Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments LM3S3739-IQC50

Part No.:
LM3S3739-IQC50
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixLM3S3739-IQC50.pdf
Description:
IC MCU 32BIT 128KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,765

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LM3S3739-IQC50 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated hibernation module, 8-channel μDMA, and dual 12-bit ADCs (1 MSPS). It operates at 50 MHz, supports 3.3 V supply, and targets low-power industrial control and sensor interface applications.

For engineers reviewing the LM3S3739-IQC50 datasheet, LM3S3739-IQC50 pinout, LM3S3739-IQC50 application, or LM3S3739-IQC50 equivalent, key selection criteria include hibernation-capable RTC, motor control peripherals (PWM, QEI), UART/SSI/USB interfaces, and Cortex-M3 debug support via JTAG/SWD.

Technical Context

The LM3S3739-IQC50 implements the ARM Cortex-M3 core with Thumb-2 instruction set, NVIC for 64 interrupt sources, and SysTick timer. It integrates a hibernation module with battery-backed RTC and 2 KB SRAM, enabling sub-μA sleep current with wake-up on external event or time match.

Peripherals include two 12-bit ADCs (each with 8-sample sequencer, hardware averaging, internal temperature sensor), eight 32/16-bit GPTMs (supporting PWM, input capture, quadrature encoder), three UARTs (one with IrDA SIR), two SSI modules (SPI/Microwire), and USB 2.0 device controller. All are memory-mapped and accessible via APB bus.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3, 32-bit, Thumb-2 ISA, 50 MHz max operation
Flash Memory256 KB on-chip, used for firmware storage and execution
SRAM64 KB main + 2 KB hibernate-backed, retains data during deep sleep
ADCDual 12-bit, 1 MSPS total, each with 8-step sequencer and hardware averaging
Hibernate ModuleRTC with calendar, battery-backed 2 KB SRAM, wake-on-match or GPIO
TimersEight 32/16-bit GPTMs supporting PWM, input edge timing, quadrature decode
CommunicationThree UARTs (one IrDA-capable), two SSI (SPI/Microwire), USB 2.0 device

Pinout & Package

LM3S3739-IQC50 is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions are defined per TI SPMS084H datasheet Rev H (July 2014).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDCPower supply inputs3.3 V digital core/analog/USB supply; decoupling required per datasheet layout guidelines
GND, GNDA, GNDCGround returnsAnalog/digital/USB ground separation minimizes noise coupling to ADC and USB PHY
USB0VBUS, USB0IDUSB detection pinsEnable USB device mode detection and ID pin sensing for OTG-capable host negotiation
HIB, RTCCLK, HIBRTCAHibernate control and clockEnable hibernation entry/exit; accept external 32.768 kHz crystal or bypass for RTC accuracy
PD0–PD7, PE0–PE5, PF0–PF4GPIO portsConfigurable as digital I/O, alternate function (UART0/1/2, SSI0/1, PWM, QEI), or analog input (ADC0/1)

Key Features

FeatureDesign Value
Hibernate with RTC & Battery BackupEnables <1 μA system sleep with calendar-aware wake-up and retained SRAM without external RTC chip
Dual Independent 12-bit ADCsSupport concurrent sampling of up to 16 channels with hardware averaging-ideal for multi-sensor monitoring
Eight General-Purpose TimersProvide flexible PWM generation, quadrature decoding, and precise input capture for motor position/speed feedback
USB 2.0 Device ControllerFull-speed (12 Mbps) USB device stack support with integrated PHY-eliminates need for external transceiver
μDMA with 32 ChannelsOffloads CPU from peripheral data movement (e.g., ADC→SRAM, UART→buffer), reducing ISR latency and power

Applications

Industrial Motor ControlSmart Sensor Node

Use Scenario: Closed-loop BLDC motor drive with Hall-effect or encoder feedback in factory automation.

IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, managing PWM outputs, reading QEI/ADC, and communicating status via UART.

Use Value: Eight GPTMs deliver synchronized PWM and real-time quadrature decoding; hibernation enables low-power standby between cycles.

Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and pressure with periodic wireless upload.

IC Role / Device Role / Timing Role: Sensor aggregator and low-power scheduler using hibernate RTC to wake every 10 minutes for measurement and transmission.

Use Value: Dual ADCs acquire multiple analog sensors simultaneously; 2 KB hibernate SRAM stores logs across sleep cycles without external memory.

USB Human Interface DeviceProgrammable Logic Controller (PLC) I/O Module

Use Scenario: Industrial USB HID device such as programmable keypad or diagnostic tool connecting directly to PC or HMI.

IC Role / Device Role / Timing Role: USB device endpoint handling HID report descriptors, button polling, and LED control via GPIO.

Use Value: Integrated USB 2.0 PHY and controller reduce BOM cost and board space; dedicated USB interrupt vector ensures timely report delivery.

Use Scenario: DIN-rail mounted remote I/O module converting field signals (4–20 mA, digital inputs) to Modbus RTU over RS-485.

IC Role / Device Role / Timing Role: Protocol gateway with UART-driven Modbus stack, ADC for analog channel digitization, and GPIO for discrete I/O control.

