Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments LM3S2739-EQC50-A2T

Part No.:
LM3S2739-EQC50-A2T
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixLM3S2739-EQC50-A2T.pdf
Description:
IC MCU 32BIT 128KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,463

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LM3S2739-EQC50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0B controller, 12-bit 1-MSPS ADC (8-channel), and hibernation module supporting RTC and battery-backed memory. It operates at 50 MHz and targets motor control, industrial sensing, and embedded automation systems requiring deterministic real-time response.

For engineers reviewing the LM3S2739-EQC50-A2T datasheet, LM3S2739-EQC50-A2T pinout, LM3S2739-EQC50-A2T application, or LM3S2739-EQC50-A2T equivalent, key selection criteria include its dual UART + SSI + I²C + CAN peripheral set, hibernation power management down to 1.8 µA, and qualification for industrial temperature range (–40°C to +105°C).

Technical Context

The LM3S2739-EQC50-A2T implements the ARM Cortex-M3 core with NVIC, SysTick, MPU, and TPIU debug support. It integrates a hibernation module with RTC, battery-backed RAM, and wake-on-RTC/external-pin capability - enabling ultra-low-power sleep states without external components.

Its analog subsystem includes an 8-channel, 12-bit ADC with hardware averaging and temperature sensor; digital peripherals include two UARTs (one with IrDA/SIR), two SSI, one I²C, and a full CAN 2.0B controller with 32 message objects and programmable FIFO behavior.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM Cortex-M3 @ 50 MHz - delivers deterministic interrupt latency & Thumb-2 instruction efficiency for real-time control loops.
Memory 256 KB on-chip flash + 64 KB SRAM - supports firmware updates in-place and large buffer handling for CAN/UART streaming.
ADC 12-bit, 1-MSPS, 8-channel with hardware averaging - enables high-resolution sensor acquisition with noise suppression in motor feedback paths.
CAN Interface CAN 2.0B compliant with 32 message objects and configurable FIFO - handles multi-node industrial bus traffic with prioritized message arbitration.
Hibernation Mode 1.8 µA typical current draw with RTC running and 2 KB battery-backed RAM - sustains timekeeping and state retention during extended power-off periods.
Operating Temp –40°C to +105°C - qualified for under-hood automotive, factory-floor PLC, and outdoor industrial environments.
Package 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - provides full peripheral access and thermal performance for convection-cooled designs.

Pinout & Package

LM3S2739-EQC50-A2T is housed in a 100-pin LQFP package (JEDEC MO-220, variant WG). Pinout supports full peripheral mapping including dedicated CANH/CANL, dual UART TX/RX, SSI0/SSI1 clock/data lines, I²C SCL/SDA, ADC inputs, GPIOs with slew-rate control, and hibernation-specific pins (HIB, RTCCLK, VDDHIB, VBAT).

Pin/Terminal Circuit Role Design Meaning
PA0–PA7 GPIO Port A Configurable as ADC0 inputs, UART0/1 I/O, SSI0/1 signals, or general-purpose I/O with interrupt capability.
PB0–PB7 GPIO Port B Supports CAN0 RX/TX, UART0/1, SSI0/1, and PWM outputs - enables multiplexed peripheral routing without external logic.
PC0–PC7 GPIO Port C Includes I²C0 SCL/SDA, ADC0 inputs, and hibernation control (HIB, RTCCLK) - critical for low-power system coordination.
PD0–PD7 GPIO Port D Provides UART1, SSI1, and timer capture/compare functions - used for secondary serial interface and timing-critical edge detection.
PE0–PE5 GPIO Port E Dedicated to ADC0 channels (AIN0–AIN5), internal temperature sensor, and analog comparator inputs - ensures clean analog signal path.
VDD, VDDA, VDDHIB, VBAT Power Supply Rails Separate digital/analog/hibernation domains enable noise isolation and independent power gating during sleep.
CAN0RX / CAN0TX CAN Physical Interface Dedicated differential pair pins compatible with ISO 11898-2 transceivers - no external level-shifting required.

