Texas Instruments LM3S308-EGZ25-C2
- Part No.:
- LM3S308-EGZ25-C2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
LM3S308-EGZ25-C2.pdf
- Description:
- IC MCU 32BIT 16KB FLASH 48VQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LM3S308-EGZ25-C2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 25 MHz maximum CPU frequency, 32 KB flash memory, 8 KB SRAM, integrated ADC (10-bit, 8-channel), two UARTs, I²C, SSI, and GPIOs. It targets industrial control, motor drive monitoring, and embedded sensor interface applications requiring deterministic real-time response.
For engineers reviewing the LM3S308-EGZ25-C2 datasheet, LM3S308-EGZ25-C2 pinout, LM3S308-EGZ25-C2 application, or LM3S308-EGZ25-C2 equivalent, key selection criteria include its 25 MHz operation limit, QFP-48 package, lack of USB or Ethernet peripherals, and support for single-cycle multiply and hardware divide instructions in the Cortex-M3 core.
Technical Context
The LM3S308-EGZ25-C2 implements the ARMv7-M architecture with NVIC-based interrupt handling, SysTick timer, and Memory Protection Unit (MPU). It executes Thumb-2 instructions and supports up to 32 priority levels across 24 system and peripheral interrupts.
Its analog subsystem includes an 8-channel, 10-bit ADC with hardware averaging and internal temperature sensor; digital peripherals include two UARTs with FIFOs, one I²C master/slave controller, one SSI port, and 39 GPIO pins with programmable slew rate and pull-up/down control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, no FPU |
| Max Clock Frequency | 25 MHz - defines real-time latency ceiling and peripheral timing margins |
| Flash Memory | 32 KB - sufficient for firmware with basic protocol stacks and control logic |
| SRAM | 8 KB - supports moderate stack depth, data buffers, and small RTOS footprint |
| ADC Resolution & Channels | 10-bit, 8-channel - enables precision sensor reading without external signal conditioning |
| Package | 48-pin LQFP (7 mm × 7 mm) - compatible with standard surface-mount assembly and thermal management |
| Operating Voltage | 3.3 V ±5% - requires stable low-noise LDO supply; not 5 V tolerant |
| Temperature Range | –40°C to +85°C - qualified for industrial ambient environments |
Pinout & Package
LM3S308-EGZ25-C2 uses a 48-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, exposed thermal pad, and JEDEC-standard footprint. Pin numbering follows counter-clockwise sequence starting from top-left corner (Pin 1 marked).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital core (VDDC), analog (VDDA), and I/O (VDD) rails must be independently decoupled |
| GND, GNDA, GNDC | Ground returns | Analog ground (GNDA) isolation prevents noise coupling into ADC reference path |
| PD0–PD7, PE0–PE5, PF0–PF4 | GPIO banks | 39 total GPIOs; PF0–PF4 support NMI, reset, and clock configuration functions |
| PA0–PA7 | UART0/SSI0/I²C0 multiplexed signals | Shared pins require software-configurable alternate function selection at boot |
| PC0–PC7 | UART1/ADC0/SSI1 multiplexed signals | ADC input channels mapped to PC0–PC7; no dedicated analog-only pins |
| NRST | Active-low reset input | Asynchronous reset assertion clears CPU state and peripherals; debounced externally |
| JTAG TCK/TMS/TDI/TDO/nTRST | JTAG debug interface | Enables full SWD/JTAG debugging; nTRST optional but recommended for reliable initialization |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-M3 core | Single-cycle multiply, hardware divide, and bit-band aliasing enable efficient control loop execution |
| Integrated ADC | 10-bit resolution with configurable sample averaging reduces need for external anti-aliasing filters |
| Dual UART with FIFO | 16-byte transmit/receive FIFO per UART minimizes CPU overhead during serial communication bursts |
| Programmable GPIO | Individual slew-rate control and weak pull-up/down on all GPIOs simplify board-level signal integrity tuning |
| Memory Protection Unit (MPU) | Configurable region-based access control supports safe partitioning of firmware and data spaces |
| On-chip LDO regulator | Internal 1.25 V core regulator allows single 3.3 V supply rail, reducing BOM count |
Applications
| Industrial Motor Monitoring | Embedded Sensor Node |
|---|---|
Use Scenario: Real-time acquisition of current, voltage, and temperature from BLDC motor drives in factory automation systems. IC Role / Device Role / Timing Role: Central controller executing closed-loop commutation logic and fault detection using ADC, timers, and GPIOs. Use Value: Deterministic 25 MHz Cortex-M3 execution ensures sub-10 µs interrupt latency for overcurrent shutdown. | Use Scenario: Battery-powered environmental sensor hub collecting temperature, humidity, and light data for wireless transmission. IC Role / Device Role / Timing Role: Low-power host MCU managing sensor polling, data preprocessing, and UART-to-RF bridge interface. Use Value: Integrated 8 KB SRAM holds sensor fusion buffers; sleep modes reduce average current to <100 µA. |
| PLC I/O Module | Smart Actuator Controller |
Use Scenario: DIN-rail mounted digital I/O expansion module interfacing with field devices via opto-isolated inputs and relay drivers. IC Role / Device Role / Timing Role: Isolation-aware controller routing discrete signals, validating status, and reporting via Modbus RTU over UART. Use Value: Dual UARTs support simultaneous Modbus master/slave operation; GPIOs tolerate 5 V logic via external level shifters. | Use Scenario: Compact valve positioner with integrated PID control, HART communication, and diagnostic self-test. IC Role / Device Role / Timing Role: Real-time actuator coordinator using ADC feedback, PWM output, and I²C-connected EEPROM for calibration storage. Use Value: Hardware PWM generation eliminates jitter in 4–20 mA loop control; I²C supports field-updatable calibration tables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S310-EGZ25-C2 | Same package and pinout; adds 16 KB additional flash (48 KB total) and 4 KB extra SRAM (12 KB) | Better suited for firmware with larger protocol stacks (e.g., full TCP/IP) or extended data logging | Select when firmware size exceeds 32 KB or heap requirements exceed 8 KB |
| TM4C123GH6PM | Successor family with 80 MHz Cortex-M4F core, FPU, USB, and enhanced ADC (12-bit, 16-channel) | Required for applications needing floating-point math, USB device/host, or higher-resolution analog capture | Choose for new designs where performance headroom, USB connectivity, or future-proofing outweigh legacy compatibility needs |
Compared with LM3S308-EGZ25-C2, LM3S310-EGZ25-C2 offers expanded memory without layout change, while TM4C123GH6PM delivers architectural upgrades including FPU and USB-but requires PCB redesign and toolchain migration.
