Texas Instruments LM3S2950-IQC50-A2
- Part No.:
- LM3S2950-IQC50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
LM3S2950-IQC50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,825
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S2950-IQC50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, hibernation module with RTC and battery-backed memory, and operating temperature range of –40°C to +85°C. It targets industrial motor control and embedded automation systems requiring deterministic real-time response and low-power hibernation.
For engineers reviewing the LM3S2950-IQC50-A2 datasheet, LM3S2950-IQC50-A2 pinout, LM3S2950-IQC50-A2 application, or LM3S2950-IQC50-A2 equivalent, key selection criteria include its integrated CAN interface, hibernation power management, 50 MHz CPU clock, dual UARTs with IrDA/SIR support, and QFP-100 package compatibility for space-constrained industrial PCBs.
Technical Context
The LM3S2950-IQC50-A2 implements the ARMv7-M architecture with NVIC, SysTick, and MPU for deterministic interrupt handling and memory protection. It integrates a dedicated hibernation module with RTC, battery-backed RAM (2 KB), and wake-up sources including external pins and RTC match events.
Its peripheral set includes two UARTs supporting IrDA and SIR modes, one I²C master/slave interface, one SSI port, four general-purpose timers (including 32-bit RTC mode), analog comparators, and a full CAN 2.0A/B controller with 32 message objects and programmable bit timing - all accessible via APB bus with configurable clock gating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs Thumb-2 instructions at up to 50 MHz |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface and single-cycle access at 50 MHz |
| SRAM | 64 KB on-chip SRAM with parity checking and zero-wait-state operation |
| Hibernation Module | Includes 2 KB battery-backed RAM, RTC with calendar support, and wake-on-RTC-match or GPIO |
| CAN Interface | One CAN 2.0A/B-compliant controller with 32 message objects and programmable bit timing |
| Operating Temp | –40°C to +85°C ambient, qualified for industrial environments per AEC-Q100 not applicable |
| Supply Voltage | 3.0 V to 3.6 V core and I/O supply; supports brown-out reset and power-down modes |
Pinout & Package
LM3S2950-IQC50-A2 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, JEDEC MS-026AC compliant, and thermal pad exposed on underside for enhanced heat dissipation in industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Dedicated domains for digital logic, analog peripherals, and core voltage regulation |
| GND, GNDA, GNDC | Ground returns | Separate analog/digital/core ground planes reduce noise coupling in mixed-signal operation |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO bank terminals | Configurable as digital I/O, alternate function (UART/SSI/I²C/CAN), or analog input with slew-rate control |
| PA0–PA3 | CAN0 RX/TX/CLK/STB | Dedicated CAN physical layer interface pins with internal pull-ups and Schmitt-trigger inputs |
| HIB, RTCCLK, HIBRST | Hibernation control | Enable hibernate entry/exit, provide external RTC clock source, and assert hibernate reset |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0A/B Controller | Enables robust fieldbus communication without external transceiver logic; supports arbitration, error handling, and automatic retransmission |
| Hibernation Module with RTC | Reduces system power to ~1.5 µA while retaining timekeeping and 2 KB RAM state using coin-cell backup |
| Dual UARTs with IrDA/SIR Support | Allows infrared remote diagnostics and legacy serial protocol bridging without external level shifters or modulators |
| ARM Cortex-M3 with MPU | Provides hardware-enforced memory protection for safety-critical tasks and prevents unintended code/data corruption |
| Four General-Purpose Timers | Supports simultaneous PWM generation, input capture, quadrature encoder interface, and RTC functionality in one timer instance |
Applications
| Industrial Motor Control | Building Automation Gateway |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC compressors with real-time current sensing and PWM modulation. IC Role / Device Role / Timing Role: Main system controller executing FOC algorithms, managing CAN-based sensor feedback, and coordinating hibernation during standby cycles. Use Value: Integrated CAN and hibernation enable direct fieldbus integration and <1.5 µA sleep current-critical for energy-certified HVAC systems. | Use Scenario: Protocol translation between BACnet MS/TP field devices and Ethernet/IP backbone in smart building controllers. IC Role / Device Role / Timing Role: Edge gateway MCU handling serial-to-Ethernet bridging, local scheduling, and secure firmware updates over CAN. Use Value: Dual UARTs with IrDA/SIR and CAN controller allow concurrent legacy fieldbus and diagnostic infrared interfaces without external ICs. |
| Remote Terminal Unit (RTU) | Industrial Data Logger |
Use Scenario: Solar-powered SCADA node collecting analog sensor data and transmitting via CAN or RS-485 to central PLC. IC Role / Device Role / Timing Role: Low-power RTU controller managing ADC sampling, CAN message queuing, and scheduled wake-up from hibernation every 15 minutes. Use Value: Battery-backed RTC and 2 KB hibernation RAM preserve time-stamped logs across power loss-no external FRAM/NVRAM required. | Use Scenario: Standalone environmental monitor logging temperature/humidity/vibration in factory machinery over weeks on lithium primary cell. IC Role / Device Role / Timing Role: Autonomous data acquisition engine using internal comparators for event-triggered sampling and hibernation between intervals. Use Value: Sub-µA hibernate current extends battery life beyond 5 years; integrated comparators eliminate need for external wake-up supervisors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Tiva C TM4C123GH6PM | Successor family with same Cortex-M4F core, 256 KB flash, but adds FPU, USB, and higher clock (80 MHz); no hibernation module with battery-backed RAM | Requires external RTC/battery-backup for timekeeping during deep sleep; better suited for USB host/device roles | Select when floating-point math or USB connectivity is required; avoid if battery-backed hibernation is mandatory |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, but lacks native CAN 2.0B and hibernation module with RTC/calendar | Needs external CAN transceiver and separate RTC chip for calendar functions; no integrated hibernate power domain | Select for cost-sensitive designs where CAN FD or USB aren't needed and external RTC is acceptable |
Compared with TM4C123GH6PM and STM32F103VET6, the LM3S2950-IQC50-A2 uniquely delivers integrated CAN 2.0A/B plus hibernation with battery-backed RTC and RAM in a single chip-eliminating three external components in industrial edge nodes where long-term autonomous operation is critical.
