Texas Instruments LM3S2608-EQC50-A2T
- Part No.:
- LM3S2608-EQC50-A2T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
LM3S2608-EQC50-A2T.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,942
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S2608-EQC50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, 12-bit ADC (8-channel), and dual UARTs. It operates at up to 50 MHz and supports hibernation mode with RTC and battery-backed memory for low-power industrial sensing and motor control applications.
For engineers reviewing the LM3S2608-EQC50-A2T datasheet, LM3S2608-EQC50-A2T pinout, LM3S2608-EQC50-A2T application, or LM3S2608-EQC50-A2T equivalent, key selection considerations include its integrated CAN interface, hibernation module with battery-backed RAM, 50 MHz Cortex-M3 core timing, and QFP-100 package compatibility with legacy Stellaris designs.
Technical Context
The LM3S2608-EQC50-A2T implements the ARMv7-M architecture with NVIC, SysTick, and MPU, enabling deterministic real-time interrupt handling and memory protection. Its hibernation module provides deep-sleep entry with wake-up via RTC match, external GPIO, or CAN activity - all while retaining 2 KB of battery-backed SRAM.
It integrates a dual-channel 12-bit ADC with hardware averaging and sequencer-based sampling, plus two independent UARTs supporting IrDA/SIR, one SSI, and one I²C interface - all clocked from a configurable PLL-driven system clock derived from internal RC, external crystal, or precision oscillator inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs at up to 50 MHz - enables deterministic real-time task scheduling and efficient C/C++ execution. |
| Flash Memory | 256 KB on-chip flash with 128-bit wide access - supports in-application programming and secure firmware updates. |
| SRAM | 64 KB general-purpose SRAM + 2 KB hibernate RAM - retains critical state during ultra-low-power hibernation. |
| ADC | 12-bit, 8-channel, 1 MSPS sampling rate with hardware averaging - suitable for precision analog sensor interfacing without external signal conditioning. |
| CAN Interface | One CAN 2.0A/B-compliant controller with 32 message objects - enables robust fieldbus communication in automotive and industrial networks. |
| Package | 100-pin LQFP (EQC), 14 mm × 14 mm, 0.5 mm pitch - compatible with standard surface-mount assembly and legacy Stellaris evaluation boards. |
| Hibernation Mode | Active current < 1.9 µA with RTC running - allows years of operation on coin-cell batteries in remote monitoring systems. |
Pinout & Package
LM3S2608-EQC50-A2T is housed in a 100-pin LQFP (Leadless Quad Flat Package) with exposed thermal pad, JEDEC MS-026AC compliant. Pinout validated per TI SPMS046I datasheet Rev I (July 2014), pages 41, 168–172, 283–293.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital (3.3 V), analog (3.3 V), and core (1.2 V) rails - require separate decoupling to meet noise immunity specs for ADC and CAN. |
| GND, GNDA, GNDC | Ground returns | Analog, digital, and core ground planes must be partitioned and joined at single point to minimize coupling noise into sensitive peripherals. |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO banks | Configurable as inputs/outputs with slew-rate control, weak pull-up/down, and edge-triggered interrupts - support multiplexed peripheral functions including UART, SSI, I²C, and CAN TX/RX. |
| PA0–PA1, PB0–PB1 | CAN0RX / CAN0TX | Dedicated differential CAN bus interface pins - require external 120 Ω termination and isolated transceiver for bus compliance. |
| HIB, RTCCLK, HIBRST | Hibernation control | Enable deep-sleep entry, provide external RTC clock source (32.768 kHz), and reset hibernation logic - essential for battery-powered wake-on-event designs. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0A/B controller | Reduces BOM count by eliminating external CAN protocol ICs and simplifies PCB layout with direct MCU-to-bus connection. |
| Hibernation module with RTC & battery-backed RAM | Enables sub-2 µA sleep current with timekeeping and state retention - critical for energy-harvesting and long-life sensor nodes. |
| 12-bit 8-channel ADC with hardware averaging | Delivers effective resolution >13 bits for noisy industrial environments without software oversampling overhead. |