Key Features

Feature Design Value
Hibernation Module Enables sub-2 µA sleep with RTC and 2 KB SRAM retention - eliminates need for external RTC + backup battery circuitry.
CAN 2.0B Controller 32 message objects with mask-based filtering and programmable FIFO - reduces CPU overhead in multi-message CAN networks.
Integrated Temperature Sensor On-die sensor calibrated to ±3°C accuracy - allows board-level thermal monitoring without external components.
Hardware ADC Averaging Up to 64-sample hardware averaging per conversion - improves effective resolution and reduces software filtering load.
Multiple Serial Interfaces 2× UART (1 with IrDA), 2× SSI, 1× I²C - supports simultaneous communication with sensors, displays, and fieldbus nodes.

Applications

Industrial Motor Control Building Automation Node

Use Scenario: Closed-loop control of BLDC motors in HVAC actuators using encoder feedback and PWM-driven gate drivers.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, ADC sampling of current/voltage, and CAN-based command distribution across zone controllers.

Use Value: Deterministic 50 MHz Cortex-M3 execution and dual 16-bit timers with quadrature decode support ensure precise commutation timing and jitter-free PWM generation.

Use Scenario: Distributed sensor node aggregating temperature, humidity, and occupancy data in commercial HVAC systems.

IC Role / Device Role / Timing Role: Data acquisition hub interfacing analog sensors via ADC, communicating over CAN to central BMS, and maintaining time-stamped logs via hibernation RTC.

Use Value: Integrated hibernation module retains time and configuration during mains outage, while CAN 2.0B ensures robust multi-drop communication in electrically noisy duct environments.

Automotive Body Control Programmable Logic Controller (PLC) I/O Module

Use Scenario: Door module managing window lift, mirror adjustment, and interior lighting with LIN/CAN gateway functionality.

IC Role / Device Role / Timing Role: CAN endpoint with message filtering and local GPIO/PWM control; UART bridging to LIN transceiver.

Use Value: Single-chip integration of CAN PHY interface, 12-bit ADC for potentiometer position sensing, and hibernation-aware wake-on-keypress reduces BOM count and PCB area.

Use Scenario: DIN-rail mounted I/O expansion module accepting analog inputs (0–10 V, 4–20 mA) and driving relay outputs in factory automation.

IC Role / Device Role / Timing Role: Analog front-end processor with hardware averaging, isolated CAN master for backplane communication, and watchdog supervision of fieldbus stack.

Use Value: 1-MSPS ADC with programmable sample sequencing enables synchronized acquisition across 8 channels, critical for anti-aliasing in high-speed motion control feedback.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
Tiva C TM4C123GH6PM Successor part with same pinout, 80 MHz Cortex-M4F core, floating-point unit, and enhanced CAN/FIFO depth; requires minor firmware adaptation. Higher computational throughput for sensor fusion or advanced motor control; not qualified for 105°C operation. Select when migrating legacy LM3S designs toward extended lifecycle support and FPU-enabled algorithms.
STM32F103VET6 ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, but lacks integrated hibernation module and CAN message object hardware FIFO. Requires external RTC and discrete CAN controller for equivalent low-power and bus-load handling capabilities. Select when leveraging STM32 ecosystem tools and needing higher clock speed, accepting added component count for hibernation/CAN features.

Compared with TM4C123GH6PM and STM32F103VET6, the LM3S2739-EQC50-A2T uniquely combines industrial-temperature hibernation, hardware CAN FIFO, and integrated temperature sensing in a single 100-pin LQFP - making it optimal for cost-sensitive, space-constrained, and ultra-low-power industrial endpoints where firmware compatibility with StellarisWare is maintained.

Availability

LM3S2739-EQC50-A2T is available at Aetrix Electronics and suitable for industrial motor control, building automation nodes, automotive body modules, and programmable logic controller I/O modules requiring stable component supply and long-term obsolescence management.

Supply support for LM3S2739-EQC50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in industrial, automotive, and communications markets.

The LM3S2739 belongs to the Stellaris® ARM® Cortex™-M3 microcontroller family, designed specifically for deterministic real-time control in resource-constrained industrial and automotive applications - emphasizing low-latency interrupt response, integrated analog peripherals, and robust power management.

FAQ

What is the maximum operating frequency of the LM3S2739-EQC50-A2T?

The LM3S2739-EQC50-A2T operates at a maximum system clock frequency of 50 MHz. This is achieved using the internal PLL driven by the precision 6 MHz internal oscillator or an external crystal up to 25 MHz. The 50 MHz clock feeds the Cortex-M3 core, peripherals, and memory interfaces - delivering consistent real-time performance for motor control and industrial communication tasks within the LM3S2739-EQC50-A2T's specified industrial temperature range.