Availability
LM3S2950-IQC50-A2 is available at Aetrix Electronics and suitable for industrial motor control, building automation gateways, remote terminal units (RTUs), and battery-powered data loggers requiring stable component supply and long-lifecycle support.
Supply support for LM3S2950-IQC50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 90 years of innovation in industrial and automotive electronics.
The Stellaris LM3S series was designed specifically for deterministic real-time industrial control applications, emphasizing low-latency interrupt response, integrated fieldbus interfaces (CAN), and ultra-low-power hibernation for battery-operated edge nodes.
FAQ
What is the maximum operating frequency of the LM3S2950-IQC50-A2?
The LM3S2950-IQC50-A2 operates at a maximum CPU clock frequency of 50 MHz, derived from an internal PLL that accepts input from multiple clock sources including the main oscillator, precision internal oscillator, or external crystal. This frequency is fully supported across the entire –40°C to +85°C industrial temperature range and enables deterministic execution of real-time control loops with sub-microsecond interrupt latency.
Does the LM3S2950-IQC50-A2 support CAN FD or only classical CAN?
The LM3S2950-IQC50-A2 supports only Classical CAN (CAN 2.0A/B) with fixed 11-bit standard and 29-bit extended identifiers. It does not implement CAN FD features such as flexible data rate, larger payloads (up to 64 bytes), or CRC enhancements. Its CAN controller complies strictly with ISO 11898-1:2003 and supports bit rates up to 1 Mbps with programmable timing registers.
How much battery-backed memory is available in hibernation mode on the LM3S2950-IQC50-A2?
The LM3S2950-IQC50-A2 provides 2 KB of battery-backed SRAM within its hibernation module, retained during deep-sleep states using an external coin-cell or supercapacitor connected to the VBAT pin. This memory preserves critical variables, timestamps, and configuration data while consuming only ~1.5 µA total system current - verified under typical 3.3 V VDD and 3.0 V VBAT conditions.
Is the LM3S2950-IQC50-A2 pin-compatible with other Stellaris LM3S devices?
No, the LM3S2950-IQC50-A2 is not pin-compatible with other LM3S devices due to unique peripheral mapping and package-specific signal assignments. For example, CAN0 signals are assigned to PA0–PA3 on the LM3S2950-IQC50-A2 in LQFP-100, whereas LM3S8962 uses PB4–PB7 in LQFP-100. Pinout validation must be performed per device using TI's official package drawings and signal multiplexing tables.
What debug interface does the LM3S2950-IQC50-A2 support?
The LM3S2950-IQC50-A2 supports JTAG debugging via dedicated TCK, TMS, TDI, TDO, and nTRST pins, compliant with IEEE 1149.1. It also supports SWD (Serial Wire Debug) through the same physical pins when configured in SWD mode, enabling single-wire debug access with reduced pin count. Both interfaces support full halt-mode debugging, flash programming, and real-time register inspection using TI's Code Composer Studio or third-party ARM-compliant tools.
LM3S2950-IQC50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- Stellaris® ARM® Cortex®-M3S 2000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 60
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S2950-IQC50-A2 FAQ
1.How can I place an order for LM3S2950-IQC50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S2950-IQC50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S2950-IQC50-A2 reliable?
The price and inventory of LM3S2950-IQC50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S2950-IQC50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S2950-IQC50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S2950-IQC50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S2950-IQC50-A2?
LM3S2950-IQC50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S2950-IQC50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S2950-IQC50-A2?
For technical support, including LM3S2950-IQC50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S2950-IQC50-A2 requirements.
6.How does Aetrix verify that LM3S2950-IQC50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S2950-IQC50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S2950-IQC50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S2950-IQC50-A2?
All LM3S2950-IQC50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S2950-IQC50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S2950-IQC50-A2 part is unused and in its original packaging.
Return procedure for LM3S2950-IQC50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S2950-IQC50-A2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