| Dual UARTs with IrDA/SIR support | Allows simultaneous serial diagnostics and infrared remote interface - useful in embedded HMI and service port applications. |
| ARM Cortex-M3 with NVIC and MPU | Provides priority-based interrupt nesting, memory protection, and Thumb-2 instruction set - improves code density and real-time determinism over legacy 8/16-bit MCUs. |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Closed-loop brushless DC motor control in HVAC blowers and pump drives using PWM timers and ADC feedback. IC Role / Device Role / Timing Role: Real-time motion controller executing FOC algorithms, sampling current/voltage sensors, and generating synchronized gate drive signals. Use Value: Integrated 50 MHz Cortex-M3 core and dual 16-bit PWM timers eliminate need for external timing ICs; CAN interface enables integration into vehicle body networks. | Use Scenario: Door module managing window lift, mirror adjustment, and interior lighting with wake-on-CAN capability. IC Role / Device Role / Timing Role: Low-power system manager that remains in hibernation until CAN frame reception triggers full wake-up and peripheral activation. Use Value: Sub-2 µA hibernation current extends battery life; integrated CAN controller reduces component count and EMI risk versus discrete transceiver solutions. |
| Remote Environmental Monitoring | Programmable Logic Controller (PLC) I/O Module |
Use Scenario: Solar-powered weather station collecting temperature, humidity, and pressure data with periodic wireless upload. IC Role / Device Role / Timing Role: Sensor hub aggregating analog and digital inputs, performing local preprocessing, and managing power states via hibernation timer. Use Value: Battery-backed 2 KB RAM preserves calibration data and event logs across power cycles; RTC ensures accurate timestamping without external components. | Use Scenario: DIN-rail mounted I/O expansion module communicating with main PLC CPU over CAN bus. IC Role / Device Role / Timing Role: Fieldbus interface processor handling CAN message filtering, buffering, and GPIO state synchronization. Use Value: 32 message object FIFO and programmable acceptance filtering offload host CPU; 100-pin LQFP supports dense I/O routing for modular backplane designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Tiva C TM4C123GH6PM | Successor part with same pinout, 80 MHz Cortex-M4F core, floating-point unit, and enhanced CAN features - requires minor firmware update for FPU usage. | Supports higher-performance motor control with DSP extensions and larger flash (256 KB → 512 KB), but lacks hibernation-specific battery-backed RAM. | Select when migrating to newer TI ecosystem with extended toolchain support and higher compute throughput; verify hibernation logic adaptation. |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, no native CAN hibernation support, different pinout and peripheral mapping. | Requires external RTC and backup power circuitry for timekeeping during sleep; CAN implementation lacks built-in message object FIFO depth matching LM3S2608. | Select for cost-sensitive applications where CAN is secondary and hibernation duration is short; expect layout and driver-level redesign. |
Compared with TM4C123GH6PM and STM32F103VET6, the LM3S2608-EQC50-A2T offers unique hibernation-optimized CAN operation with battery-backed RAM and legacy StellarisWare software compatibility - making it irreplaceable in field-deployed systems requiring long-term unattended operation on minimal power.
Availability
LM3S2608-EQC50-A2T is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, remote environmental monitoring, and PLC I/O modules requiring stable component supply and long-lifecycle support.
Supply support for LM3S2608-EQC50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The Stellaris LM3S series was designed specifically for cost-sensitive, real-time embedded applications requiring integrated connectivity (CAN, UART, I²C), analog sensing, and ultra-low-power hibernation - targeting industrial automation and automotive subsystems before the Tiva C transition.
FAQ
What is the maximum operating frequency of the LM3S2608-EQC50-A2T?
The LM3S2608-EQC50-A2T operates at a maximum system clock frequency of 50 MHz, achieved via its internal PLL locked to an external crystal or precision oscillator. This frequency applies to both the Cortex-M3 core and peripheral bus clock domains, ensuring deterministic timing for real-time control loops and high-speed serial communication. The LM3S2608-EQC50-A2T maintains full specification compliance-including ADC accuracy and CAN bit timing-at this rated speed under industrial temperature conditions (–40°C to +105°C).
Does the LM3S2608-EQC50-A2T support hibernation with RTC and battery-backed memory?
Yes, the LM3S2608-EQC50-A2T includes a dedicated hibernation module supporting RTC operation, wake-up on alarm or external GPIO, and retention of 2 KB of SRAM powered by an external VBAT supply. The hibernation current is specified at <1.9 µA with RTC enabled, allowing multi-year operation on CR2032 coin cells. This functionality is fully implemented in silicon and documented in Section 6 of the SPMS046I datasheet. The LM3S2608-EQC50-A2T uses this feature for energy-constrained remote monitoring and automotive body control applications.
What interfaces does the LM3S2608-EQC50-A2T provide for industrial communication?
The LM3S2608-EQC50-A2T integrates one Controller Area Network (CAN 2.0A/B) controller, two UARTs (with IrDA/SIR support), one SSI (SPI-compatible), and one I²C interface - all accessible via multiplexed GPIO pins. These interfaces enable direct connection to industrial fieldbuses, sensor networks, and human-machine interfaces without external level translators or protocol bridges. The LM3S2608-EQC50-A2T's CAN module includes 32 message objects and hardware acceptance filtering, making it suitable for distributed control systems in harsh EMI environments.
Is the LM3S2608-EQC50-A2T pin-compatible with other Stellaris devices?
The LM3S2608-EQC50-A2T uses a 100-pin LQFP (EQC) package shared across multiple LM3S family members, including LM3S811, LM3S8962, and LM3S9B92 - enabling partial hardware reuse in design families. However, peripheral pin mappings differ between variants; for example, CAN0RX/TX are fixed to PA0/PA1 on LM3S2608-EQC50-A2T but may appear on alternate pins in other models. Always consult the specific device datasheet's "Signal Descriptions" section before assuming interchangeability. The LM3S2608-EQC50-A2T's pinout is defined in TI SPMS046I pages 168–172.
What development tools and software support are available for the LM3S2608-EQC50-A2T?
Texas Instruments provided full StellarisWare Peripheral Driver Library, Code Composer Studio v5.x integration, and IAR Embedded Workbench support for the LM3S2608-EQC50-A2T during its active lifecycle. Evaluation kits such as the EK-LM3S2608 included JTAG debugging, onboard USB-to-UART bridge, and preloaded demo firmware. Though TI discontinued new development support after transitioning to Tiva C, legacy StellarisWare remains publicly available and functional for maintenance of deployed LM3S2608-EQC50-A2T systems.
LM3S2608-EQC50-A2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- Stellaris® ARM® Cortex®-M3S 2000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S2608-EQC50-A2T FAQ
1.How can I place an order for LM3S2608-EQC50-A2T through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S2608-EQC50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S2608-EQC50-A2T reliable?
The price and inventory of LM3S2608-EQC50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2608-EQC50-A2T is usually 5 days.
3.What payment methods are accepted for LM3S2608-EQC50-A2T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2608-EQC50-A2T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S2608-EQC50-A2T?
LM3S2608-EQC50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S2608-EQC50-A2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S2608-EQC50-A2T?
For technical support, including LM3S2608-EQC50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2608-EQC50-A2T requirements.
6.How does Aetrix verify that LM3S2608-EQC50-A2T is sourced from the original manufacturer or authorized distributors?
All LM3S2608-EQC50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2608-EQC50-A2T meets industry standards.
7.What is the process for return or replacement of LM3S2608-EQC50-A2T?
All LM3S2608-EQC50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2608-EQC50-A2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S2608-EQC50-A2T part is unused and in its original packaging.
Return procedure for LM3S2608-EQC50-A2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S2608-EQC50-A2T Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

