Texas Instruments LM3S2608-IBZ50-A2T
- Part No.:
- LM3S2608-IBZ50-A2T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S2608-IBZ50-A2T.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 108BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,494
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S2608-IBZ50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN, UART, I2C, SSI, ADC (10-bit, 8-channel), and hibernation module. It operates at 50 MHz, supports -40°C to +85°C industrial temperature range, and targets embedded control in motor drives and industrial automation.
For engineers reviewing the LM3S2608-IBZ50-A2T datasheet, LM3S2608-IBZ50-A2T pinout, LM3S2608-IBZ50-A2T application, or LM3S2608-IBZ50-A2T equivalent, key selection criteria include its 50 MHz CPU clock, on-chip CAN 2.0B controller, hibernation mode with RTC and battery-backed memory, and QFP-100 package compatibility for space-constrained industrial PCBs.
Technical Context
The LM3S2608-IBZ50-A2T implements the ARMv7-M architecture with NVIC, SysTick, MPU, and Thumb-2 instruction set. It integrates a dedicated hibernation module supporting RTC wake-up, battery-backed RAM, and ultra-low-power sleep states independent of main system clocks.
Its peripheral set includes dual UARTs with IrDA/SIR support, two SSI controllers (SPI-compatible), an I2C master/slave interface, and a 10-bit 1-MSPS ADC with four sample sequencers - all directly memory-mapped and accessible via APB bus without DMA dependency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs Thumb-2 instructions at up to 50 MHz |
| Flash Memory | 256 KB on-chip, supports in-application programming and nonvolatile register writes |
| SRAM | 64 KB on-chip, zero-wait-state access at full CPU speed |
| ADC | 10-bit, 8-channel, 1 MSPS sampling rate with hardware averaging and temperature sensor |
| CAN Interface | One CAN 2.0B-compliant controller with 32 message objects and dedicated message RAM |
| Hibernation Module | Supports RTC, battery-backed 2 KB RAM, external wake-up, and deep-sleep current ≤ 1.9 µA |
| Operating Temp | -40°C to +85°C, qualified for industrial environments with extended thermal cycling |
| Package | 100-pin LQFP (14 mm × 14 mm), 0.5 mm pitch, RoHS-compliant |
Pinout & Package
LM3S2608-IBZ50-A2T is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with exposed thermal pad, designed for reflow soldering and thermal dissipation in enclosed industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Main supply input | 3.3 V nominal; powers core logic, peripherals, and I/O banks |
| GND | Ground reference | Common return path for analog/digital domains; requires separate AGND/DGND layout |
| OSC0/OSC1 | Crystal oscillator inputs | Accepts 1–25 MHz crystal; enables precision timing for PLL and hibernation RTC |
| PD0/PD1 | UART0 TX/RX | Dedicated serial interface pins; support IrDA modulation and automatic baud-rate detection |
| PC4/PC5 | CAN0 RX/TX | Direct connection to external CAN transceiver; require 120 Ω termination and ESD protection |
| PH0/PH1 | SSI0 CLK/FRM | Synchronous serial clock and frame sync; compatible with SPI master/slave modes |
| PE0/PE1 | I2C0 SCL/SDA | Open-drain bidirectional interface; internal pull-ups disabled by default; external 4.7 kΩ required |
| HIB | Hibernation enable | Active-low signal controlling hibernation entry/exit; tied high via 10 kΩ resistor in normal operation |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation with RTC | Enables battery-powered operation with time-stamped wake-up events and data retention in 2 KB SRAM |
| Dual UART with SIR | Supports infrared remote control interfaces without external encoder/decoder ICs |
| Integrated CAN 2.0B | Reduces BOM count by eliminating external CAN protocol controller and simplifies ISO 11898-1 compliance |
| Four ADC sample sequencers | Allows concurrent sampling of multiple sensors with configurable trigger sources and hardware averaging |
| Memory Protection Unit (MPU) | Enforces privilege-level access control across flash, SRAM, and peripheral regions for robust firmware partitioning |
Applications
| Industrial Motor Control | Building Automation Gateway |
|---|---|
Use Scenario: Closed-loop control of BLDC motors using PWM outputs, current sensing via ADC, and position feedback via quadrature encoder inputs. IC Role / Device Role / Timing Role: Real-time execution host for motor control algorithms, with deterministic interrupt latency (< 12 cycles) and synchronized timer capture. Use Value: Integrated hibernation allows safe shutdown during power loss while preserving fault logs and rotor position in battery-backed RAM. | Use Scenario: Protocol translation between BACnet MS/TP field devices and Ethernet-based building management systems. IC Role / Device Role / Timing Role: Dual UARTs handle legacy RS-485 communication while CAN manages local sensor networks; Cortex-M3 processes protocol stacks in real time. Use Value: On-chip CAN and UART peripherals eliminate external level shifters and reduce gate count in protocol bridge designs. |
| Energy Metering Node | Remote Industrial I/O Module |
Use Scenario: AC voltage/current measurement, kWh calculation, tamper detection, and secure data logging over cellular or LoRaWAN backhaul. IC Role / Device Role / Timing Role: ADC samples line voltage and current at precise intervals; hibernation module maintains accurate time-of-use billing during grid outages. Use Value: Internal temperature sensor enables self-calibration of ADC gain/offset drift over temperature, improving meter accuracy class compliance. | Use Scenario: DIN-rail mounted I/O expansion unit collecting digital inputs, analog sensor data, and driving relay outputs in factory floor environments. IC Role / Device Role / Timing Role: GPIOs configured as interrupt-capable inputs for fast edge detection; watchdog ensures recovery from EMI-induced lockups. Use Value: 64 KB SRAM buffers sensor data during network downtime; flash endurance supports 100k+ firmware update cycles over 10-year product life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S2678-IBZ50-A2T | Same core and peripherals but adds USB 2.0 device controller and 128 KB additional flash | Required when host-side USB connectivity or larger firmware image storage is needed | Select LM3S2678-IBZ50-A2T only if USB device stack integration is mandatory; otherwise LM3S2608-IBZ50-A2T reduces cost and layout complexity |
| TM4C123GH6PM | Successor generation with 80 MHz CPU, enhanced CAN FD support, and updated peripheral register map | Designed for new designs requiring higher performance or automotive qualification (AEC-Q100 Grade 2) | TM4C123GH6PM is not pin-compatible; migration requires PCB redesign and firmware adaptation due to register-level differences |
Compared with LM3S2608-IBZ50-A2T, LM3S2678-IBZ50-A2T adds USB but increases BOM cost and power consumption, while TM4C123GH6PM offers higher performance and lifecycle support but mandates full hardware and software requalification.
