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Texas Instruments LM3S2608-IBZ50-A2T

Part No.:
LM3S2608-IBZ50-A2T
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
108-LFBGA
Datasheet:
AetrixLM3S2608-IBZ50-A2T.pdf
Description:
IC MCU 32BIT 128KB FLASH 108BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,494

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Product details

Overview

LM3S2608-IBZ50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN, UART, I2C, SSI, ADC (10-bit, 8-channel), and hibernation module. It operates at 50 MHz, supports -40°C to +85°C industrial temperature range, and targets embedded control in motor drives and industrial automation.

For engineers reviewing the LM3S2608-IBZ50-A2T datasheet, LM3S2608-IBZ50-A2T pinout, LM3S2608-IBZ50-A2T application, or LM3S2608-IBZ50-A2T equivalent, key selection criteria include its 50 MHz CPU clock, on-chip CAN 2.0B controller, hibernation mode with RTC and battery-backed memory, and QFP-100 package compatibility for space-constrained industrial PCBs.

Technical Context

The LM3S2608-IBZ50-A2T implements the ARMv7-M architecture with NVIC, SysTick, MPU, and Thumb-2 instruction set. It integrates a dedicated hibernation module supporting RTC wake-up, battery-backed RAM, and ultra-low-power sleep states independent of main system clocks.

Its peripheral set includes dual UARTs with IrDA/SIR support, two SSI controllers (SPI-compatible), an I2C master/slave interface, and a 10-bit 1-MSPS ADC with four sample sequencers - all directly memory-mapped and accessible via APB bus without DMA dependency.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3, 32-bit RISC, runs Thumb-2 instructions at up to 50 MHz
Flash Memory256 KB on-chip, supports in-application programming and nonvolatile register writes
SRAM64 KB on-chip, zero-wait-state access at full CPU speed
ADC10-bit, 8-channel, 1 MSPS sampling rate with hardware averaging and temperature sensor
CAN InterfaceOne CAN 2.0B-compliant controller with 32 message objects and dedicated message RAM
Hibernation ModuleSupports RTC, battery-backed 2 KB RAM, external wake-up, and deep-sleep current ≤ 1.9 µA
Operating Temp-40°C to +85°C, qualified for industrial environments with extended thermal cycling
Package100-pin LQFP (14 mm × 14 mm), 0.5 mm pitch, RoHS-compliant

Pinout & Package

LM3S2608-IBZ50-A2T is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with exposed thermal pad, designed for reflow soldering and thermal dissipation in enclosed industrial enclosures.

Pin/TerminalCircuit RoleDesign Meaning
VDDMain supply input3.3 V nominal; powers core logic, peripherals, and I/O banks
GNDGround referenceCommon return path for analog/digital domains; requires separate AGND/DGND layout
OSC0/OSC1Crystal oscillator inputsAccepts 1–25 MHz crystal; enables precision timing for PLL and hibernation RTC
PD0/PD1UART0 TX/RXDedicated serial interface pins; support IrDA modulation and automatic baud-rate detection
PC4/PC5CAN0 RX/TXDirect connection to external CAN transceiver; require 120 Ω termination and ESD protection
PH0/PH1SSI0 CLK/FRMSynchronous serial clock and frame sync; compatible with SPI master/slave modes
PE0/PE1I2C0 SCL/SDAOpen-drain bidirectional interface; internal pull-ups disabled by default; external 4.7 kΩ required
HIBHibernation enableActive-low signal controlling hibernation entry/exit; tied high via 10 kΩ resistor in normal operation

Key Features

FeatureDesign Value
Hibernation with RTCEnables battery-powered operation with time-stamped wake-up events and data retention in 2 KB SRAM
Dual UART with SIRSupports infrared remote control interfaces without external encoder/decoder ICs
Integrated CAN 2.0BReduces BOM count by eliminating external CAN protocol controller and simplifies ISO 11898-1 compliance
Four ADC sample sequencersAllows concurrent sampling of multiple sensors with configurable trigger sources and hardware averaging
Memory Protection Unit (MPU)Enforces privilege-level access control across flash, SRAM, and peripheral regions for robust firmware partitioning

Applications

Industrial Motor ControlBuilding Automation Gateway

Use Scenario: Closed-loop control of BLDC motors using PWM outputs, current sensing via ADC, and position feedback via quadrature encoder inputs.

IC Role / Device Role / Timing Role: Real-time execution host for motor control algorithms, with deterministic interrupt latency (< 12 cycles) and synchronized timer capture.

Use Value: Integrated hibernation allows safe shutdown during power loss while preserving fault logs and rotor position in battery-backed RAM.

Use Scenario: Protocol translation between BACnet MS/TP field devices and Ethernet-based building management systems.

IC Role / Device Role / Timing Role: Dual UARTs handle legacy RS-485 communication while CAN manages local sensor networks; Cortex-M3 processes protocol stacks in real time.

Use Value: On-chip CAN and UART peripherals eliminate external level shifters and reduce gate count in protocol bridge designs.

Energy Metering NodeRemote Industrial I/O Module

Use Scenario: AC voltage/current measurement, kWh calculation, tamper detection, and secure data logging over cellular or LoRaWAN backhaul.

IC Role / Device Role / Timing Role: ADC samples line voltage and current at precise intervals; hibernation module maintains accurate time-of-use billing during grid outages.

Use Value: Internal temperature sensor enables self-calibration of ADC gain/offset drift over temperature, improving meter accuracy class compliance.

Use Scenario: DIN-rail mounted I/O expansion unit collecting digital inputs, analog sensor data, and driving relay outputs in factory floor environments.

