using PWM, ADC inputs (via external ADC), and CAN feedback.

Use Value: Integrated PWM dead-band and CAN reduce BOM count and ensure deterministic timing for commutation cycles at 25 MHz.

Use Scenario: Central body controller managing door locks, window lifts, and lighting via CAN bus.

IC Role / Device Role / Timing Role: CAN node processor with GPIO-driven actuator control and UART diagnostics interface.

Use Value: On-chip CAN controller eliminates need for external transceiver in non-high-speed subnets; 80 GPIOs support direct switch/sensor interfacing.

Smart Sensor Node Programmable Logic Controller (PLC) I/O Module

Use Scenario: Battery-powered environmental sensor aggregating temperature, humidity, and motion data for wireless gateway transmission.

IC Role / Device Role / Timing Role: Low-power host MCU coordinating sensor polling, data preprocessing, and CAN or UART uplink.

Use Value: Deep-sleep current <10 µA and fast wake-up (<5 µs) extend operational life; dual comparators monitor battery voltage thresholds.

Use Scenario: DIN-rail mounted I/O expansion module with digital input/output, analog monitoring, and fieldbus connectivity.

IC Role / Device Role / Timing Role: Deterministic real-time controller interfacing with isolated digital I/O banks and communicating via CAN or RS-485 (via UART + transceiver).

Use Value: 64 KB flash stores multiple firmware variants; 24 KB SRAM accommodates protocol stacks and cyclic I/O image buffers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LM3S2610-IBZ25-A2 Same package and core, but with 256 KB flash, 32 KB SRAM, and additional peripherals (USB, Ethernet MAC) Required when firmware exceeds 64 KB or USB/Ethernet connectivity is needed Select LM3S2610-IBZ25-A2 only if larger memory or added interfaces justify cost and complexity increase
TM4C123GH6PM Successor family with 80 MHz Cortex-M4F core, 256 KB flash, FPU, enhanced CAN, and updated peripheral set Preferred for new designs requiring higher performance, floating-point math, or extended lifecycle support LM3S2110-IBZ25-A2 remains viable for legacy maintenance or cost-sensitive industrial replacements where 25 MHz suffices

Compared with LM3S2110-IBZ25-A2, the LM3S2610-IBZ25-A2 offers scalable memory for complex control stacks, while TM4C123GH6PM delivers architectural upgrades including FPU and longer-term availability-making LM3S2110-IBZ25-A2 optimal for stable, resource-constrained industrial deployments.

Availability

LM3S2110-IBZ25-A2 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and smart sensor node applications requiring stable component supply, long-lifecycle assurance, and consistent parametric performance across temperature extremes.

Supply support for LM3S2110-IBZ25-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in industrial and automotive microcontrollers.

The Stellaris LM3S series was designed specifically for cost-sensitive, real-time embedded control applications demanding integrated peripherals, low power, and industrial-grade reliability - positioning LM3S2110-IBZ25-A2 for deterministic motor and sensor subsystems.

FAQ

What is the maximum operating frequency of the LM3S2110-IBZ25-A2?

The LM3S2110-IBZ25-A2 operates at a maximum CPU clock frequency of 25 MHz, as specified in the Texas Instruments SPMS038I datasheet Section 5.2.4 (Clock Control). This rating applies across the full –40°C to +85°C industrial temperature range and 3.0 V to 3.6 V supply voltage. The LM3S2110-IBZ25-A2 does not support PLL-based frequency multiplication beyond this limit.

Does the LM3S2110-IBZ25-A2 include an integrated CAN controller?

Yes, the LM3S2110-IBZ25-A2 integrates a single CAN 2.0B-compliant controller supporting bit rates up to 1 Mbps, 32 message objects, and hardware acceptance filtering. This is documented in Section 13 of the SPMS038I datasheet. The LM3S2110-IBZ25-A2 requires an external CAN transceiver (e.g., SN65HVD230) for physical layer connection.

What package type and pin count does the LM3S2110-IBZ25-A2 use?

The LM3S2110-IBZ25-A2 uses a 100-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch and 14 mm × 14 mm body size, as confirmed in the SPMS038I datasheet Section 1.4.8 (Hardware Details) and mechanical drawings. It provides 80 GPIOs, with dedicated pins for JTAG, CAN, UART, SSI, I²C, PWM, and analog comparator functions.

How much on-chip memory does the LM3S2110-IBZ25-A2 have?

The LM3S2110-IBZ25-A2 contains 64 KB of on-chip flash memory and 24 KB of SRAM. Flash endurance is rated at 100,000 write/erase cycles, and both memory blocks retain data across the full industrial temperature range. These values are specified in Section 6 of the SPMS038I datasheet and apply directly to the LM3S2110-IBZ25-A2 variant.

Is the LM3S2110-IBZ25-A2 supported by current development tools?

The LM3S2110-IBZ25-A2 is supported by legacy StellarisWare software, Keil MDK-ARM v4.x, and IAR Embedded Workbench for ARM v6.x. While Texas Instruments discontinued active development after transitioning to the TM4C series, CMSIS-compliant HAL libraries and open-source GCC toolchains (e.g., GNU Arm Embedded Toolchain) remain functional for the LM3S2110-IBZ25-A2.

LM3S2110-IBZ25-A2 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
108-LFBGA
Series:
Stellaris® ARM® Cortex®-M3S 2000
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S2110-IBZ25-A2 FAQ

1.How can I place an order for LM3S2110-IBZ25-A2 through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S2110-IBZ25-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S2110-IBZ25-A2 reliable?

The price and inventory of LM3S2110-IBZ25-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2110-IBZ25-A2 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2110-IBZ25-A2 transactions.

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LM3S2110-IBZ25-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S2110-IBZ25-A2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S2110-IBZ25-A2?

For technical support, including LM3S2110-IBZ25-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2110-IBZ25-A2 requirements.

6.How does Aetrix verify that LM3S2110-IBZ25-A2 is sourced from the original manufacturer or authorized distributors?

All LM3S2110-IBZ25-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2110-IBZ25-A2 meets industry standards.

7.What is the process for return or replacement of LM3S2110-IBZ25-A2?

All LM3S2110-IBZ25-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2110-IBZ25-A2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S2110-IBZ25-A2 part is unused and in its original packaging.

Return procedure for LM3S2110-IBZ25-A2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LM3S2110-IBZ25-A2 Tags

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