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Texas Instruments LM3S2739-IQC50-A2T
- Part No.:
- LM3S2739-IQC50-A2T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
LM3S2739-IQC50-A2T.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,660
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Product details
Overview
LM3S2739-IQC50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, 12-bit ADC (up to 1 MSPS), and hibernation module supporting RTC and battery-backed memory. It operates at 50 MHz and targets motor control, industrial automation, and embedded systems requiring low-power operation with real-time communication.
For engineers reviewing the LM3S2739-IQC50-A2T datasheet, LM3S2739-IQC50-A2T pinout, LM3S2739-IQC50-A2T application, or LM3S2739-IQC50-A2T equivalent, key selection criteria include its integrated CAN interface, hibernation power management, dual UARTs with IrDA support, SSI and I²C peripherals, and qualification for industrial temperature range (–40°C to +85°C).
Technical Context
The LM3S2739-IQC50-A2T implements the ARM Cortex-M3 core with NVIC, SysTick, MPU, and TPIU debug support. It integrates a hibernation module with RTC, battery-backed RAM, and wake-up sources including external pins and RTC match events.
Peripherals include one CAN controller compliant with ISO 11898-1, two UARTs (one with IrDA SIR), two SSI modules, two I²C interfaces, eight PWM outputs, four 32-bit GPTMs, and a 12-channel 12-bit ADC with hardware averaging and temperature sensor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 50 MHz max operation - enables deterministic real-time execution with Thumb-2 instruction set and low-latency interrupt handling. |
| Flash Memory | 256 KB on-chip flash - supports in-application programming (IAP) and secure firmware updates without external memory. |
| SRAM | 64 KB on-chip SRAM - sufficient for real-time control stacks, communication buffers, and sensor data processing. |
| ADC | 12-bit, 1 MSPS, 12-channel - delivers high-resolution analog sensing for motor current, voltage, and temperature monitoring. |
| CAN Interface | One CAN 2.0A/B controller with 32 message objects - enables robust fieldbus communication in industrial and automotive subsystems. |
| Hibernation Module | RTC + battery-backed 2 KB RAM + wake-on-RTC/external-pin - reduces system power to ~1.7 µA while retaining timekeeping and critical state. |
| Operating Temp | –40°C to +85°C - qualified for industrial environments without derating or thermal management overhead. |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard surface-mount assembly and offers full peripheral pin access. |
Pinout & Package
LM3S2739-IQC50-A2T is housed in a 100-pin LQFP package (JEDEC MO-152AC) with exposed thermal pad. Pin assignments are defined per the official TI LM3S2739 datasheet revision SPMS054I (July 2014), supporting full GPIO multiplexing across all peripherals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Dedicated domains for digital logic (VDD), analog (VDDA), and core (VDDC) - enable noise isolation and stable ADC/clock operation. |
| GND, GNDA, GNDC | Ground returns | Separate ground paths minimize coupling between analog, digital, and core circuits - critical for 12-bit ADC accuracy. |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO / peripheral mux pins | Multi-function pins support UART, SSI, I²C, CAN, PWM, and timer capture - configurable per application via register-based pin select. |
| USB0VBUS, USB0ID | USB host/device detection | Supports USB OTG functionality - allows dynamic role switching between host and device without external circuitry. |
| CAN0RX, CAN0TX | CAN physical layer interface | Differential pair routed to external transceiver - complies with ISO 11898-2 signaling requirements when paired with SN65HVD230 or equivalent. |
| HIB, RTCCLK, HIBRST | Hibernation control signals | Enable deep-sleep entry, RTC clock input, and hibernate reset - allow autonomous low-power operation without MCU intervention. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0A/B controller | 32 message objects with maskable acceptance filtering - eliminates need for external CAN protocol IC and reduces BOM count in distributed control nodes. |
| Hibernation module with RTC | Sub-µA retention mode with battery-backed RAM and calendar timekeeping - enables always-on monitoring in energy-constrained edge devices. |
| Dual UARTs with IrDA SIR support | One UART includes built-in serial infrared encoder/decoder - enables contactless configuration and diagnostics without external modulation ICs. |
| Hardware-accelerated PWM | Eight PWM generator blocks with fault protection and dead-band insertion - simplifies motor gate drive timing and improves reliability in BLDC/PMSM control. |
| On-chip temperature sensor | Calibrated ±3°C accuracy over –40°C to +85°C - provides system-level thermal monitoring without external sensors or calibration effort. |
| Memory Protection Unit (MPU) | Configurable region-based access control - enforces software partitioning for safety-critical tasks and prevents accidental memory corruption. |
Applications
| Industrial Motor Control | Building Automation Node |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC blowers and pumps using space-vector PWM and current feedback. IC Role / Device Role / Timing Role: Real-time motor controller executing FOC algorithms, managing CAN bus commands, and sampling ADC channels at 10 kHz. Use Value: Integrated PWM timers with dead-band generation and CAN messaging reduce external component count and ensure deterministic timing for torque ripple minimization. | Use Scenario: Distributed sensor node collecting temperature, humidity, and occupancy data, then reporting via CAN or UART to central building management system. IC Role / Device Role / Timing Role: Low-power system manager coordinating sensor reads, local decision logic, and scheduled CAN transmissions during active periods. Use Value: Hibernation mode with RTC wake-up enables hourly data uploads while consuming <2 µA average current - extends battery life to >5 years on coin cell. |
| Factory Floor PLC I/O Module | Medical Diagnostic Equipment Subsystem |
Use Scenario: Modular I/O expansion unit interfacing with 24 V DC sensors and actuators, communicating status and commands over industrial CAN network. IC Role / Device Role / Timing Role: Deterministic I/O processor handling GPIO interrupts, analog input scanning, and CAN frame assembly with timestamping. Use Value: 12-bit ADC with hardware averaging and dedicated analog supply rails deliver stable 12-bit resolution despite noisy factory EMI environment. | Use Scenario: Embedded subsystem in portable ultrasound or patient monitor performing front-panel button handling, display backlight control, and battery gauge telemetry. IC Role / Device Role / Timing Role: System supervisor managing power sequencing, watchdog supervision, and nonvolatile parameter storage during power cycles. Use Value: On-chip 256 KB flash with EEPROM emulation and 2 KB battery-backed RAM preserve calibration data and usage logs across unexpected shutdowns. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Tiva C TM4C123GH6PM | Successor part with same pinout, 80 MHz Cortex-M4F core, enhanced CAN, USB 2.0 OTG, and larger memory (256 KB flash/32 KB SRAM). | Requires updated toolchain and firmware migration; supports floating-point math and higher bandwidth USB. | Preferred for new designs needing higher performance or USB host capability; LM3S2739-IQC50-A2T remains viable for cost-sensitive CAN-only applications. |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash/64 KB SRAM, CAN 2.0B, but no hibernation module or integrated RTC battery backup. | Lacks sub-µA retention mode - requires external RTC and backup power circuitry for long-term timekeeping. | Consider when higher flash density and USB 2.0 FS are required, and ultra-low-power hibernation is not mandatory. |
Compared with TM4C123GH6PM and STM32F103VET6, the LM3S2739-IQC50-A2T offers unique integration of CAN, hibernation, and industrial temperature rating in a mature, production-proven platform - ideal for legacy-compatible upgrades or cost-optimized industrial nodes where USB or floating-point are unnecessary.
