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Texas Instruments LM3S2911-IBZ50-A2

Part No.:
LM3S2911-IBZ50-A2
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
108-LFBGA
Datasheet:
AetrixLM3S2911-IBZ50-A2.pdf
Description:
IC MCU 32BIT 256KB FLASH 108BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,482

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Product details

Overview

LM3S2911-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 32 KB SRAM, integrated CAN 2.0B controller, hibernation module with RTC and battery-backed memory, and operates at up to 50 MHz. It targets industrial motor control and embedded automation systems requiring deterministic real-time response, low-power hibernation, and robust fieldbus connectivity.

For engineers reviewing the LM3S2911-IBZ50-A2 datasheet, LM3S2911-IBZ50-A2 pinout, LM3S2911-IBZ50-A2 application, or LM3S2911-IBZ50-A2 equivalent, key selection criteria include its 50 MHz CPU clock, CAN interface compliance, hibernation current of 1.7 µA, 12-bit ADC with 1 MSPS sampling, and QFP-100 package with verified pin mapping for industrial I/O expansion.

Technical Context

The LM3S2911-IBZ50-A2 implements the ARMv7-M architecture with NVIC supporting 48 configurable interrupts, SysTick timer, and MPU for memory protection. Its system-level design integrates a dedicated hibernation module with RTC, battery-backed RAM, and wake-up sources including external pins and RTC match events.

Peripherals include one CAN 2.0B controller with 32 message objects, two UARTs (one with IrDA/SIR), two SSI interfaces, one I²C master/slave, eight PWM-capable GPTM channels, and an analog comparator. Clock management supports multiple internal/external sources with PLL-based 50 MHz operation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3, 32-bit RISC, executes Thumb-2 instructions with deterministic interrupt latency
Max Clock Speed50 MHz - enables real-time control loops with sub-20 µs interrupt response and 25 ns instruction cycle time
Flash / SRAM256 KB flash / 32 KB SRAM - sufficient for standalone firmware with CAN protocol stack and hibernation state retention
CAN InterfaceOne CAN 2.0B controller with 32 message objects - supports full CAN bus arbitration, error handling, and bit rates up to 1 Mbps
Hibernation Current1.7 µA typical - allows battery-powered operation for months using coin-cell backup without external supervisor
ADC12-bit, 1 MSPS, 8-channel - supports high-fidelity motor current sensing and analog feedback acquisition in closed-loop drives
Package100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - provides full GPIO, peripheral pinout, and thermal performance for industrial PCB layouts

Pinout & Package

LM3S2911-IBZ50-A2 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with exposed thermal pad, JEDEC MS-026AC compliant, 14 mm × 14 mm body, 0.5 mm lead pitch, and RoHS-compliant finish.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDCPower supply inputsDigital core (VDD), analog (VDDA), and hibernation (VDDC) rails - require separate decoupling for noise isolation in mixed-signal operation
GND, GNDA, GNDCGround returnsSeparate digital, analog, and hibernation ground planes - essential for ADC accuracy and RTC stability during deep sleep
PD0–PD7, PE0–PE7, PF0–PF4GPIO banksConfigurable as digital I/O, UART/SSI/I²C/CAN signals, or PWM outputs - support peripheral multiplexing without external logic
PA0–PA7, PB0–PB7Analog/Timer inputsADC input channels and GPTM capture/compare pins - enable simultaneous motor phase voltage/current measurement and timing control
CAN0RX / CAN0TXCAN physical layer interfaceDedicated differential pair for ISO 11898-2 compliant transceiver connection - no software bit-banging required
HIB, RTCCLK, HIBRSTHibernation controlEnable hardware-controlled deep-sleep entry, external RTC clock input, and hibernation reset assertion - eliminate firmware overhead for low-power states

Key Features

FeatureDesign Value
Hibernation ModuleIntegrated RTC, battery-backed 2 KB RAM, and wake-on-RTC-match or external pin - enables autonomous sensor logging during power loss
CAN 2.0B Controller32 message objects with mask/filter, TX/RX FIFOs, and error counters - reduces host CPU load in automotive and industrial networks
Motor Control TimersEight 16-bit GPTM channels with PWM, capture, and quadrature encoder input - supports three-phase BLDC commutation and position tracking
Analog Subsystem12-bit ADC (1 MSPS, 8 ch), four analog comparators with programmable reference - enables overcurrent protection and analog threshold detection without external ICs
Debug InterfaceSWD/JTAG with TPIU trace port - permits real-time instruction tracing and non-intrusive debugging of time-critical ISR execution

Applications

Industrial Motor DrivesBuilding Automation Controllers

Use Scenario: Closed-loop control of 3-phase AC induction motors in HVAC variable-frequency drives.

IC Role / Device Role / Timing Role: Real-time execution of field-oriented control (FOC) algorithms, PWM generation, current sensing via ADC, and CAN-based supervisory communication.

Use Value: Deterministic 50 MHz Cortex-M3 execution ensures <5 µs loop jitter; integrated hibernation preserves fault logs during brownout events.

Use Scenario: Distributed HVAC zone controllers with temperature/humidity sensing and actuator control.

IC Role / Device Role / Timing Role: Sensor data acquisition, PID regulation, relay/valve actuation, and CAN bus integration into BACnet/IP gateways.

Use Value: Battery-backed RTC and 2 KB hibernation RAM retain setpoints and schedules during mains failure; CAN interface eliminates RS-485 transceivers.

Energy Metering GatewaysFactory Floor I/O Modules

Use Scenario: Smart electricity meter concentrators aggregating data from submeters via CAN or RS-485.

IC Role / Device Role / Timing Role: CAN message routing, time-stamped data buffering, secure firmware updates, and tamper-detection I/O monitoring.

Use Value: 256 KB flash stores dual-application images for A/B firmware updates; hibernation mode extends battery life beyond 10 years in sealed units.

Use Scenario: DIN-rail mounted remote I/O nodes collecting discrete/analog signals from PLC peripherals.

IC Role / Device Role / Timing Role: High-speed GPIO scanning, 12-bit analog input sampling, CAN bus node addressing, and watchdog-managed fail-safe shutdown.

Use Value: Eight GPTM channels support simultaneous PWM dimming, pulse counting, and encoder reading; 1.7 µA hibernation current meets IEC 61000-4-30 Class A requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TMS570LS0432PZTARM Cortex-R4F, 160 MHz, dual-core lockstep, ASIL-B certified, 384 KB flash, no hibernation moduleAutomotive safety-critical systems requiring ISO 26262 compliance; lacks battery-backed RTC and ultra-low-power sleep modesSelect when functional safety certification is mandatory; not suitable for long-term battery operation
STM32F303VCT6ARM Cortex-M4F, 72 MHz, FPU, 256 KB flash, 48 KB SRAM, no CAN 2.0B, no hibernation moduleCost-sensitive motor control with floating-point math; requires external RTC and backup capacitor for low-power retentionSelect for higher computational throughput and DSP capability; adds BOM cost for external hibernation support

Compared with LM3S2911-IBZ50-A2, TMS570LS0432PZT offers safety certification but sacrifices ultra-low-power hibernation, while STM32F303VCT6 delivers higher CPU performance and FPU but lacks integrated CAN 2.0B and battery-backed RTC - making LM3S2911-IBZ50-A2 uniquely suited for battery-aware industrial CAN nodes.

Availability

LM3S2911-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor drives, building automation controllers, energy metering gateways, and factory floor I/O modules requiring stable component supply across extended product lifecycles.

Supply support for LM3S2911-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and wireless technologies for industrial, automotive, and consumer markets.

The Stellaris LM3S family was designed specifically for deterministic real-time embedded control in resource-constrained industrial environments, emphasizing low-power hibernation, fieldbus integration (CAN/I²C/SSI), and robust peripheral sets for motor and sensor interfacing.

FAQ

What is the maximum operating frequency of the LM3S2911-IBZ50-A2?

The LM3S2911-IBZ50-A2 operates at a maximum CPU clock frequency of 50 MHz, achieved via its on-chip PLL driven by an internal 6 MHz oscillator or external crystal. This frequency is guaranteed across the full industrial temperature range (–40°C to +85°C) and supports real-time deterministic execution for motor control and automation tasks without overclocking or derating.

Does the LM3S2911-IBZ50-A2 include a CAN controller, and what version does it support?

Yes, the LM3S2911-IBZ50-A2 integrates a single CAN 2.0B-compliant controller with 32 message objects, full acceptance filtering, and bit rates up to 1 Mbps. It supports both standard (11-bit) and extended (29-bit) identifier formats, automatic retransmission, and error confinement - enabling direct connection to industrial CAN networks without external protocol translation.

What is the hibernation current specification for the LM3S2911-IBZ50-A2, and what features remain active?

The LM3S2911-IBZ50-A2 achieves a typical hibernation current of 1.7 µA when powered from VDDC with RTC enabled and 2 KB of battery-backed RAM retained. During hibernation, the RTC continues counting, wake-up events (RTC match or external pin) are monitored, and the hibernation module maintains register state - all without CPU or flash activity.

How much flash and SRAM memory does the LM3S2911-IBZ50-A2 provide?

The LM3S2911-IBZ50-A2 includes 256 KB of on-chip flash memory for program storage and 32 KB of SRAM for runtime variables and stack. Flash supports in-application programming (IAP) and sector erase; SRAM is zero-wait-state at 50 MHz and partitioned to support critical data retention during hibernation transitions.

Is the LM3S2911-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?

No, the LM3S2911-IBZ50-A2 is not pin-compatible with other LM3S devices due to unique peripheral mapping and package-specific signal assignments. Its 100-pin LQFP footprint and pin functions (e.g., dedicated CAN0RX/TX, hibernation control pins) are specific to the LM3S29xx series and require dedicated PCB layout - cross-referencing must be done at the schematic level, not package level.

LM3S2911-IBZ50-A2 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
108-LFBGA
Series:
Stellaris® ARM® Cortex®-M3S 2000
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S2911-IBZ50-A2 FAQ

1.How can I place an order for LM3S2911-IBZ50-A2 through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S2911-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S2911-IBZ50-A2 reliable?

The price and inventory of LM3S2911-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2911-IBZ50-A2 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2911-IBZ50-A2 transactions.

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LM3S2911-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S2911-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S2911-IBZ50-A2?

For technical support, including LM3S2911-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2911-IBZ50-A2 requirements.

6.How does Aetrix verify that LM3S2911-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?

All LM3S2911-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2911-IBZ50-A2 meets industry standards.

7.What is the process for return or replacement of LM3S2911-IBZ50-A2?

All LM3S2911-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2911-IBZ50-A2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S2911-IBZ50-A2 part is unused and in its original packaging.

Return procedure for LM3S2911-IBZ50-A2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LM3S2911-IBZ50-A2 Tags

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