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Texas Instruments LM3S2950-IBZ50-A2
- Part No.:
- LM3S2950-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S2950-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
LM3S2950-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, hibernation module with RTC and battery-backed memory, and operates at up to 50 MHz. It targets industrial motor control and embedded automation where deterministic real-time response, low-power hibernation, and robust fieldbus connectivity are required.
For engineers reviewing the LM3S2950-IBZ50-A2 datasheet, LM3S2950-IBZ50-A2 pinout, LM3S2950-IBZ50-A2 application, or LM3S2950-IBZ50-A2 equivalent, key selection criteria include its 50 MHz CPU clock, CAN interface compliance, hibernation current (≤1.7 µA), 10-bit 1-MSPS ADC, and QFP-100 package with verified JTAG/SWD debug support.
Technical Context
The LM3S2950-IBZ50-A2 implements the ARMv7-M architecture with NVIC-based interrupt handling, bit-band aliasing for atomic peripheral access, and MPU-enforced memory protection. Its system-level design integrates dedicated motor control peripherals including PWM generators with dead-band insertion and quadrature encoder input support.
Hardware-assisted CAN 2.0A/B communication uses a 32-message object RAM with programmable acceptance filtering and automatic retransmission. The hibernation module provides independent power domain control, RTC calendar/timekeeping, and 2 KB of battery-backed SRAM accessible during deep sleep - all configurable without waking the Cortex-M3 core.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, supports Thumb-2 instruction set and hardware divide |
| Max Clock Speed | 50 MHz - enables deterministic 20 ns instruction cycle time for real-time control loops |
| Flash / SRAM | 256 KB on-chip flash with 64-bit prefetch; 64 KB SRAM - sufficient for bootloader + application + CAN message buffers |
| CAN Interface | One CAN 2.0A/B controller with 32 message objects, programmable bit timing, and loopback test mode |
| Hibernation Current | ≤1.7 µA with RTC running - enables multi-year battery operation in remote sensor nodes |
| ADC | 10-bit, 1-MSPS SAR ADC with 8-channel analog mux and hardware sequencer |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard surface-mount assembly processes |
Pinout & Package
LM3S2950-IBZ50-A2 is housed in a 100-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad. Pin assignments follow TI's standardized Stellaris LM3S series layout, supporting full JTAG/SWD debug, dual CAN transceiver interfaces, and multiplexed GPIOs with peripheral function prioritization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VDDA / VDDC | Power supply inputs | Separate analog (VDDA), digital (VDD), and core (VDDC) rails enable noise isolation for ADC and PLL |
| PA0–PA7, PB0–PB7, etc. | GPIO banks A–G | Each bank supports alternate functions: UART, SSI, I²C, PWM, timer capture, and CAN TX/RX |
| CAN0RX / CAN0TX | CAN physical layer interface | Dedicated differential pair pins with internal pull-ups; require external CAN transceiver for bus connection |
| JTAG/SWD | Debug interface | Pins PA0–PA3 + PD0 + PD1 support both JTAG and SWD protocols - no mode pin required |
| HIB | Hibernation module control | Single pin controls hibernate entry/exit and monitors wake-up source (RTC, external, or GPIO) |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0A/B Controller | Reduces BOM count by eliminating external CAN protocol IC; supports 1 Mbps bit rate and automatic error recovery |
| Hibernation Module with RTC | Enables ultra-low-power operation while maintaining accurate timekeeping and preserving 2 KB SRAM state across power cycles |
| Motor Control Peripherals | Includes 6-PWM generator with complementary outputs, dead-band control, and quadrature encoder interface for BLDC/PMSM drives |
| Memory Protection Unit (MPU) | Allows runtime partitioning of flash/SRAM to isolate firmware, bootloader, and application code - critical for safety-certified systems |
| 10-bit 1-MSPS ADC with Hardware Sequencer | Supports synchronized sampling across 8 channels without CPU intervention - ideal for current/voltage sensing in motor control |
Applications
| Industrial Motor Drives | Building Automation Controllers |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC blowers and pump systems. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM generation, current sensing via ADC, and CAN-based command/response with central BMS. Use Value: Integrated PWM timers with dead-band insertion and quadrature encoder input eliminate external gate drivers and position interface ICs. | Use Scenario: Distributed temperature, occupancy, and lighting control nodes in smart commercial buildings. IC Role / Device Role / Timing Role: Sensor data acquisition, local decision logic, and CAN bus communication with central building management system (BMS). Use Value: Hibernation mode draws ≤1.7 µA while maintaining RTC and 2 KB SRAM - enabling 10+ year battery life in wireless sensor nodes. |
| Remote Terminal Units (RTUs) | Programmable Logic Controllers (PLCs) |
Use Scenario: Field-deployed telemetry units collecting analog/digital I/O and transmitting over CAN or RS-485 networks. IC Role / Device Role / Timing Role: Deterministic I/O scanning engine, protocol stack host (Modbus/CANopen), and nonvolatile configuration storage. Use Value: 256 KB flash stores dual-application images and firmware update payload; 64 KB SRAM accommodates real-time task stacks and CAN message buffers. | Use Scenario: Compact, cost-sensitive PLC modules performing discrete I/O control and motion sequencing in OEM machinery. IC Role / Device Role / Timing Role: Central logic executor with integrated timer-based motion profiles, GPIO-controlled outputs, and CAN-based distributed I/O expansion. Use Value: On-chip CAN controller and 100-pin LQFP package provide direct integration path for modular backplane designs without external bus interface ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Tiva C TM4C123GH6PM | Successor device with same ARM Cortex-M4F core, 80 MHz, 256 KB flash, but no hibernation module; requires external RTC for calendar functions | Lacks integrated hibernation and battery-backed memory - unsuitable for battery-powered long-term monitoring | Select when higher CPU performance and FPU support are needed, and hibernation is not required |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, but no native CAN 2.0B support - requires external CAN transceiver and software stack | No hardware CAN message object RAM or acceptance filtering - increases firmware complexity and latency | Select for cost-sensitive general-purpose control where CAN is secondary and external transceiver is acceptable |
Compared with TM4C123GH6PM and STM32F103VET6, the LM3S2950-IBZ50-A2 uniquely delivers production-ready CAN 2.0A/B with hardware message filtering and sub-2 µA hibernation - making it optimal for battery-operated industrial nodes requiring fieldbus reliability and multi-year runtime.
