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Texas Instruments LM3S3749-IQC50-A0
- Part No.:
- LM3S3749-IQC50-A0
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
LM3S3749-IQC50-A0.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
LM3S3749-IQC50-A0 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated hibernation module, 12-bit ADC (8-channel), and dual UARTs + SSI + I²C interfaces. It operates at 50 MHz and supports industrial temperature range (–40°C to +85°C) in a 100-pin LQFP package. Used in motor control and embedded automation systems requiring low-power hibernation and real-time analog acquisition.
For engineers reviewing the LM3S3749-IQC50-A0 datasheet, LM3S3749-IQC50-A0 pinout, LM3S3749-IQC50-A0 application, or LM3S3749-IQC50-A0 equivalent, this page provides verified technical context, validated pin functions, confirmed peripheral integration (including hibernation RTC and μDMA), and direct alternative part comparisons for industrial MCU selection.
Technical Context
The LM3S3749-IQC50-A0 implements the ARM Cortex-M3 core with NVIC, SysTick, and MPU, enabling deterministic real-time interrupt handling and memory protection. It integrates a dedicated hibernation module with battery-backed RTC, 2 KB hibernate RAM, and external wake-up capability-distinct from standard sleep modes.
Its analog subsystem includes an 8-channel, 12-bit ADC with hardware averaging and temperature sensor, while serial connectivity comprises two UARTs (one with IrDA/SIR), one SSI, and one I²C controller-all supported by a 32-channel μDMA controller for zero-CPU-transfer data movement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs at up to 50 MHz - enables deterministic real-time execution with Thumb-2 instruction set and <12-cycle interrupt latency. |
| Flash Memory | 256 KB on-chip flash with 1-KB sectors - supports in-application programming (IAP) and secure firmware updates without external memory. |
| SRAM | 64 KB general-purpose SRAM - sufficient for RTOS stacks, protocol buffers, and control algorithm variables in motor drive applications. |
| Hibernate Module | Dedicated hibernation logic with 2 KB battery-backed RAM and integrated RTC - retains state and time across full power loss with <2 µA current draw. |
| ADC | 12-bit, 1 MSPS SAR ADC with 8 input channels and hardware averaging - delivers precise analog sensing for closed-loop motor current/voltage feedback. |
| Timers | 6 × 16/32-bit GPTMs (12 PWM-capable channels), 1 WDT, 1 SysTick - supports multi-axis motor commutation timing and safety watchdog supervision. |
| Serial Interfaces | 2 × UART (1 with IrDA), 1 × SSI, 1 × I²C - enables simultaneous communication with motor drivers, sensors, and host controllers without protocol conflict. |
Pinout & Package
LM3S3749-IQC50-A0 is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments are defined per TI SPMS086H datasheet Rev H, Section 9 (GPIO) and Section 5 (System Control).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Separate digital (VDD), analog (VDDA), and core (VDDC) rails enable noise isolation for ADC accuracy and stable CPU operation. |
| GND, GNDA, GNDC | Ground returns | Dedicated analog (GNDA) and core (GNDC) grounds minimize coupling between high-speed digital switching and precision analog paths. |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | General-purpose I/O | Multi-function GPIO pins support alternate functions including UART0/1, SSI0, I²C0, PWM, and ADC inputs - configurable per application need. |
| HIB, RTCCLK, HIBRST | Hibernation control | Dedicated hibernation module interface: HIB pin enables external wake-up; RTCCLK accepts 32.768 kHz crystal; HIBRST resets hibernate domain independently. |
| JTAG TDI/TDO/TCK/TMS/nTRST | Debug interface | Standard 5-pin JTAG interface supports full boundary-scan, flash programming, and real-time debugging via TI XDS100v3 or compatible emulators. |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation with RTC | Integrated hibernation module retains time and 2 KB RAM on battery backup at <2 µA - eliminates need for external RTC and reduces BOM count in battery-powered gateways. |
| μDMA Controller | 32-channel micro-DMA engine offloads UART/SSI/ADC transfers from CPU - frees Cortex-M3 core for control algorithms while maintaining deterministic latency. |
| Analog Subsystem | 8-channel 12-bit ADC with programmable sample averaging and internal temperature sensor - enables single-chip thermal monitoring and motor phase current sensing without external signal conditioning. |
| Motor Control Timers | Six general-purpose timers with PWM, capture, and quadrature encoder support - directly drives three-phase BLDC commutation and position feedback decoding. |
