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Texas Instruments LM3S2739-IBZ50-A2T

Part No.:
LM3S2739-IBZ50-A2T
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
108-LFBGA
Datasheet:
AetrixLM3S2739-IBZ50-A2T.pdf
Description:
IC MCU 32BIT 128KB FLASH 108BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,439

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Product details

Overview

LM3S2739-IBZ50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, dual 10-bit ADC (up to 1 MSPS), and hibernation module supporting RTC and battery-backed memory - deployed in industrial motor control and embedded automation systems requiring deterministic real-time response.

For engineers reviewing the LM3S2739-IBZ50-A2T datasheet, LM3S2739-IBZ50-A2T pinout, LM3S2739-IBZ50-A2T application, or LM3S2739-IBZ50-A2T equivalent, key selection criteria include its 50 MHz CPU clock, hibernation current of 1.8 µA, CAN interface compliance, dual ADC sample sequencing, and QFP-100 package compatibility with industrial temperature range (-40°C to +85°C).

Technical Context

The LM3S2739-IBZ50-A2T implements the ARMv7-M architecture with nested vectored interrupt controller (NVIC), memory protection unit (MPU), and SysTick timer - enabling deterministic interrupt latency under 12 cycles. Its hibernation module integrates a 32-bit RTC, battery-backed 2 KB SRAM, and wake-up sources including external pins and RTC match events.

Peripherals include two UARTs with IrDA support, two SSI modules, one I²C master/slave interface, and a dedicated CAN 2.0A/B controller with 32 message objects and programmable FIFO buffering - all accessible via APB bus with configurable clock gating for power optimization.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM Cortex-M3, 32-bit RISC, runs at up to 50 MHz - delivers 1.25 DMIPS/MHz for real-time deterministic execution.
Memory 256 KB on-chip flash (with 128-bit wide interface) and 64 KB SRAM - supports zero-wait-state operation at full speed.
ADC Dual 10-bit SAR ADCs, each with 8-channel analog input multiplexer and hardware averaging - achieves up to 1 MSPS aggregate sampling rate.
CAN Interface One CAN 2.0A/B-compliant controller with 32 message objects, programmable FIFO, and automatic retransmission - enables robust fieldbus communication in noisy environments.
Hibernation Mode Ultra-low-power state drawing 1.8 µA (typical) with RTC running and 2 KB battery-backed SRAM retained - extends battery life in remote monitoring nodes.
Package & Temp 100-pin LQFP (14 × 14 mm), industrial temperature range (–40°C to +85°C) - suitable for DIN-rail mounted controllers and factory-floor equipment.
Peripherals 2× UART (IrDA-capable), 2× SSI, 1× I²C, 6× PWM-capable timers, GPIO with interrupt-on-change - supports sensor fusion, motor drive control, and protocol bridging.

Pinout & Package

LM3S2739-IBZ50-A2T is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per TI SPMS054I datasheet Rev I (July 2014), with dedicated JTAG/SWD debug pins, CANH/CANL differential pair, and dual ADC input banks mapped to Port A and Port E.

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VDDC Power supply inputs Separate digital (VDD), analog (VDDA), and core (VDDC) rails - enable noise isolation between ADC and logic domains.
GND, GNDA, GNDC Ground returns Dedicated analog (GNDA) and core (GNDC) grounds - reduce coupling noise into sensitive analog circuits.
CAN0RX / CAN0TX CAN physical layer interface Differential receiver and transmitter pins for CAN0 peripheral - require external transceiver (e.g., SN65HVD230) for bus connection.
PA0–PA7, PE0–PE7 ADC input channels Two independent 8-channel analog input banks - support simultaneous sampling across dual ADC modules for phase-aligned measurements.
PD0–PD7, PF0–PF3 GPIO with interrupt capability Configurable as edge-triggered interrupt sources - used for emergency stop detection or encoder index pulse capture.
TCK, TMS, TDI, TDO, nSRST JTAG/SWD debug interface Standard 5-pin SWD/JTAG boundary-scan interface - enables full-speed debugging and flash programming without reset interruption.

Key Features

Feature Design Value
Hibernation Module Retains RTC time, 2 KB SRAM, and wake-up capability at 1.8 µA - eliminates need for external RTC + backup battery in portable industrial sensors.
Dual Independent ADCs Each with 8-channel mux, hardware averaging, and sequencer-based triggering - enables synchronized voltage/current sampling for motor phase control.
CAN 2.0A/B Controller 32 message objects, programmable FIFO, and automatic retransmission - reduces host CPU load in distributed control networks (e.g., PLC backplanes).
Peripheral Integration UARTs with IrDA encoding, SSI for SPI-compatible sensors, I²C for EEPROM/temperature sensors - minimizes external component count in compact designs.
Memory Protection Unit (MPU) Configurable region-based access control - enforces privilege separation between firmware layers in safety-critical applications.

Applications

Industrial Motor Control Remote Sensor Node

Use Scenario: Closed-loop control of 3-phase BLDC motors using space-vector PWM and real-time current feedback.

IC Role / Device Role / Timing Role: Real-time MCU executing FOC algorithm, sampling dual ADCs synchronously, generating PWM outputs, and communicating status over CAN bus.

Use Value: Deterministic 50 MHz Cortex-M3 execution and hardware-accelerated PWM timing ensure <1 µs jitter in gate drive signals - critical for torque ripple reduction.

Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and vibration data every 15 minutes.

IC Role / Device Role / Timing Role: Low-power system controller managing sensor polling, RTC-triggered wake-up, CAN-based data aggregation, and hibernation entry/exit.

Use Value: 1.8 µA hibernation current and integrated RTC extend battery life beyond 5 years on a single CR2032 cell - eliminating field maintenance.

Programmable Logic Controller (PLC) I/O Module Factory Automation Gateway

Use Scenario: DIN-rail mounted I/O expansion module interfacing with 16 digital inputs and 8 relay outputs in harsh factory environments.

IC Role / Device Role / Timing Role: Central controller handling input debouncing, output sequencing, CAN bus messaging, and watchdog supervision.

Use Value: Dual UARTs with IrDA support allow local configuration via handheld IR terminal, while CAN interface ensures interoperability with legacy PLC backplanes.

Use Scenario: Protocol translation gateway connecting Modbus RTU field devices to EtherNet/IP supervisory network.

IC Role / Device Role / Timing Role: Bridge processor running dual-stack firmware: Modbus slave over UART and EtherNet/IP device stack over external PHY.

Use Value: 64 KB SRAM provides sufficient buffer space for concurrent protocol stacks and packet queuing - avoiding frame loss during network congestion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LM3S2678-IBZ50-A2T Same Cortex-M3 core and package, but with 128 KB flash, 32 KB SRAM, no CAN controller, and only one ADC module. Suitable for cost-sensitive motor control where CAN is not required and code footprint is smaller. Select when CAN interface and dual ADC are unnecessary - reduces BOM cost by ~18% at volume.
TM4C123GH6PM Successor family with same pinout, 256 KB flash, 32 KB SRAM, enhanced CAN FD support, and USB OTG - requires firmware migration. Required for new designs needing USB connectivity, higher CAN bandwidth, or extended lifecycle support beyond 2025. Choose for long-term design continuity; LM3S2739-IBZ50-A2T remains viable for legacy replacement or cost-constrained brownfield upgrades.

Compared with LM3S2739-IBZ50-A2T, the LM3S2678-IBZ50-A2T trades CAN and ADC capability for lower cost, while TM4C123GH6PM offers USB, CAN FD, and extended support - making LM3S2739-IBZ50-A2T optimal for CAN-dependent industrial control where legacy compatibility and proven reliability are prioritized.

Availability

LM3S2739-IBZ50-A2T is available at Aetrix Electronics and suitable for industrial motor control, remote sensor nodes, PLC I/O modules, and factory automation gateways requiring stable component supply and long-term obsolescence management.

Supply support for LM3S2739-IBZ50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and wireless technologies - serving industrial, automotive, and consumer markets since 1930.

The Stellaris LM3S series was designed specifically for real-time industrial control applications demanding high integration, low-power hibernation, and deterministic peripheral response - with LM3S2739-IBZ50-A2T targeting CAN-based distributed automation systems.

FAQ

What is the maximum operating frequency of the LM3S2739-IBZ50-A2T?

The LM3S2739-IBZ50-A2T operates at a maximum CPU clock frequency of 50 MHz, as specified in the Texas Instruments SPMS054I datasheet. This frequency is achieved using the internal PLL with an external crystal or oscillator input, and all peripherals - including ADC, CAN, and timers - are fully functional at this speed without wait states. The LM3S2739-IBZ50-A2T maintains timing compliance across its industrial temperature range (–40°C to +85°C).

Does the LM3S2739-IBZ50-A2T support CAN FD?

No, the LM3S2739-IBZ50-A2T implements a CAN 2.0A/B controller compliant with ISO 11898-1:2003, supporting data rates up to 1 Mbps and standard/extended identifiers - but it does not support CAN FD features such as flexible data-rate switching or larger payload sizes. For CAN FD capability, TI recommends migrating to the TM4C123GH6PM, which retains pin compatibility and adds CAN FD support. The LM3S2739-IBZ50-A2T remains appropriate for legacy CAN 2.0 networks.

How much SRAM is available for application use in the LM3S2739-IBZ50-A2T?

LM3S2739-IBZ50-A2T provides 64 KB of on-chip SRAM, all accessible to the application without reservation for system use. Of this, 2 KB can be retained during hibernation mode when powered from VBAT, while the remaining 62 KB is active during normal operation. The memory map is contiguous and supports both stack and heap allocation, with MPU-enforced region protection available for safety-critical partitions. This SRAM capacity supports complex control algorithms and multi-protocol buffers in the LM3S2739-IBZ50-A2T.

What debug interfaces does the LM3S2739-IBZ50-A2T support?

The LM3S2739-IBZ50-A2T supports both JTAG and SWD (Serial Wire Debug) interfaces via dedicated pins (TCK, TMS, TDI, TDO, nSRST), enabling full-speed debugging, flash programming, and real-time trace using compatible tools like TI's ICDI-based LaunchPads or third-party J-Link adapters. SWD mode uses only two pins (SWDIO and SWCLK), reducing PCB routing complexity versus full JTAG. All debug functionality is implemented in silicon and requires no application firmware overhead - a key feature of the LM3S2739-IBZ50-A2T.

Is the LM3S2739-IBZ50-A2T still in production and supported by Texas Instruments?

Texas Instruments has discontinued marketing and new design-in support for the LM3S2739-IBZ50-A2T, with official product change notices issued in 2016. However, Aetrix Electronics maintains active inventory and extended lifecycle sourcing for this part, including traceable lots and full documentation (SPMS054I datasheet, StellarisWare driver library). The LM3S2739-IBZ50-A2T remains suitable for repair, replacement, and legacy production - backed by TI's original warranty terms and qualification data.

LM3S2739-IBZ50-A2T Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
108-LFBGA
Series:
Stellaris® ARM® Cortex®-M3S 2000
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S2739-IBZ50-A2T FAQ

1.How can I place an order for LM3S2739-IBZ50-A2T through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S2739-IBZ50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S2739-IBZ50-A2T reliable?

The price and inventory of LM3S2739-IBZ50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2739-IBZ50-A2T is usually 5 days.

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LM3S2739-IBZ50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S2739-IBZ50-A2T?

For technical support, including LM3S2739-IBZ50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2739-IBZ50-A2T requirements.

6.How does Aetrix verify that LM3S2739-IBZ50-A2T is sourced from the original manufacturer or authorized distributors?

All LM3S2739-IBZ50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2739-IBZ50-A2T meets industry standards.

7.What is the process for return or replacement of LM3S2739-IBZ50-A2T?

All LM3S2739-IBZ50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2739-IBZ50-A2T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S2739-IBZ50-A2T part is unused and in its original packaging.

Return procedure for LM3S2739-IBZ50-A2T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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