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Texas Instruments LM3S316-IGZ25-C2
- Part No.:
- LM3S316-IGZ25-C2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
LM3S316-IGZ25-C2.pdf
- Description:
- IC MCU 32BIT 16KB FLASH 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,041
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Product details
Overview
LM3S316-IGZ25-C2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 25 MHz maximum CPU frequency, 32 KB flash memory, 8 KB SRAM, integrated ADC (10-bit, 8-channel), two UARTs, I²C, SSI, PWM, and analog comparator. It targets motor control and industrial sensing applications requiring deterministic real-time response.
For engineers reviewing the LM3S316-IGZ25-C2 datasheet, LM3S316-IGZ25-C2 pinout, LM3S316-IGZ25-C2 application, or LM3S316-IGZ25-C2 equivalent, key selection criteria include its 25 MHz operation limit, QFP-48 package, integrated motor-control peripherals (PWM with dead-band), on-chip temperature sensor, and lack of Ethernet or USB interfaces.
Technical Context
The LM3S316-IGZ25-C2 implements the ARM Cortex-M3 core with Thumb-2 instruction set, NVIC for low-latency interrupt handling, and SysTick timer. It supports sleep modes (sleep/deep-sleep) with wake-up via GPIO, timer, or peripheral interrupts.
Its analog subsystem includes a single 10-bit ADC with hardware averaging and internal temperature sensor, plus one analog comparator with programmable reference. Motor control is enabled by a dedicated PWM module supporting center-aligned and edge-aligned modes with configurable dead-band generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set for compact code and deterministic execution |
| Max Clock Frequency | 25 MHz - defines real-time loop timing budget and peripheral throughput ceiling |
| Flash Memory | 32 KB - sufficient for small embedded firmware with bootloader and basic drivers |
| SRAM | 8 KB - supports stack, heap, and real-time data buffers without external RAM |
| ADC | 10-bit, 8-channel, up to 1 MSPS - enables precision analog monitoring in motor current or voltage feedback |
| PWM Outputs | 6-channel, with dead-band insertion and fault protection - directly drives half-bridge or H-bridge gate drivers |
| Package | 48-pin LQFP (7 mm × 7 mm) - surface-mount compatible with standard reflow profiles and manual inspection |
Pinout & Package
LM3S316-IGZ25-C2 is housed in a 48-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, JEDEC MS-026AC compliant, thermal pad optional, RoHS-compliant lead finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core Power Supply | 3.3 V nominal supply for CPU and digital logic; requires local 100 nF decoupling |
| GND | Ground Reference | Analog and digital ground planes must be connected at single point near device |
| GPIOA[0–7] | General-Purpose I/O | Configurable as inputs/outputs with pull-up/down, slew rate control, and interrupt capability |
| SSI0CLK / I2C0SCL | Shared Peripheral Clock Line | Time-shared between SSI master clock and I²C serial clock; software-configured function |
| U0RX / U1RX | UART Receive Inputs | Dual UART receive pins support independent serial debug and host communication paths |
| PHB0 / PHB1 | PWM High-Side Outputs | Direct drive outputs for high-side MOSFETs in half-bridge configurations |
| PLB0 / PLB1 | PWM Low-Side Outputs | Complementary low-side outputs synchronized with PHBx and dead-band enforced |
| AIN0–AIN7 | ADC Input Channels | Single-ended analog inputs; AIN0 also connects to internal temperature sensor |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Temperature Sensor | On-die sensor calibrated to ±3°C accuracy over –40°C to +85°C, usable for thermal derating in motor control |
| Dedicated PWM Module | 6-channel output with independent dead-band control per pair, enabling safe commutation in BLDC or stepper drivers |
| Hardware ADC Averaging | Up to 64-sample hardware averaging reduces noise without CPU overhead in current-sense applications |
| Nested Vectored Interrupt Controller | 8 priority levels with tail-chaining and low-latency (<12 cycle) interrupt entry/exit for time-critical ISR handling |
| System Control Block (SCB) | Includes system reset control, power management registers, and vector table offset register for runtime relocation |
Applications
| Motor Control System | Industrial Sensor Node |
|---|---|
Use Scenario: Closed-loop speed and position control of 3-phase BLDC motors in HVAC blowers or pump drives. IC Role / Device Role / Timing Role: Real-time execution of FOC (Field-Oriented Control) algorithms, PWM waveform generation, and ADC sampling synchronization. Use Value: Integrated PWM dead-band and ADC hardware averaging eliminate need for external timing ICs or signal conditioning, reducing BOM count. | Use Scenario: Battery-powered remote monitoring of pressure, temperature, and vibration in factory equipment. IC Role / Device Role / Timing Role: Low-power sensor interface hub with deep-sleep wake-up on threshold event and UART/I²C data aggregation. Use Value: 8 KB SRAM retains sensor history during sleep; internal temperature sensor enables self-calibration without external components. |
| Programmable Logic Controller (PLC) I/O Module | Power Supply Monitoring Unit |
Use Scenario: Digital input/output expansion module for DIN-rail mounted PLCs with isolated field connections. IC Role / Device Role / Timing Role: Deterministic GPIO scanning, debounce filtering, and status reporting via UART to main controller. Use Value: GPIO interrupt capability with configurable edge detection allows immediate response to field-device state changes without polling overhead. | Use Scenario: Real-time monitoring of rail voltages (12 V, 5 V, 3.3 V) and overtemperature in telecom power shelves. IC Role / Device Role / Timing Role: Analog comparator with programmable reference triggers fast shutdown before damage occurs. Use Value: Comparator output can directly assert fault line to PMIC or latch into safety circuit - sub-1 µs response avoids catastrophic failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S328-IQC25-C2 | Same core and package, but adds Ethernet MAC and PHY interface; higher pin count (64-pin LQFP) | Requires Ethernet connectivity; not drop-in due to different pinout and larger footprint | Select only if networked control is required; LM3S316-IGZ25-C2 remains optimal for cost-sensitive standalone motor control |
| Tiva C TM4C123GH6PM | Successor family with 80 MHz Cortex-M4F core, 256 KB flash, FPU, and enhanced peripherals; same 64-pin LQFP option available | Higher performance and feature set; requires PCB redesign and firmware migration | Choose for new designs needing floating-point math or future scalability; LM3S316-IGZ25-C2 suits legacy or resource-constrained deployments |
Compared with LM3S316-IGZ25-C2, LM3S328-IQC25-C2 adds Ethernet but increases board area and cost, while TM4C123GH6PM delivers significantly higher compute throughput and memory but mandates full hardware and software requalification.
