My Inquiry
My Account
Texas Instruments LM3S2616-IQR50-A0
- Part No.:
- LM3S2616-IQR50-A0
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
LM3S2616-IQR50-A0.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,091
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S2616-IQR50-A0 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, 12-bit ADC (8-channel), and dual UARTs. It operates at up to 50 MHz and supports hibernation mode with RTC and battery-backed memory for low-power embedded control in motor drives and industrial automation.
For engineers reviewing the LM3S2616-IQR50-A0 datasheet, LM3S2616-IQR50-A0 pinout, LM3S2616-IQR50-A0 application, or LM3S2616-IQR50-A0 equivalent, key selection criteria include its integrated CAN interface, hibernation module with RTC, 50 MHz operation, and QFP-100 package compatibility with legacy Stellaris designs.
Technical Context
The LM3S2616-IQR50-A0 implements the ARM Cortex-M3 core with NVIC, SysTick, and MPU, supporting Thumb-2 instruction set and deterministic interrupt latency down to 12 cycles. Its system-level peripherals include a hibernation module with battery-backed RAM, real-time clock, and wake-up sources including external pins and RTC match events.
It integrates a μDMA controller with 32 channels supporting memory-peripheral transfers, plus analog subsystem with hardware averaging and temperature sensor. The CAN module complies with ISO 11898-1 and supports both standard and extended frame formats with programmable bit timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, Harvard architecture |
| Max Clock Frequency | 50 MHz - enables real-time motor control loop execution within 20 ns resolution |
| Flash Memory | 256 KB - sufficient for bootloader + application firmware with field-upgrade capability |
| SRAM | 64 KB - supports multi-threaded RTOS operation and data buffering for CAN/UART traffic |
| ADC Resolution | 12-bit - provides 1 LSB = ~2.44 mV @ 10 V full-scale for precision sensor interfacing |
| CAN Interface | One CAN 2.0A/B controller - supports 1 Mbit/s baud rate and message filtering via 32 FIFOs |
| Hibernation Mode | RTC + 2 KB battery-backed SRAM - retains state during power loss with <1 µA current draw |
Pinout & Package
LM3S2616-IQR50-A0 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, RoHS-compliant, and thermal pad exposed on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital (3.3 V), analog (3.3 V), and core (1.2 V) rails - require separate decoupling per domain |
| GND, GNDA, GNDC | Ground returns | Analog/digital/core ground separation minimizes noise coupling into ADC and PLL paths |
| PA0–PA7, PB0–PB7, etc. | GPIO ports A–G | Configurable as digital I/O, alternate function (UART/CAN/I2C), or analog input - each port has lockable commit register |
| CAN0RX / CAN0TX | CAN physical layer interface | Differential receive/transmit signals - require external transceiver (e.g., SN65HVD230) for bus connection |
| USB0VBUS, USB0ID, etc. | USB device interface | Full-speed (12 Mbps) USB 2.0 device-only support - no host capability |
| HIBRST, HIBACK | Hibernation module control | Reset assertion and acknowledgment for hibernate entry/exit - synchronized with RTC alarm |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module with RTC | Enables ultra-low-power operation (<1 µA) while maintaining timekeeping and retaining 2 KB of SRAM across main power loss |
| Integrated CAN 2.0A/B Controller | Reduces BOM count by eliminating external CAN protocol handler; supports 32 message objects and programmable bit timing |
| μDMA Controller (32 channels) | Offloads CPU from peripheral data movement - enables zero-wait-state transfers between ADC, UART, and memory |
| 12-bit ADC with Hardware Averaging | Improves effective resolution to ~13.5 bits via 16-sample averaging - reduces need for external signal conditioning |
| ROM-based Bootloader | Provides in-field firmware update capability over UART/USB without requiring external programmer or debug interface |
Applications
| Industrial Motor Control | Automotive Body Control Module |
|---|---|
Use Scenario: Closed-loop control of BLDC motors using PWM outputs, current sensing via ADC, and CAN-based command feedback. IC Role / Device Role / Timing Role: Real-time MCU executing FOC algorithm at 10 kHz, managing gate drivers, and communicating status over CAN bus. Use Value: Integrated CAN and hibernation enable seamless sleep/wake transitions during vehicle ignition-off periods while preserving motor position state. | Use Scenario: Centralized control of door locks, window lifts, lighting, and HVAC actuators in 12 V automotive systems. IC Role / Device Role / Timing Role: System controller coordinating multiple LIN/CAN sub-nodes, monitoring switch inputs, and driving relay/LED loads. Use Value: 64 KB SRAM supports concurrent task scheduling for safety-critical diagnostics and non-safety functions without external memory. |
| Smart Energy Metering | Factory Automation Gateway |
Use Scenario: Residential electricity meter with tamper detection, pulse counting, and time-of-use tariff calculation. IC Role / Device Role / Timing Role: Data acquisition MCU sampling voltage/current transformers, computing RMS values, and storing billing logs in flash. Use Value: On-chip RTC with hibernation ensures accurate time-stamping of energy events during AC power interruptions. | Use Scenario: Protocol translator bridging Modbus RTU field devices to Ethernet/IP or MQTT cloud interfaces. IC Role / Device Role / Timing Role: Edge node aggregating sensor data from RS-485 networks and forwarding via UART-to-WiFi bridge. Use Value: Dual UARTs with FIFO and DMA allow simultaneous full-duplex communication with multiple serial slaves without CPU overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S2678-IQR50-A0 | Same core and package, but adds Ethernet MAC + PHY interface and increases SRAM to 96 KB | Suitable for wired industrial networking where LAN connectivity is required | Select when Ethernet is mandatory; otherwise LM3S2616-IQR50-A0 offers lower cost and power |
| TMS570LS0432PZT | ARM Cortex-R4F, ASIL-B certified, 192 KB flash, 64 KB RAM, dual-lockstep cores, no CAN FD | Targeted at functional safety applications (e.g., automotive ADAS sensors) | Choose only if ISO 26262 compliance is required; LM3S2616-IQR50-A0 lacks safety certification |
Compared with LM3S2616-IQR50-A0, LM3S2678-IQR50-A0 adds Ethernet at higher power and cost, while TMS570LS0432PZT delivers safety-certified redundancy at expense of legacy peripheral compatibility and toolchain continuity.