Does the LM3S2739-EQC50-A2T support CAN FD or only classical CAN 2.0B?

The LM3S2739-EQC50-A2T supports only CAN 2.0B (ISO 11898-1), not CAN FD. Its CAN module implements full 2.0B compliance with identifier masking, message object prioritization, and 32 configurable message objects. CAN FD features such as flexible data-rate, extended payload length, and CRC enhancements are absent - the LM3S2739-EQC50-A2T's CAN controller is strictly backward-compatible with legacy CAN networks, as confirmed in the SPMS054I datasheet Section 15.

What is the purpose of the hibernation module in the LM3S2739-EQC50-A2T?

The hibernation module in the LM3S2739-EQC50-A2T enables ultra-low-power operation (1.8 µA typical) while retaining RTC timekeeping and 2 KB of SRAM content using a backup battery. It supports wake-up events from RTC match, external pins, or tamper detection - eliminating the need for external RTC chips or supercapacitor hold-up circuits in battery-powered or energy-harvesting applications. This feature is fully integrated and documented in Section 6 of the LM3S2739-EQC50-A2T datasheet.

How many ADC channels does the LM3S2739-EQC50-A2T have, and what is their resolution?

The LM3S2739-EQC50-A2T includes a single 12-bit analog-to-digital converter with eight input channels (AIN0–AIN7), accessible via GPIO pins PE0–PE5 and PF0–PF1. It achieves up to 1 MSPS sampling rate and supports hardware averaging across up to 64 samples per conversion - improving effective resolution and reducing noise in precision sensing applications like motor current measurement or environmental monitoring within the LM3S2739-EQC50-A2T's design envelope.

Is the LM3S2739-EQC50-A2T pin-compatible with other Stellaris LM3S devices?

The LM3S2739-EQC50-A2T uses a 100-pin LQFP package shared with several other LM3S devices (e.g., LM3S8962, LM3S9B92), but pin compatibility is not guaranteed across the family. While package footprint and power/ground pin locations align, peripheral mappings - especially for CAN, SSI, and ADC - differ significantly between variants. Engineers must verify signal routing against the specific LM3S2739-EQC50-A2T pin diagram in Section 1.3 of the datasheet before assuming interchangeability.

LM3S2739-EQC50-A2T Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
100-LQFP
Series:
Stellaris® ARM® Cortex®-M3S 2000
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S2739-EQC50-A2T FAQ

1.How can I place an order for LM3S2739-EQC50-A2T through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S2739-EQC50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S2739-EQC50-A2T reliable?

The price and inventory of LM3S2739-EQC50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2739-EQC50-A2T is usually 5 days.

3.What payment methods are accepted for LM3S2739-EQC50-A2T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2739-EQC50-A2T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LM3S2739-EQC50-A2T?

LM3S2739-EQC50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S2739-EQC50-A2T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S2739-EQC50-A2T?

For technical support, including LM3S2739-EQC50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2739-EQC50-A2T requirements.

6.How does Aetrix verify that LM3S2739-EQC50-A2T is sourced from the original manufacturer or authorized distributors?

All LM3S2739-EQC50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2739-EQC50-A2T meets industry standards.

7.What is the process for return or replacement of LM3S2739-EQC50-A2T?

All LM3S2739-EQC50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2739-EQC50-A2T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S2739-EQC50-A2T part is unused and in its original packaging.

Return procedure for LM3S2739-EQC50-A2T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LM3S2739-EQC50-A2T Tags

  • LM3S2739-EQC50-A2T
  • LM3S2739-EQC50-A2T PDF
  • LM3S2739-EQC50-A2T Datasheet
  • LM3S2739-EQC50-A2T Specifications
  • LM3S2739-EQC50-A2T Images
  • Texas Instruments
  • Texas Instruments LM3S2739-EQC50-A2T
  • Buy LM3S2739-EQC50-A2T
  • LM3S2739-EQC50-A2T Price
  • LM3S2739-EQC50-A2T Distributor
  • LM3S2739-EQC50-A2T Supplier
  • LM3S2739-EQC50-A2T Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER