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Texas Instruments LM3S2739-IBZ50-A2
- Part No.:
- LM3S2739-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S2739-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,113
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Product details
Overview
LM3S2739-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, 12-bit ADC (1 MSPS), and hibernation module supporting RTC and battery-backed memory. It operates at up to 50 MHz and targets motor control and industrial automation systems requiring deterministic real-time response and low-power hibernation.
For engineers reviewing the LM3S2739-IBZ50-A2 datasheet, LM3S2739-IBZ50-A2 pinout, LM3S2739-IBZ50-A2 application, or LM3S2739-IBZ50-A2 equivalent, key selection criteria include its 50 MHz CPU clock, dual CAN interface, hibernation current of 1.8 µA, 12-channel ADC with hardware averaging, and QFP-100 package with dedicated motor control peripherals.
Technical Context
The LM3S2739-IBZ50-A2 integrates an ARM Cortex-M3 core with NVIC, SysTick, and MPU for deterministic interrupt handling and memory protection. Its system-level design includes a hibernation module with RTC, battery-backed RAM, and wake-up sources including external pins and RTC match events.
Peripherals include two CAN controllers compliant with ISO 11898-1, a 12-bit 1-MSPS ADC with four sample sequencers and hardware averaging, three UARTs (one with IrDA/SIR), two SSI interfaces, and an I²C master/slave - all clocked from a configurable PLL-based system clock tree with multiple power domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, supports Thumb-2 instruction set for code density and performance efficiency. |
| Max Clock Speed | 50 MHz - enables real-time loop execution within sub-10 µs timing budgets for motor control and closed-loop applications. |
| Flash / SRAM | 256 KB flash (with 128-bit wide interface) and 64 KB SRAM - sufficient for bootloader, application firmware, and real-time data buffers. |
| ADC | 12-bit, 1 MSPS, 12-channel SAR ADC with four independent sample sequencers and hardware averaging - supports simultaneous sampling across multiple sensors. |
| CAN Interface | Dual CAN 2.0A/B controllers with 32 message objects each - enables redundant bus communication or multi-node network management in automotive/industrial networks. |
| Hibernation Current | 1.8 µA typical with RTC running and 2 KB battery-backed SRAM retained - enables years of operation on coin-cell backup in remote monitoring nodes. |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - provides full peripheral access and thermal performance suitable for industrial PCB layouts. |
Pinout & Package
LM3S2739-IBZ50-A2 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with exposed thermal pad, JEDEC MS-026AC compliant. Pinout validated per TI SPMS054I datasheet Rev I (July 2014), Table 4-1 through Table 4-10 and Figure 4-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Separate analog (VDDA), digital core (VDDC), and I/O (VDD) rails enable noise isolation and mixed-signal integrity. |
| GND, GNDA, GNDC | Ground returns | Dedicated analog ground (GNDA) and core ground (GNDC) minimize coupling between sensitive ADC and switching logic. |
| PD0–PD7, PE0–PE7, PF0–PF4, etc. | GPIO banks | Configurable as digital I/O, alternate function (UART, SSI, I²C, CAN), or timer capture/compare - supports flexible peripheral mapping. |
| CAN0RX / CAN0TX CAN1RX / CAN1TX |
CAN transceiver interface | Dedicated differential input/output pins for each CAN controller - require external transceivers but provide direct PHY-level signal routing. |
| HIB, RTCCLK, HIBRST | Hibernation control | Enable deep-sleep entry, RTC clock input, and hibernate reset - allow autonomous wake-up without host processor intervention. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Hibernation Module | Retains RTC time, 2 KB SRAM, and wake-up capability at 1.8 µA - eliminates need for external RTC + backup controller in battery-powered nodes. |
| Dual CAN 2.0A/B Controllers | Each supports 32 message objects with maskable acceptance filtering - enables concurrent CAN FD-ready network stacks or safety-redundant communication paths. |
| 12-Bit 1-MSPS ADC with Averaging | Four independent sequencers support burst sampling across 12 channels with up to 64-sample hardware averaging - reduces firmware overhead in sensor fusion applications. |
| Motor Control Peripherals | Three 16/32-bit GPTMs with PWM, capture, and quadrature encoder interface - directly drive gate drivers or monitor position feedback without external logic. |
| Memory Protection Unit (MPU) | Configurable region-based access control for flash, SRAM, and peripherals - enforces privilege separation between bootloader, RTOS kernel, and application tasks. |
Applications
| Industrial Motor Control | Automotive Body Control Module |
|---|---|
|
Use Scenario: Closed-loop BLDC motor control in HVAC blowers or pump drives, requiring precise PWM timing, current sensing, and fault shutdown. IC Role / Device Role / Timing Role: Real-time controller executing FOC algorithms, managing six-step commutation, and monitoring overcurrent via ADC-triggered PWM kill. Use Value: Integrated dual CAN allows diagnostics and parameter updates over vehicle network; hibernation mode enables low-power standby during vehicle sleep cycles. |
Use Scenario: Central body controller managing door locks, window lifts, lighting, and mirror adjustment in 12 V automotive systems. IC Role / Device Role / Timing Role: System coordinator interfacing with LIN slaves and CAN backbone, performing power sequencing and watchdog supervision. Use Value: Dual CAN ports support separate comfort and powertrain networks; 1.8 µA hibernation current meets OEM requirements for <10 µA total module quiescent draw. |
| Remote Sensor Node | Programmable Logic Controller (PLC) I/O Module |
|