Availability
LM3S2616-IQR50-A0 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart metering, and factory automation gateways requiring stable component supply and long-term lifecycle support.
Supply support for LM3S2616-IQR50-A0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and consumer markets since 1930.
The Stellaris LM3S series was designed as the first ARM Cortex-M3-based microcontroller family for cost-sensitive, real-time embedded applications requiring integrated connectivity and low-power operation.
FAQ
What is the operating temperature range of the LM3S2616-IQR50-A0?
The LM3S2616-IQR50-A0 is rated for industrial temperature operation from –40°C to +105°C. This range is validated across all core peripherals including the CAN controller, ADC, and hibernation module. The device meets this specification under full load at maximum frequency (50 MHz) with appropriate PCB thermal design. LM3S2616-IQR50-A0 maintains timing accuracy and flash retention within these limits per TI SPMS047H datasheet Section 6.3.6.
Does the LM3S2616-IQR50-A0 support USB device functionality?
Yes, the LM3S2616-IQR50-A0 includes a full-speed USB 2.0 device controller compliant with USB Specification Revision 2.0. It supports control, interrupt, bulk, and isochronous transfer types, and integrates USB PHY transceivers. The LM3S2616-IQR50-A0 does not support USB host mode or OTG. USB enumeration and descriptor handling are supported in StellarisWare driver library v2.1.0.895.
How many CAN message objects does the LM3S2616-IQR50-A0 support?
The LM3S2616-IQR50-A0 supports 32 individually configurable CAN message objects, each with maskable identifier filtering, direction control (TX/RX), and priority assignment. These objects are managed via the CAN Message Object RAM and accessed through the CAN Message Object interface registers. LM3S2616-IQR50-A0 uses this structure to implement efficient mailbox-style messaging without CPU polling, as documented in Section 15.3.1 of SPMS047H.
Is there a ROM-based bootloader on the LM3S2616-IQR50-A0?
Yes, the LM3S2616-IQR50-A0 contains a factory-programmed ROM bootloader that supports firmware updates over UART and USB interfaces. The bootloader validates image integrity via checksum before programming flash and supports secure boot disable via GPIO strap. LM3S2616-IQR50-A0's bootloader is accessible without JTAG and remains active even after user code execution begins, enabling field upgrades without debug hardware.
What debug interfaces are supported by the LM3S2616-IQR50-A0?
The LM3S2616-IQR50-A0 supports IEEE 1149.1 JTAG and SWD (Serial Wire Debug) interfaces for boundary scan, flash programming, and real-time debugging. Both interfaces share the same physical pins (TCK, TMS, TDI, TDO, nTRST, SWCLK, SWDIO). The device implements ARM CoreSight debug architecture with breakpoints, watchpoints, and trace support via TPIU. LM3S2616-IQR50-A0 debug capabilities are fully compatible with TI Code Composer Studio v6.x and IAR Embedded Workbench.
LM3S2616-IQR50-A0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-LQFP
- Series:
- Stellaris® ARM® Cortex®-M3S 2000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, I2C, IrDA, QEI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 33
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 6x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S2616-IQR50-A0 FAQ
1.How can I place an order for LM3S2616-IQR50-A0 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S2616-IQR50-A0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S2616-IQR50-A0 reliable?
The price and inventory of LM3S2616-IQR50-A0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2616-IQR50-A0 is usually 5 days.
3.What payment methods are accepted for LM3S2616-IQR50-A0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2616-IQR50-A0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S2616-IQR50-A0?
LM3S2616-IQR50-A0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S2616-IQR50-A0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S2616-IQR50-A0?
For technical support, including LM3S2616-IQR50-A0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2616-IQR50-A0 requirements.
6.How does Aetrix verify that LM3S2616-IQR50-A0 is sourced from the original manufacturer or authorized distributors?
All LM3S2616-IQR50-A0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2616-IQR50-A0 meets industry standards.
7.What is the process for return or replacement of LM3S2616-IQR50-A0?
All LM3S2616-IQR50-A0 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2616-IQR50-A0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S2616-IQR50-A0 part is unused and in its original packaging.
Return procedure for LM3S2616-IQR50-A0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S2616-IQR50-A0 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