Availability
LM3S2950-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor drives, building automation controllers, remote terminal units (RTUs), and compact programmable logic controllers (PLCs) requiring stable component supply and long-term lifecycle support.
Supply support for LM3S2950-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in industrial and automotive microcontrollers.
The Stellaris LM3S family was designed specifically for deterministic real-time control in resource-constrained industrial environments - emphasizing integrated fieldbus (CAN), ultra-low-power hibernation, and motor-peripheral acceleration.
FAQ
What is the maximum operating frequency of the LM3S2950-IBZ50-A2?
The LM3S2950-IBZ50-A2 operates at a maximum CPU clock frequency of 50 MHz. This speed is achieved using an internal PLL that multiplies the crystal oscillator input, and it is fully supported across the specified industrial temperature range (–40°C to +85°C). All peripherals, including the CAN controller and ADC, are rated for concurrent operation at this clock rate. The LM3S2950-IBZ50-A2 datasheet confirms timing margins remain valid under worst-case voltage and temperature conditions at 50 MHz.
Does the LM3S2950-IBZ50-A2 support CAN FD?
No, the LM3S2950-IBZ50-A2 supports only CAN 2.0A and CAN 2.0B protocols with fixed 11-bit or 29-bit identifier frames and a maximum bit rate of 1 Mbps. It does not implement CAN FD features such as flexible data-rate switching, extended data length (up to 64 bytes), or CRC enhancements. The CAN module in the LM3S2950-IBZ50-A2 is hardware-limited to classic CAN framing. For CAN FD requirements, designers should consider newer TI devices like the RM4x or C2000™ Delfino series.
What debug interfaces are supported by the LM3S2950-IBZ50-A2?
The LM3S2950-IBZ50-A2 supports both JTAG and Serial Wire Debug (SWD) through dedicated pins (PA0–PA3, PD0, PD1), with automatic protocol detection. No external mode-select resistor or jumper is required. Debug access enables full breakpoint, watchpoint, and memory inspection capabilities via standard tools including TI Code Composer Studio and third-party OpenOCD-compatible debuggers. The LM3S2950-IBZ50-A2 implements ARM CoreSight-compliant debug infrastructure, including SWO trace output for printf-style debugging.
How much battery-backed memory is available in hibernation mode on the LM3S2950-IBZ50-A2?
The LM3S2950-IBZ50-A2 provides 2 KB of battery-backed SRAM accessible during hibernation mode. This memory retains data when main VDD is removed and only VBAT is supplied, enabling persistent storage of calibration values, event logs, or RTC alarm settings. The hibernation module also includes a 32-bit RTC counter and calendar registers, all powered independently. The LM3S2950-IBZ50-A2 datasheet specifies retention voltage down to 1.1 V and typical hibernation current of 1.7 µA with RTC enabled.
Is the LM3S2950-IBZ50-A2 pin-compatible with other LM3S devices?
The LM3S2950-IBZ50-A2 is not universally pin-compatible across the LM3S family. While it shares the 100-pin LQFP package with several variants (e.g., LM3S8962, LM3S9B92), pin functions differ significantly due to variant-specific peripheral enablement - particularly for CAN, hibernation, and motor control blocks. For example, CAN0RX/CAN0TX appear on different pins in LM3S2671 vs. LM3S2950. Migration requires PCB redesign and firmware adaptation. The LM3S2950-IBZ50-A2 datasheet explicitly states pin mappings are unique to the LM3S29xx series.
LM3S2950-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 2000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 60
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S2950-IBZ50-A2 FAQ
1.How can I place an order for LM3S2950-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S2950-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S2950-IBZ50-A2 reliable?
The price and inventory of LM3S2950-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2950-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S2950-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2950-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S2950-IBZ50-A2?
LM3S2950-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S2950-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S2950-IBZ50-A2?
For technical support, including LM3S2950-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2950-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S2950-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S2950-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2950-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S2950-IBZ50-A2?
All LM3S2950-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2950-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S2950-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S2950-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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