Availability
LM3S308-EGZ25-C2 is available at Aetrix Electronics and suitable for industrial motor monitoring, embedded sensor nodes, PLC I/O modules, and smart actuator controllers requiring stable component supply and long-term production continuity.
Supply support for LM3S308-EGZ25-C2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and consumer markets.
The Stellaris LM3S series was designed as TI's first ARM-based microcontroller line targeting cost-sensitive, real-time industrial and automation applications with integrated analog and communication peripherals.
FAQ
What is the maximum operating frequency of the LM3S308-EGZ25-C2?
The LM3S308-EGZ25-C2 operates at a maximum CPU frequency of 25 MHz, as specified in its electrical characteristics table. This limit applies across the full industrial temperature range (–40°C to +85°C) and 3.3 V supply. The part does not support overclocking or higher-frequency variants-its PLL and clock tree are configured to deliver stable 25 MHz from internal or external sources. LM3S308-EGZ25-C2 timing margins assume this rated speed for all peripheral synchronization.
Does the LM3S308-EGZ25-C2 include a hardware floating-point unit (FPU)?
No, the LM3S308-EGZ25-C2 does not include a hardware FPU. It implements the ARM Cortex-M3 core, which supports only integer and fixed-point arithmetic. Floating-point operations must be performed in software using compiler-provided libraries. For applications requiring hardware-accelerated floating-point math, TI's later TM4C123x series (Cortex-M4F) is the direct upgrade path. LM3S308-EGZ25-C2 remains optimized for deterministic integer-based control tasks.
How many ADC channels does the LM3S308-EGZ25-C2 support, and what is their resolution?
The LM3S308-EGZ25-C2 integrates a single 10-bit successive-approximation ADC with eight input channels (ADC0–ADC7), all mapped to GPIO pins PC0–PC7. It supports hardware sample averaging (up to 64 samples) and includes an internal temperature sensor channel. No external reference is required-the ADC uses the internal 3.3 V supply as reference. LM3S308-EGZ25-C2 ADC performance is characterized for 1 MSPS sampling rate under specified conditions.
Is the LM3S308-EGZ25-C2 pin-compatible with other Stellaris LM3S devices?
The LM3S308-EGZ25-C2 is pin-compatible with other LM3S3xx-series devices in the same 48-pin LQFP package (e.g., LM3S310-EGZ25-C2), sharing identical pin assignments for power, ground, JTAG, reset, and peripheral signals. However, it is not pin-compatible with LM3S1xx or LM3S2xx families due to differing peripheral mappings and register layouts. LM3S308-EGZ25-C2 users should verify signal routing against the specific variant's datasheet before substitution.
What debug interfaces are supported by the LM3S308-EGZ25-C2?
The LM3S308-EGZ25-C2 supports both JTAG and SWD (Serial Wire Debug) protocols via its dedicated debug pins (TCK, TMS, TDI, TDO, nTRST). TI's Stellaris ICDI and third-party CMSIS-DAP debug probes are fully compatible. Debug access enables full breakpoint, watchpoint, and memory inspection capabilities without requiring code instrumentation. LM3S308-EGZ25-C2 retains debug functionality even when running from internal flash or ROM-based bootloader.
LM3S308-EGZ25-C2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- Stellaris® ARM® Cortex®-M3S 300
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 25MHz
- Connectivity:
- I2C, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S308-EGZ25-C2 FAQ
1.How can I place an order for LM3S308-EGZ25-C2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S308-EGZ25-C2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S308-EGZ25-C2 reliable?
The price and inventory of LM3S308-EGZ25-C2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S308-EGZ25-C2 is usually 5 days.
3.What payment methods are accepted for LM3S308-EGZ25-C2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S308-EGZ25-C2 transactions.
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LM3S308-EGZ25-C2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S308-EGZ25-C2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S308-EGZ25-C2?
For technical support, including LM3S308-EGZ25-C2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S308-EGZ25-C2 requirements.
6.How does Aetrix verify that LM3S308-EGZ25-C2 is sourced from the original manufacturer or authorized distributors?
All LM3S308-EGZ25-C2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S308-EGZ25-C2 meets industry standards.
7.What is the process for return or replacement of LM3S308-EGZ25-C2?
All LM3S308-EGZ25-C2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S308-EGZ25-C2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S308-EGZ25-C2 part is unused and in its original packaging.
Return procedure for LM3S308-EGZ25-C2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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