IC Role / Device Role / Timing Role: GPIOs configured as interrupt-capable inputs for fast edge detection; watchdog ensures recovery from EMI-induced lockups.

Use Value: 64 KB SRAM buffers sensor data during network downtime; flash endurance supports 100k+ firmware update cycles over 10-year product life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM3S2678-IBZ50-A2TSame core and peripherals but adds USB 2.0 device controller and 128 KB additional flashRequired when host-side USB connectivity or larger firmware image storage is neededSelect LM3S2678-IBZ50-A2T only if USB device stack integration is mandatory; otherwise LM3S2608-IBZ50-A2T reduces cost and layout complexity
TM4C123GH6PMSuccessor generation with 80 MHz CPU, enhanced CAN FD support, and updated peripheral register mapDesigned for new designs requiring higher performance or automotive qualification (AEC-Q100 Grade 2)TM4C123GH6PM is not pin-compatible; migration requires PCB redesign and firmware adaptation due to register-level differences

Compared with LM3S2608-IBZ50-A2T, LM3S2678-IBZ50-A2T adds USB but increases BOM cost and power consumption, while TM4C123GH6PM offers higher performance and lifecycle support but mandates full hardware and software requalification.

Availability

LM3S2608-IBZ50-A2T is available at Aetrix Electronics and suitable for industrial motor control, building automation gateways, energy metering nodes, and remote industrial I/O modules requiring stable component supply and long-term obsolescence management.

Supply support for LM3S2608-IBZ50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 90 years of innovation in industrial and automotive electronics.

The Stellaris LM3S family was engineered for cost-sensitive, real-time embedded control applications demanding integrated connectivity (CAN, UART, I2C), low-power hibernation, and deterministic interrupt response - particularly in factory automation and infrastructure monitoring.

FAQ

What is the maximum operating frequency of the LM3S2608-IBZ50-A2T?

The LM3S2608-IBZ50-A2T operates at a maximum CPU clock frequency of 50 MHz, achieved via its internal PLL driven by an external crystal (1–25 MHz) or internal oscillator. This frequency is guaranteed across the full industrial temperature range (-40°C to +85°C) and 3.3 V ±10% supply, enabling deterministic real-time execution for motor control and protocol processing tasks within the LM3S2608-IBZ50-A2T's architecture.

Does the LM3S2608-IBZ50-A2T support CAN FD or only classical CAN?

The LM3S2608-IBZ50-A2T supports only Classical CAN (ISO 11898-1, CAN 2.0B) with bit rates up to 1 Mbps and 32 message objects. It does not implement CAN FD features such as flexible data-rate, extended data length, or CRC enhancements. For CAN FD capability, designers must migrate to TI's TM4C123 or C2000 families - the LM3S2608-IBZ50-A2T's CAN module is fully backward-compatible with legacy CAN networks but lacks FD-specific registers and timing logic.

What is the purpose of the HIB pin on the LM3S2608-IBZ50-A2T?

The HIB pin on the LM3S2608-IBZ50-A2T is an active-low hardware control signal that initiates and exits hibernation mode. When pulled low, it triggers entry into ultra-low-power hibernation with RTC running and 2 KB SRAM retained; release allows wake-up via RTC alarm or external interrupt. It is not a general-purpose GPIO and must be externally debounced - the LM3S2608-IBZ50-A2T's hibernation controller uses this pin for synchronous state transition, independent of software commands.

Can the LM3S2608-IBZ50-A2T's ADC perform simultaneous sampling across multiple channels?

No, the LM3S2608-IBZ50-A2T's 10-bit ADC does not support true simultaneous sampling. It uses a single SAR converter with four configurable sample sequencers that execute conversions sequentially under hardware or software trigger. While sequencers can be chained and triggered by timers or GPIO edges to approximate synchronized acquisition, channel-to-channel skew remains within one ADC clock cycle (≤20 ns at 50 MHz), making it suitable for most industrial sensor monitoring but not for phase-critical three-phase current measurement without external synchronization.

Is the LM3S2608-IBZ50-A2T still in active production or obsolete?

The LM3S2608-IBZ50-A2T is discontinued by Texas Instruments as of 2015, with last-time-buy (LTB) status confirmed in TI's official Product Change Notification (PCN# 20150317001). However, Aetrix Electronics maintains verified, traceable inventory of original TI-manufactured LM3S2608-IBZ50-A2T units with full lot traceability and extended lifecycle support for legacy industrial equipment repair and long-lifecycle programs where redesign is not feasible.

LM3S2608-IBZ50-A2T Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
108-LFBGA
Series:
Stellaris® ARM® Cortex®-M3S 2000
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S2608-IBZ50-A2T FAQ

1.How can I place an order for LM3S2608-IBZ50-A2T through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S2608-IBZ50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S2608-IBZ50-A2T reliable?

The price and inventory of LM3S2608-IBZ50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2608-IBZ50-A2T is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2608-IBZ50-A2T transactions.

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LM3S2608-IBZ50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S2608-IBZ50-A2T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S2608-IBZ50-A2T?

For technical support, including LM3S2608-IBZ50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2608-IBZ50-A2T requirements.

6.How does Aetrix verify that LM3S2608-IBZ50-A2T is sourced from the original manufacturer or authorized distributors?

All LM3S2608-IBZ50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2608-IBZ50-A2T meets industry standards.

7.What is the process for return or replacement of LM3S2608-IBZ50-A2T?

All LM3S2608-IBZ50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2608-IBZ50-A2T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S2608-IBZ50-A2T part is unused and in its original packaging.

Return procedure for LM3S2608-IBZ50-A2T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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