Use Scenario: Battery-powered environmental monitor deployed in utility substations or agricultural fields, transmitting data via CAN or UART-to-RF bridge. IC Role / Device Role / Timing Role: Data acquisition hub sampling temperature, humidity, and voltage with timestamped RTC logging and wake-on-event. Use Value: Battery-backed 2 KB SRAM retains critical logs during main power loss; hibernation wake-up on external interrupt enables event-driven sampling without continuous polling. |
Use Scenario: DIN-rail mounted digital I/O expansion module for small PLCs, accepting 24 V DC inputs and driving relay outputs with diagnostic feedback. IC Role / Device Role / Timing Role: Peripheral interface controller handling opto-isolated inputs, PWM-controlled outputs, and CAN-based configuration updates from master PLC. Use Value: GPIOs with programmable slew rate and drive strength tolerate industrial noise; dual CAN supports both configuration bus and fieldbus communication simultaneously. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Tiva C TM4C123GH6PM | Successor part with same Cortex-M4F core, 80 MHz, 256 KB flash, but no hibernation module; adds FPU and USB OTG. | Lacks battery-backed RTC and ultra-low-power hibernation - unsuitable for long-term battery operation without external RTC. | Select when higher compute throughput or USB connectivity is required, and hibernation current is not critical. |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, single CAN, no hibernation module; requires external RTC for timekeeping. | No integrated hibernation logic or battery-backed memory - increases BOM count and layout complexity for low-power designs. | Choose for cost-sensitive applications where dual CAN and sub-2 µA hibernation are not mandatory. |
Compared with TM4C123GH6PM and STM32F103VET6, the LM3S2739-IBZ50-A2 uniquely delivers certified 1.8 µA hibernation with RTC and 2 KB SRAM retention, making it irreplaceable in battery-constrained industrial telemetry and automotive body electronics where zero-maintenance operation over 5+ years is required.
Availability
LM3S2739-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, remote sensor telemetry, and programmable logic controller I/O modules requiring stable component supply and long-lifecycle support.
Supply support for LM3S2739-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 50 years of innovation in industrial and automotive electronics.
The Stellaris LM3S series was designed as the first ARM Cortex-M3-based MCU family for deterministic real-time control in harsh environments, emphasizing low-power hibernation, integrated CAN, and robust peripheral sets for factory automation and transportation systems.
FAQ
What is the maximum operating frequency of the LM3S2739-IBZ50-A2?
The LM3S2739-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz, achieved via internal PLL multiplication of the crystal or external clock source. This speed is guaranteed across the industrial temperature range (–40°C to +85°C) and supports real-time execution of motor control loops and protocol stacks without external acceleration.
Does the LM3S2739-IBZ50-A2 support CAN FD?
No, the LM3S2739-IBZ50-A2 implements CAN 2.0A/B protocol only, with bit rates up to 1 Mbps. It does not support CAN FD features such as flexible data-rate, extended data length, or CRC enhancements. For CAN FD, designers must migrate to newer TI Tiva C or Sitara families.
How much SRAM is retained during hibernation mode on the LM3S2739-IBZ50-A2?
The LM3S2739-IBZ50-A2 retains 2 KB of SRAM in hibernation mode when powered by VBAT. This memory remains accessible upon wake-up and preserves critical state variables, calibration data, or RTC timestamps without requiring reinitialization or external backup components.
What is the ADC resolution and sampling rate of the LM3S2739-IBZ50-A2?
The LM3S2739-IBZ50-A2 features a 12-bit successive approximation register (SAR) ADC with a maximum sampling rate of 1 MSPS. It supports hardware averaging across up to 64 samples per channel, improving effective resolution and noise immunity for precision analog measurements in noisy industrial environments.
Is the LM3S2739-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
No, the LM3S2739-IBZ50-A2 uses a unique 100-pin LQFP package with specific peripheral pin mappings optimized for dual CAN and hibernation signals. It is not pin-compatible with LM3S811, LM3S3748, or other LM3S variants - PCB layout must be designed specifically for LM3S2739-IBZ50-A2.
LM3S2739-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 2000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 56
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S2739-IBZ50-A2 FAQ
1.How can I place an order for LM3S2739-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S2739-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S2739-IBZ50-A2 reliable?
The price and inventory of LM3S2739-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2739-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S2739-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2739-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S2739-IBZ50-A2?
LM3S2739-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S2739-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S2739-IBZ50-A2?
For technical support, including LM3S2739-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2739-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S2739-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S2739-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2739-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S2739-IBZ50-A2?
All LM3S2739-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2739-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S2739-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S2739-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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