Use Value: Three UARTs allow simultaneous Modbus master/slave and debug port; robust 3.3 V I/O tolerates industrial noise margins.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Tiva C TM4C123GH6PMSuccessor family: Cortex-M4F core, 80 MHz, 256 KB flash, 32 KB SRAM, no hibernate SRAM but deeper sleep modesLacks battery-backed hibernate SRAM and calendar RTC; requires external RTC for long-term timekeepingSelect when floating-point math or higher CPU throughput is needed; not drop-in due to different register map and peripheral naming
STM32F103VET6Cortex-M3 core, 72 MHz, 512 KB flash, 64 KB SRAM, no integrated hibernate module or USB device PHYRequires external USB transceiver and RTC IC; offers more timers and CAN interface not present in LM3S3739-IQC50Choose for CAN-based industrial networks or where larger flash is critical; pinout and peripheral mapping differ significantly

Compared with TM4C123GH6PM and STM32F103VET6, the LM3S3739-IQC50 uniquely delivers integrated hibernate RTC with battery-backed SRAM and USB device PHY in a single 100-pin LQFP-enabling compact, ultra-low-power designs without external timing or interface components.

Availability

LM3S3739-IQC50 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, USB HID devices, and PLC I/O modules requiring stable component supply and long-term lifecycle support.

Supply support for LM3S3739-IQC50 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies since 1930.

The Stellaris LM3S series was designed as TI's first ARM-based microcontroller platform targeting cost-sensitive, low-power industrial and automation applications with integrated analog and motor control peripherals.

FAQ

What is the maximum operating frequency of the LM3S3739-IQC50?

The LM3S3739-IQC50 operates at a maximum system clock frequency of 50 MHz, derived from its internal PLL or external crystal oscillator. This frequency applies to both the Cortex-M3 core and all synchronous peripherals including GPIO, UART, SSI, and ADC timing. The device meets this specification across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±10% supply voltage.

Does the LM3S3739-IQC50 support USB device functionality without external components?

Yes, the LM3S3739-IQC50 integrates a full-speed USB 2.0 device controller with an on-chip PHY, enabling direct connection to a USB host using only standard termination resistors and a USB connector. No external transceiver or level shifter is required. The USB interface supports HID, CDC, and MSC classes via TI's StellarisWare USB library.

How does the hibernation module in the LM3S3739-IQC50 retain data during deep sleep?

The LM3S3739-IQC50 hibernation module retains 2 KB of SRAM and maintains RTC calendar/time registers using a separate battery-backed power domain (VBAT). When entering hibernate mode, the main power rails are shut down while VBAT sustains the hibernate logic, RTC oscillator, and backup SRAM-achieving typical current draw below 1 μA.

What ADC features are available on the LM3S3739-IQC50?

The LM3S3739-IQC50 includes two independent 12-bit successive-approximation ADCs, each with an 8-step hardware sequencer, programmable sample rate up to 1 MSPS, internal temperature sensor, and hardware averaging (2–64 samples). Both ADCs support differential input mode and can be triggered by software, timer, or GPIO events.

Is the LM3S3739-IQC50 pin-compatible with other Stellaris LM3S devices?

No, the LM3S3739-IQC50 is not pin-compatible with other LM3S devices-even within the same package size-due to unique peripheral mapping and signal assignment. For example, USB0ID and HIB pins occupy specific locations not shared across the LM3S family. Migration requires PCB redesign and firmware adaptation.

LM3S3739-IQC50 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
100-LQFP
Series:
Stellaris® ARM® Cortex®-M3S 3000
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Programmable:
Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
61
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S3739-IQC50 FAQ

1.How can I place an order for LM3S3739-IQC50 through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S3739-IQC50 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S3739-IQC50 reliable?

The price and inventory of LM3S3739-IQC50 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S3739-IQC50 is usually 5 days.

3.What payment methods are accepted for LM3S3739-IQC50?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S3739-IQC50 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LM3S3739-IQC50?

LM3S3739-IQC50 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S3739-IQC50 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S3739-IQC50?

For technical support, including LM3S3739-IQC50 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S3739-IQC50 requirements.

6.How does Aetrix verify that LM3S3739-IQC50 is sourced from the original manufacturer or authorized distributors?

All LM3S3739-IQC50 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S3739-IQC50 meets industry standards.

7.What is the process for return or replacement of LM3S3739-IQC50?

All LM3S3739-IQC50 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S3739-IQC50, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S3739-IQC50 part is unused and in its original packaging.

Return procedure for LM3S3739-IQC50:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LM3S3739-IQC50 Tags

  • LM3S3739-IQC50
  • LM3S3739-IQC50 PDF
  • LM3S3739-IQC50 Datasheet
  • LM3S3739-IQC50 Specifications
  • LM3S3739-IQC50 Images
  • Texas Instruments
  • Texas Instruments LM3S3739-IQC50
  • Buy LM3S3739-IQC50
  • LM3S3739-IQC50 Price
  • LM3S3739-IQC50 Distributor
  • LM3S3739-IQC50 Supplier
  • LM3S3739-IQC50 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER