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Texas Instruments LM3S2620-IBZ25-A2
- Part No.:
- LM3S2620-IBZ25-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S2620-IBZ25-A2.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
LM3S2620-IBZ25-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, 8-channel 10-bit ADC, and hibernation module for ultra-low-power operation. It operates at up to 50 MHz and supports industrial motor control, embedded automation, and battery-backed sensor nodes.
For engineers reviewing the LM3S2620-IBZ25-A2 datasheet, LM3S2620-IBZ25-A2 pinout, LM3S2620-IBZ25-A2 application, or LM3S2620-IBZ25-A2 equivalent, key selection criteria include its integrated CAN interface, hibernation current of 1.7 µA, 8-channel ADC resolution, and QFP-100 package compatibility with industrial temperature range (–40°C to +85°C).
Technical Context
The LM3S2620-IBZ25-A2 implements the ARM Cortex-M3 core with Thumb-2 instruction set, NVIC with 64 interrupt lines, and SysTick timer. It integrates a dedicated hibernation module with RTC, battery-backed RAM, and wake-up on external event or time match.
Peripherals include one CAN 2.0A/B controller, two UARTs, two SSI modules, one I²C interface, eight general-purpose timers (including RTC-capable GPTM), and analog comparators. Clock management supports multiple PLL configurations and deep-sleep mode entry via WFI/WFE instructions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs Thumb-2 instructions at up to 50 MHz |
| Flash Memory | 256 KB on-chip flash with 128-bit wide bus; enables in-application programming and secure firmware updates |
| SRAM | 64 KB on-chip SRAM with parity protection; supports real-time data buffering and stack allocation |
| CAN Interface | One CAN 2.0A/B controller with 32 message objects; handles arbitration, filtering, and error handling without CPU intervention |
| Hibernate Current | 1.7 µA typical with RTC running from external crystal; enables multi-year battery life in remote monitoring systems |
| ADC | 8-channel 10-bit SAR ADC with 1 MSPS sample rate and hardware sequencer; supports simultaneous sampling for motor phase current sensing |
| Package | 100-pin LQFP (14 mm × 14 mm), RoHS-compliant, industrial temperature grade (–40°C to +85°C) |
| Operating Voltage | 2.25 V to 2.75 V core supply; allows direct connection to single-cell Li-ion or dual-cell alkaline power rails |
Pinout & Package
LM3S2620-IBZ25-A2 is housed in a 100-pin Low-Profile Quad Flat Package (LQFP) with 0.5 mm pitch, thermal pad exposed on underside for enhanced heat dissipation in enclosed industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Core, analog, and digital power supplies | Separate 2.25–2.75 V domains isolate noise-sensitive analog circuits from digital switching transients |
| GND, GNDA, GNDC | Analog, digital, and core ground returns | Dedicated ground planes reduce coupling between high-speed digital logic and precision ADC references |
| PD0–PD7, PE0–PE7, PF0–PF4, etc. | GPIO pins with multiplexed peripheral functions | Each port supports configurable slew rate, drive strength, and pull-up/down; many pins are 5-V tolerant on input |
| CAN0RX / CAN0TX | CAN physical layer interface signals | Dedicated differential pair routed internally to CAN controller; requires external transceiver for bus connection |
| HIBERNATE | Hibernation module enable and status | Active-low signal controlling entry/exit from hibernation; asserts during wake-up to synchronize system reset |
| RTCCLK | Real-time clock crystal input | Accepts 32.768 kHz external crystal for accurate timekeeping during hibernation with ±20 ppm stability |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module with RTC | Enables sub-2 µA sleep current while maintaining calendar time and wake-on-alarm-critical for battery-powered field sensors |
| Integrated CAN 2.0B Controller | Offloads protocol handling (bit timing, arbitration, retransmission) from CPU, reducing firmware complexity in automotive and industrial networks |
| 8-Channel 10-Bit ADC with Hardware Sequencer | Supports synchronized sampling across multiple channels for motor control current/voltage measurement without software overhead |
| ARM Cortex-M3 Core with NVIC | Delivers deterministic interrupt latency (<12 cycles) and prioritized vectoring-essential for real-time motion control loops |
| Flash Programming via SWD/JTAG | Allows field firmware updates using standard debug interfaces without requiring external programming hardware |
| Peripheral Multiplexing on GPIO | Enables flexible board layout by assigning UART, SSI, I²C, or PWM to shared pins-reducing PCB layer count in space-constrained designs |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers and pump drives using hall-effect or encoder feedback. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM generation, current sensing via ADC, and CAN-based command interface. Use Value: Integrated hibernation enables standby mode with <2 µA draw; CAN controller reduces MCU load during network communication. | Use Scenario: Central body controller managing door locks, window lifts, mirror adjustment, and lighting via CAN bus. IC Role / Device Role / Timing Role: CAN node endpoint with message filtering, low-power wake-on-CAN, and GPIO-driven actuator drivers. Use Value: Hibernation current of 1.7 µA meets OEM quiescent current requirements; 100-pin LQFP provides sufficient I/O for multi-function integration. |
| Battery-Powered Sensor Node | Programmable Logic Controller (PLC) I/O Module |
Use Scenario: Remote environmental monitor logging temperature, humidity, and vibration data every 15 minutes, transmitting via CAN or UART to gateway. IC Role / Device Role / Timing Role: Data acquisition hub with RTC-triggered wake-up, ADC sampling, and hibernation between measurements. Use Value: 1.7 µA hibernate current extends AA battery life beyond 5 years; internal 32.768 kHz RTC calibration eliminates need for external oscillator. | Use Scenario: DIN-rail mounted I/O expansion module converting discrete inputs/outputs to CANopen or proprietary CAN protocol. IC Role / Device Role / Timing Role: Protocol translator and digital I/O conditioner with galvanically isolated inputs and relay/mosfet outputs. Use Value: On-chip CAN controller handles bit timing and error recovery autonomously; 64 KB SRAM buffers protocol stack and I/O state tables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S2965-IQC50-A2 | Same Cortex-M3 core, 512 KB flash, 96 KB SRAM, identical peripherals and pinout; higher memory density | Preferred where firmware complexity or data logging depth exceeds 256 KB flash capacity | Select when future firmware growth or OTA update partitioning requires >256 KB code space |
| TMS570LS0432PZT | ARM Cortex-R4F safety-certified core, dual-lockstep execution, 3 MB flash, no hibernation module, different CAN implementation (dual CAN) | Targeted at ASIL-B automotive safety applications; lacks ultra-low-power hibernation capability | Choose only if functional safety certification (ISO 26262) is mandatory; not suitable for battery-life-critical designs |
Compared with LM3S2620-IBZ25-A2, LM3S2965-IQC50-A2 offers scalable memory without changing PCB layout, while TMS570LS0432PZT trades hibernation capability for safety features-making it unsuitable for energy-constrained deployments but necessary for certified automotive ECUs.
Availability
LM3S2620-IBZ25-A2 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and battery-powered sensor nodes requiring stable component supply and long-term manufacturability.
Supply support for LM3S2620-IBZ25-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions since 1930.
The Stellaris LM3S family was designed as the first ARM Cortex-M3-based microcontroller line for cost-sensitive industrial and automotive applications, emphasizing integration, low-power operation, and CAN-ready connectivity.
FAQ
What is the maximum operating frequency of the LM3S2620-IBZ25-A2?
The LM3S2620-IBZ25-A2 operates at a maximum system clock frequency of 50 MHz. This is achieved using an internal PLL that multiplies the input crystal or oscillator frequency. The ARM Cortex-M3 core executes Thumb-2 instructions at this rate, enabling real-time control loops and fast peripheral response. All timing specifications-including ADC conversion time, UART baud rate accuracy, and CAN bit timing-are validated at this 50 MHz condition.
Does the LM3S2620-IBZ25-A2 support in-system programming via UART or USB?
No, the LM3S2620-IBZ25-A2 does not support in-system programming via UART or USB. Firmware updates require JTAG or SWD debug interface access using tools such as TI's ICDI-based debuggers or third-party CMSIS-DAP adapters. The device lacks a ROM-based bootloader for serial programming; all flash programming must be performed through the debug port or via application-level flash write routines executed from SRAM.
What is the hibernation current specification for the LM3S2620-IBZ25-A2?
The hibernation current for the LM3S2620-IBZ25-A2 is 1.7 µA typical at 25°C with the internal RTC running from a 32.768 kHz external crystal and battery-backed RAM enabled. This value assumes VDD = 2.5 V and all non-hibernate peripherals disabled. Measured under these conditions, it enables multi-year operation on coin-cell batteries in wireless sensor applications where periodic wake-up and data transmission are required.
Is the LM3S2620-IBZ25-A2 pin-compatible with other Stellaris LM3S devices?
The LM3S2620-IBZ25-A2 is pin-compatible with other 100-pin LQFP Stellaris devices in the LM3S2xxx series, including LM3S2965-IQC50-A2 and LM3S2730-IQC50-A2. Identical pin mapping for power, ground, GPIO, CAN, UART, SSI, I²C, and reset signals allows drop-in replacement where flash/SRAM size differences do not impact firmware footprint. However, it is not compatible with 64-pin or 144-pin variants due to differing pin counts and peripheral allocations.
What development tools are officially supported for the LM3S2620-IBZ25-A2?
Texas Instruments officially supports Keil MDK-ARM, IAR Embedded Workbench for ARM, and TI's Code Composer Studio v5.x for LM3S2620-IBZ25-A2 firmware development. Debugging uses JTAG or SWD via TI's XDS100v2/v3 or ICDI-based launchpads. StellarisWare Peripheral Driver Library and example projects-including CAN echo, ADC sampling, and hibernation wakeup-are provided in the official SDK and validated against the LM3S2620-IBZ25-A2 silicon revision.
LM3S2620-IBZ25-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 2000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S2620-IBZ25-A2 FAQ
1.How can I place an order for LM3S2620-IBZ25-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S2620-IBZ25-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S2620-IBZ25-A2 reliable?
The price and inventory of LM3S2620-IBZ25-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2620-IBZ25-A2 is usually 5 days.
3.What payment methods are accepted for LM3S2620-IBZ25-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2620-IBZ25-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S2620-IBZ25-A2?
LM3S2620-IBZ25-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S2620-IBZ25-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S2620-IBZ25-A2?
For technical support, including LM3S2620-IBZ25-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2620-IBZ25-A2 requirements.
6.How does Aetrix verify that LM3S2620-IBZ25-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S2620-IBZ25-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2620-IBZ25-A2 meets industry standards.
7.What is the process for return or replacement of LM3S2620-IBZ25-A2?
All LM3S2620-IBZ25-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2620-IBZ25-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S2620-IBZ25-A2 part is unused and in its original packaging.
Return procedure for LM3S2620-IBZ25-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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