Availability
LM3S2739-IQC50-A2T is available at Aetrix Electronics and suitable for industrial motor control, building automation nodes, factory floor PLC I/O modules, and medical diagnostic equipment subsystems requiring stable component supply and long-term lifecycle support.
Supply support for LM3S2739-IQC50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and wireless technologies for industrial, automotive, and consumer applications.
The Stellaris LM3S series was designed as the first ARM Cortex-M3-based microcontroller family for industrial and real-time embedded systems - emphasizing integration of CAN, hibernation, and analog peripherals in a single chip.
FAQ
What is the maximum operating frequency of the LM3S2739-IQC50-A2T?
The LM3S2739-IQC50-A2T operates at a maximum CPU frequency of 50 MHz, as specified in the Texas Instruments SPMS054I datasheet. This speed is achieved using the internal PLL with an external crystal or oscillator input. The LM3S2739-IQC50-A2T maintains full peripheral functionality-including CAN, ADC, and PWM-at this frequency, with timing margins verified across the industrial temperature range (–40°C to +85°C).
Does the LM3S2739-IQC50-A2T support CAN FD or only classical CAN?
The LM3S2739-IQC50-A2T supports only classical CAN 2.0A/B (ISO 11898-1), not CAN FD. Its CAN controller implements 32 message objects with identifier masking and FIFO-style transmission, but lacks the variable bit rate, extended data length, and CRC enhancements of CAN FD. For CAN FD capability, designers should consider newer TI parts such as the TM4C129x series or automotive-grade C2000™ microcontrollers.
Is there an internal temperature sensor in the LM3S2739-IQC50-A2T?
Yes, the LM3S2739-IQC50-A2T includes an on-die temperature sensor calibrated to ±3°C accuracy over –40°C to +85°C. It connects directly to ADC channel 13 and requires no external components. The LM3S2739-IQC50-A2T datasheet provides conversion formulas and calibration constants in Section 11.3.7, enabling accurate junction temperature estimation for thermal management and safety monitoring.
What debug interfaces does the LM3S2739-IQC50-A2T support?
The LM3S2739-IQC50-A2T supports JTAG and SWD (Serial Wire Debug) interfaces for programming and real-time debugging. It includes full ARM CoreSight-compliant debug features: breakpoints, watchpoints, halt/resume control, and memory inspection. The LM3S2739-IQC50-A2T uses the standard 20-pin ARM JTAG connector layout, and TI's Stellaris ICDI and third-party tools like Segger J-Link are fully compatible.
How is hibernation mode configured and exited on the LM3S2739-IQC50-A2T?
Hibernation mode on the LM3S2739-IQC50-A2T is entered by writing to the HIBCTL register and asserting the HIBREQ bit, after configuring wake sources (e.g., RTC match or external pin). Exit occurs automatically on wake event - the LM3S2739-IQC50-A2T restores clocks and memory contents, then resumes execution from the point prior to hibernation. All configuration is documented in Section 6 of the SPMS054I datasheet.
LM3S2739-IQC50-A2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- Stellaris® ARM® Cortex®-M3S 2000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 56
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S2739-IQC50-A2T FAQ
1.How can I place an order for LM3S2739-IQC50-A2T through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S2739-IQC50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S2739-IQC50-A2T reliable?
The price and inventory of LM3S2739-IQC50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2739-IQC50-A2T is usually 5 days.
3.What payment methods are accepted for LM3S2739-IQC50-A2T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2739-IQC50-A2T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S2739-IQC50-A2T?
LM3S2739-IQC50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S2739-IQC50-A2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S2739-IQC50-A2T?
For technical support, including LM3S2739-IQC50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2739-IQC50-A2T requirements.
6.How does Aetrix verify that LM3S2739-IQC50-A2T is sourced from the original manufacturer or authorized distributors?
All LM3S2739-IQC50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2739-IQC50-A2T meets industry standards.
7.What is the process for return or replacement of LM3S2739-IQC50-A2T?
All LM3S2739-IQC50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2739-IQC50-A2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S2739-IQC50-A2T part is unused and in its original packaging.
Return procedure for LM3S2739-IQC50-A2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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