My Inquiry
My Account
Texas Instruments LM3S2608-IBZ50-A2
- Part No.:
- LM3S2608-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S2608-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,672
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S2608-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN, UART, I2C, SSI, ADC (10-bit, 1 MSPS), and hibernation module. It operates at 50 MHz and supports industrial motor control and embedded automation systems requiring real-time deterministic response.
For engineers reviewing the LM3S2608-IBZ50-A2 datasheet, LM3S2608-IBZ50-A2 pinout, LM3S2608-IBZ50-A2 application, or LM3S2608-IBZ50-A2 equivalent, key selection criteria include its 50 MHz CPU clock, CAN 2.0B interface, hibernation mode with RTC and battery-backed memory, and QFP-100 package compatibility for space-constrained industrial controllers.
Technical Context
The LM3S2608-IBZ50-A2 implements the ARM Cortex-M3 core with NVIC, SysTick, MPU, and bit-band addressing - enabling deterministic interrupt latency under 12 cycles and memory protection for safety-critical firmware. Its peripheral set includes dual UARTs with IrDA support, two SSI modules for SPI/SSI/Microwire, and an I2C master/slave controller compliant with SMBus v2.0.
Hardware timing control is provided by eight 16/32-bit general-purpose timers (GPTMs), a watchdog timer, and a dedicated hibernation module with RTC, battery management, and 2 KB of battery-backed SRAM. The ADC features four sample sequencers, hardware averaging, and internal temperature sensor readout - all accessible without CPU intervention via DMA or processor-triggered sampling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 @ 50 MHz - delivers 1.25 DMIPS/MHz for real-time control loops with sub-μs interrupt response. |
| Flash Memory | 256 KB on-chip flash - supports in-application programming (IAP) and secure code storage with erase/write cycle endurance >10k. |
| SRAM | 64 KB on-chip SRAM - includes 2 KB hibernation-mode-retained memory for state preservation during ultra-low-power sleep. |
| ADC | 10-bit, 1 MSPS SAR ADC with 8-channel input and 4 independent sample sequencers - enables simultaneous analog monitoring of motor phase currents and temperature sensors. |
| CAN Interface | CAN 2.0B-compliant controller with 32 message objects - supports robust fieldbus communication in automotive and industrial networks without external transceiver logic. |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard PCB assembly processes and thermal management for 1.2 W typical power dissipation. |
| Hibernation Module | Integrated hibernation controller with RTC, battery backup, and wake-on-RTC-match or GPIO - reduces system standby current to 1.7 μA. |
Pinout & Package
LM3S2608-IBZ50-A2 is housed in a 100-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, JEDEC MS-026AC compliant. Pin functions are defined per TI SPMS046I datasheet Rev I, Section 5.1 and Figure 5-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital (3.3 V), analog (3.3 V), and core (1.2 V) supplies - require separate decoupling for noise-sensitive ADC and PLL operation. |
| GND, GNDA, GNDC | Ground returns | Analog, digital, and core ground planes must be partitioned and joined at single point near regulator to minimize coupling. |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO banks | Configurable as inputs/outputs with slew-rate control, pull-up/down, and edge-triggered interrupts - support peripheral function multiplexing (e.g., UART0 on PA0/PA1). |
| USB0VBUS, USB0ID, USB0DP, USB0DM | USB 2.0 Full-Speed interface | On-chip PHY supports device-only mode; VBUS sensing enables automatic enumeration and suspend/resume detection. |
| CAN0RX, CAN0TX | CAN 2.0B physical layer interface | Direct connection to external CAN transceiver (e.g., SN65HVD230); no level-shifting required for 3.3 V logic compatibility. |
| HIB, RTCCLK, HIBRST | Hibernation control signals | Enable deep-sleep entry, RTC clock source selection (external 32.768 kHz crystal or internal oscillator), and reset assertion during wake-up. |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-M3 core with NVIC | Enables <12-cycle interrupt latency and priority-based nested handling - critical for motor commutation timing and fault response. |
| Hibernation module with RTC | Reduces system idle power to 1.7 μA while maintaining timekeeping and retaining 2 KB SRAM - extends battery life in remote sensor nodes. |
| Dual CAN 2.0B controllers | Supports redundant bus architectures or multi-node diagnostics - eliminates need for external CAN protocol accelerators in vehicle subsystems. |
| Hardware ADC sequencers & averaging | Permits autonomous sampling of up to 8 analog channels with 4x hardware averaging - improves signal-to-noise ratio without CPU overhead. |
| Multiple serial interfaces (2×UART, 2×SSI, I2C) | Allows concurrent communication with motor drivers (UART), position encoders (SSI), and environmental sensors (I2C) - simplifies system-level interconnect. |
Applications
| Industrial Motor Control | Building Automation Controller |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors with real-time current sensing and PWM generation. IC Role / Device Role / Timing Role: Central controller executing FOC algorithms, managing gate driver timing, and communicating status over CAN bus. Use Value: Deterministic 50 MHz Cortex-M3 execution and integrated hibernation enable rapid start-up and energy-efficient standby between operational cycles. | Use Scenario: Distributed HVAC zone controller interfacing with thermostats, damper actuators, and CO₂ sensors via I2C and UART. IC Role / Device Role / Timing Role: System-on-chip host managing sensor polling, actuator sequencing, and network reporting via CAN or RS-485 (with external transceiver). Use Value: On-chip 10-bit ADC and dual UARTs eliminate external signal conditioning and level-shifting components - reducing BOM count and board area. |
| Remote Telemetry Node | Programmable Logic Controller (PLC) I/O Module |
Use Scenario: Battery-powered field sensor collecting temperature, humidity, and vibration data for wireless transmission via cellular or LoRa gateway. IC Role / Device Role / Timing Role: Low-power data acquisition engine using hibernation mode, RTC wake-up, and autonomous ADC sampling. Use Value: 1.7 μA hibernate current and battery-backed 2 KB SRAM preserve configuration and last-read values across multi-day power outages. | Use Scenario: DIN-rail mounted I/O expansion module converting discrete 24 V DC inputs to CANopen or Modbus RTU messages. IC Role / Device Role / Timing Role: Protocol bridge and digital I/O manager with configurable debounce, edge detection, and cyclic redundancy checking. Use Value: Integrated CAN controller and GPIO with programmable slew rate reduce external logic and improve EMC robustness in electrically noisy factory environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S2965-IQC50-A2 | Same Cortex-M3 core, 512 KB flash, 96 KB SRAM, identical peripheral set and pinout - higher memory capacity variant in same LQFP-100 package. | Preferred where firmware image size exceeds 256 KB or additional RAM is needed for complex protocol stacks (e.g., full TCP/IP). | Select when future firmware growth or multi-protocol support requires headroom beyond LM3S2608-IBZ50-A2's 256 KB flash limit. |
| Tiva C TM4C123GH6PM | Successor family with enhanced peripherals (USB OTG, Ethernet MAC), 80 MHz operation, and improved ADC performance - not pin-compatible; requires PCB redesign. | Targeted at next-generation designs needing USB device/host capability or higher computational throughput. | Choose for new designs requiring extended lifecycle support and TI's ongoing Tiva C software ecosystem - not a drop-in replacement. |
Compared with LM3S2608-IBZ50-A2, LM3S2965-IQC50-A2 offers direct pin-and-code compatibility with doubled memory, while TM4C123GH6PM provides architectural upgrades at the cost of layout changes and firmware adaptation - making LM3S2608-IBZ50-A2 optimal for legacy-stable, cost-sensitive industrial control deployments.
Availability
LM3S2608-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, building automation systems, and remote telemetry nodes requiring stable component supply and long-term obsolescence management.
Supply support for LM3S2608-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies - serving industrial, automotive, and consumer markets with high-reliability silicon and comprehensive design resources.
The Stellaris LM3S series was engineered for deterministic real-time control in resource-constrained embedded systems - emphasizing low-latency interrupt response, integrated analog/motor control peripherals, and ultra-low-power hibernation for battery-operated and energy-conscious applications.
FAQ
What is the maximum operating frequency of the LM3S2608-IBZ50-A2?
The LM3S2608-IBZ50-A2 operates at a maximum CPU clock frequency of 50 MHz, derived from an internal PLL that accepts input from either the main oscillator (4–25 MHz crystal) or internal precision oscillator. This frequency is specified across the full industrial temperature range (–40°C to +85°C) and 3.0–3.6 V supply voltage, ensuring consistent real-time performance in demanding environments.
Does the LM3S2608-IBZ50-A2 include a hardware CAN controller?
Yes, the LM3S2608-IBZ50-A2 integrates a CAN 2.0B-compliant controller with 32 message objects, supporting both standard and extended frame formats. It handles bit timing, error detection, and message arbitration in hardware - requiring only an external CAN transceiver (e.g., SN65HVD230) for physical layer connectivity. No firmware-based CAN stack is needed for basic operation.
What power-saving modes does the LM3S2608-IBZ50-A2 support?
The LM3S2608-IBZ50-A2 supports Sleep, Deep-Sleep, and Hibernation modes. Hibernation achieves 1.7 μA typical current draw while retaining RTC operation and 2 KB of SRAM. Wake-up sources include RTC match, external GPIO, and CAN activity - enabling responsive yet energy-efficient operation in battery-powered applications.
Is the LM3S2608-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
The LM3S2608-IBZ50-A2 uses a 100-pin LQFP package shared with several LM3S family members, including LM3S2965-IQC50-A2. Pin compatibility is confirmed for identical package variants (e.g., -IBZ50 vs -IQC50), but functional pin mapping must be verified per device-specific datasheet - especially for peripheral multiplexing and power/ground pin assignments.
What development tools are supported for the LM3S2608-IBZ50-A2?
The LM3S2608-IBZ50-A2 is supported by TI's Code Composer Studio IDE, Keil MDK-ARM, and IAR Embedded Workbench. Hardware debugging uses JTAG/SWD via LM Flash Programmer or Stellaris ICDI-based debug probes. TI's StellarisWare Peripheral Driver Library provides production-ready drivers for all on-chip peripherals used in LM3S2608-IBZ50-A2 firmware development.
LM3S2608-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 2000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S2608-IBZ50-A2 FAQ
1.How can I place an order for LM3S2608-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S2608-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S2608-IBZ50-A2 reliable?
The price and inventory of LM3S2608-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2608-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S2608-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2608-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S2608-IBZ50-A2?
LM3S2608-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S2608-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S2608-IBZ50-A2?
For technical support, including LM3S2608-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2608-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S2608-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S2608-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2608-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S2608-IBZ50-A2?
All LM3S2608-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2608-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S2608-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S2608-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S2608-IBZ50-A2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