Availability
LM3S316-IGZ25-C2 is available at Aetrix Electronics and suitable for motor control systems, industrial sensor nodes, PLC I/O modules, and power supply monitoring units requiring stable component supply across long-lifecycle production programs.
Supply support for LM3S316-IGZ25-C2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The Stellaris LM3S series was designed as an early-generation ARM-based MCU platform targeting cost-sensitive, real-time industrial control applications with integrated analog and motor-control peripherals.
FAQ
What is the maximum operating frequency of the LM3S316-IGZ25-C2?
The LM3S316-IGZ25-C2 operates at a maximum CPU clock frequency of 25 MHz, as specified in the production data sheet. This limit applies across the full industrial temperature range (–40°C to +85°C) and under nominal 3.3 V supply conditions. The device does not support overclocking or frequency scaling beyond this rating, and all timing-critical peripherals (PWM, ADC, UART) are validated to function correctly at this speed.
Does the LM3S316-IGZ25-C2 include an internal temperature sensor?
Yes, the LM3S316-IGZ25-C2 integrates a factory-calibrated internal temperature sensor connected to ADC channel AIN0. Its output is linear over –40°C to +85°C with ±3°C typical accuracy, and it requires no external components. This sensor is used in the LM3S316-IGZ25-C2 for thermal monitoring in motor control and power supply applications without adding BOM cost or layout complexity.
What communication interfaces are supported by the LM3S316-IGZ25-C2?
The LM3S316-IGZ25-C2 supports UART (two channels), I²C (one master/slave), and SSI (one master/slave) interfaces. It does not include USB, CAN, Ethernet, or SPI in standalone mode - SSI serves as the primary synchronous serial interface. All interfaces are fully register-mapped and accessible via the APB bus, with dedicated NVIC interrupts and configurable GPIO remapping per the datasheet pin tables.
Is the LM3S316-IGZ25-C2 pin-compatible with other Stellaris LM3S devices?
No, the LM3S316-IGZ25-C2 is not pin-compatible with other LM3S variants such as LM3S328 or LM3S811. It uses a 48-pin LQFP package with unique signal allocation - for example, PHB0/PLB0 PWM outputs and AIN0 temperature sensor routing differ across models. Pin compatibility must be verified per device-specific pin diagrams; substitution requires schematic and layout review.
What debug interface does the LM3S316-IGZ25-C2 support?
The LM3S316-IGZ25-C2 supports JTAG debugging via a 5-pin interface (TCK, TMS, TDI, TDO, nTRST), compliant with IEEE 1149.1. It includes full SWD (Serial Wire Debug) capability through the same pins using TI's ICDI protocol. Debug access enables flash programming, real-time variable inspection, and hardware breakpoint setting - all supported by TI's Code Composer Studio and third-party tools like OpenOCD.
LM3S316-IGZ25-C2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- Stellaris® ARM® Cortex®-M3S 300
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 25MHz
- Connectivity:
- I2C, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S316-IGZ25-C2 FAQ
1.How can I place an order for LM3S316-IGZ25-C2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S316-IGZ25-C2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S316-IGZ25-C2 reliable?
The price and inventory of LM3S316-IGZ25-C2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S316-IGZ25-C2 is usually 5 days.
3.What payment methods are accepted for LM3S316-IGZ25-C2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S316-IGZ25-C2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S316-IGZ25-C2?
LM3S316-IGZ25-C2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S316-IGZ25-C2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S316-IGZ25-C2?
For technical support, including LM3S316-IGZ25-C2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S316-IGZ25-C2 requirements.
6.How does Aetrix verify that LM3S316-IGZ25-C2 is sourced from the original manufacturer or authorized distributors?
All LM3S316-IGZ25-C2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S316-IGZ25-C2 meets industry standards.
7.What is the process for return or replacement of LM3S316-IGZ25-C2?
All LM3S316-IGZ25-C2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S316-IGZ25-C2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S316-IGZ25-C2 part is unused and in its original packaging.
Return procedure for LM3S316-IGZ25-C2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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