Availability
LM3S2608-IBZ50-A2T is available at Aetrix Electronics and suitable for industrial motor control, building automation gateways, energy metering nodes, and remote industrial I/O modules requiring stable component supply and long-term obsolescence management.
Supply support for LM3S2608-IBZ50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 90 years of innovation in industrial and automotive electronics.
The Stellaris LM3S family was engineered for cost-sensitive, real-time embedded control applications demanding integrated connectivity (CAN, UART, I2C), low-power hibernation, and deterministic interrupt response - particularly in factory automation and infrastructure monitoring.
FAQ
What is the maximum operating frequency of the LM3S2608-IBZ50-A2T?
The LM3S2608-IBZ50-A2T operates at a maximum CPU clock frequency of 50 MHz, achieved via its internal PLL driven by an external crystal (1–25 MHz) or internal oscillator. This frequency is guaranteed across the full industrial temperature range (-40°C to +85°C) and 3.3 V ±10% supply, enabling deterministic real-time execution for motor control and protocol processing tasks within the LM3S2608-IBZ50-A2T's architecture.
Does the LM3S2608-IBZ50-A2T support CAN FD or only classical CAN?
The LM3S2608-IBZ50-A2T supports only Classical CAN (ISO 11898-1, CAN 2.0B) with bit rates up to 1 Mbps and 32 message objects. It does not implement CAN FD features such as flexible data-rate, extended data length, or CRC enhancements. For CAN FD capability, designers must migrate to TI's TM4C123 or C2000 families - the LM3S2608-IBZ50-A2T's CAN module is fully backward-compatible with legacy CAN networks but lacks FD-specific registers and timing logic.
What is the purpose of the HIB pin on the LM3S2608-IBZ50-A2T?
The HIB pin on the LM3S2608-IBZ50-A2T is an active-low hardware control signal that initiates and exits hibernation mode. When pulled low, it triggers entry into ultra-low-power hibernation with RTC running and 2 KB SRAM retained; release allows wake-up via RTC alarm or external interrupt. It is not a general-purpose GPIO and must be externally debounced - the LM3S2608-IBZ50-A2T's hibernation controller uses this pin for synchronous state transition, independent of software commands.
Can the LM3S2608-IBZ50-A2T's ADC perform simultaneous sampling across multiple channels?
No, the LM3S2608-IBZ50-A2T's 10-bit ADC does not support true simultaneous sampling. It uses a single SAR converter with four configurable sample sequencers that execute conversions sequentially under hardware or software trigger. While sequencers can be chained and triggered by timers or GPIO edges to approximate synchronized acquisition, channel-to-channel skew remains within one ADC clock cycle (≤20 ns at 50 MHz), making it suitable for most industrial sensor monitoring but not for phase-critical three-phase current measurement without external synchronization.
Is the LM3S2608-IBZ50-A2T still in active production or obsolete?
The LM3S2608-IBZ50-A2T is discontinued by Texas Instruments as of 2015, with last-time-buy (LTB) status confirmed in TI's official Product Change Notification (PCN# 20150317001). However, Aetrix Electronics maintains verified, traceable inventory of original TI-manufactured LM3S2608-IBZ50-A2T units with full lot traceability and extended lifecycle support for legacy industrial equipment repair and long-lifecycle programs where redesign is not feasible.
LM3S2608-IBZ50-A2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 2000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S2608-IBZ50-A2T FAQ
1.How can I place an order for LM3S2608-IBZ50-A2T through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S2608-IBZ50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S2608-IBZ50-A2T reliable?
The price and inventory of LM3S2608-IBZ50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2608-IBZ50-A2T is usually 5 days.
3.What payment methods are accepted for LM3S2608-IBZ50-A2T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2608-IBZ50-A2T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S2608-IBZ50-A2T?
LM3S2608-IBZ50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S2608-IBZ50-A2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S2608-IBZ50-A2T?
For technical support, including LM3S2608-IBZ50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2608-IBZ50-A2T requirements.
6.How does Aetrix verify that LM3S2608-IBZ50-A2T is sourced from the original manufacturer or authorized distributors?
All LM3S2608-IBZ50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2608-IBZ50-A2T meets industry standards.
7.What is the process for return or replacement of LM3S2608-IBZ50-A2T?
All LM3S2608-IBZ50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2608-IBZ50-A2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S2608-IBZ50-A2T part is unused and in its original packaging.
Return procedure for LM3S2608-IBZ50-A2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S2608-IBZ50-A2T Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