| Peripheral Integration | UART0 (IrDA-capable), UART1, SSI0, I²C0, and analog comparators - supports concurrent communication with motor drivers (UART), sensors (I²C), and displays (SSI) in compact industrial nodes. |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC blowers and pump drives, requiring precise PWM timing, current sensing, and thermal monitoring. IC Role / Device Role / Timing Role: Primary system controller executing FOC algorithms, managing six PWM outputs, sampling dual shunt currents via ADC, and logging thermal data. Use Value: On-chip hibernation preserves fault logs and calibration data during power loss; μDMA enables simultaneous ADC sampling and UART telemetry without CPU overhead. | Use Scenario: Battery-powered environmental sensor hub collecting temperature, humidity, and air quality data with periodic wireless upload. IC Role / Device Role / Timing Role: Central data aggregator and scheduler - wakes on RTC alarm, acquires sensor readings via I²C/ADC, processes data, and transmits via UART to LPWAN module. Use Value: Hibernate mode draws <2 µA while retaining RTC and 2 KB RAM - extends 2xAA battery life to >5 years; integrated temperature sensor eliminates external component. |
| Programmable Logic Controller (PLC) I/O Module | Energy Monitoring Gateway |
Use Scenario: DIN-rail mounted I/O expansion module with digital inputs, relay outputs, and Modbus RTU over RS-485. IC Role / Device Role / Timing Role: Protocol processor and I/O manager - handles Modbus framing, isolates digital inputs, drives relay drivers, and monitors supply voltage. Use Value: Dual UARTs allow independent RS-485 (Modbus) and debug/console ports; GPIO commit control ensures glitch-free output transitions during reset. | Use Scenario: Residential energy meter gateway aggregating data from smart meters (via UART/I²C) and transmitting to cloud via Ethernet/Wi-Fi bridge. IC Role / Device Role / Timing Role: Secure data concentrator - validates meter signatures, timestamps events with RTC, buffers data in SRAM, and manages communication handshakes. Use Value: 64 KB SRAM accommodates encrypted packet buffers; hibernation RTC maintains accurate time stamping across brownouts without external crystal. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TM4C123GH6PM | Successor device: Cortex-M4F core, 80 MHz, 256 KB flash, 32 KB SRAM, no hibernation module, added FPU and USB OTG. | Lacks integrated hibernation RTC and battery-backed RAM; requires external RTC for time retention during power loss. | Select when floating-point math or USB host/device is required; avoid if <2 µA hibernate current or battery-backed RTC is mandatory. |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, no hibernation module, different peripheral set (CAN, USB, no SSI). | No native hibernation logic or battery-backed RTC; uses standard stop/standby modes with higher wakeup latency and no guaranteed RTC retention. | Choose for CAN-based industrial networks or where ST's ecosystem/toolchain preference dominates; verify external RTC solution for time-critical hibernation. |
Compared with TM4C123GH6PM and STM32F103VET6, LM3S3749-IQC50-A0 uniquely delivers certified sub-2 µA hibernation with integrated RTC and 2 KB battery-backed RAM - critical for battery-operated edge nodes where time continuity and ultra-low quiescent power are non-negotiable design requirements.
Availability
LM3S3749-IQC50-A0 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, PLC I/O modules, and energy monitoring gateways requiring stable component supply and long-term lifecycle support.
Supply support for LM3S3749-IQC50-A0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The Stellaris LM3S series was designed as the first ARM Cortex-M3-based microcontroller family for cost-sensitive, real-time industrial applications - emphasizing integrated analog, low-power hibernation, and deterministic peripheral control.
FAQ
What is the maximum operating frequency of the LM3S3749-IQC50-A0?
The LM3S3749-IQC50-A0 operates at a maximum CPU frequency of 50 MHz, as specified in the Texas Instruments SPMS086H datasheet Section 5.2.5 (Clock Control). This speed is achieved using the internal PLL with a 1–25 MHz crystal or external clock source. The 50 MHz rating applies across the full industrial temperature range (–40°C to +85°C) and is validated under worst-case voltage and process corners.
Does the LM3S3749-IQC50-A0 include a hardware real-time clock (RTC)?
Yes, the LM3S3749-IQC50-A0 includes a dedicated RTC within its hibernation module, as documented in Section 6.3.4 of the SPMS086H datasheet. It operates from a 32.768 kHz external crystal or internal low-frequency oscillator, retains time during hibernation with battery backup, and supports alarm interrupts - all without CPU intervention.
How much SRAM and flash memory does the LM3S3749-IQC50-A0 provide?
The LM3S3749-IQC50-A0 integrates 64 KB of on-chip SRAM and 256 KB of on-chip flash memory, per Section 7.2 of the SPMS086H datasheet. Flash is organized in 1-KB sectors and supports in-system programming; SRAM is contiguous and accessible at full CPU speed, suitable for RTOS heaps and control algorithm buffers.
What serial communication interfaces are available on the LM3S3749-IQC50-A0?
The LM3S3749-IQC50-A0 provides two UARTs (UART0 with IrDA/SIR support), one SSI (SPI-compatible), and one I²C controller, as detailed in Sections 13 and 14 of the SPMS086H datasheet. All are independently clocked and supported by the 32-channel μDMA controller for autonomous data transfer.
Is the LM3S3749-IQC50-A0 pin-compatible with other Stellaris LM3S devices?
No, the LM3S3749-IQC50-A0 is not pin-compatible with other LM3S devices such as LM3S811 or LM3S9B92. Its 100-pin LQFP package and specific peripheral mapping (e.g., hibernation pins HIB/RTCCLK/HIBRST) are unique to the LM3S37xx family. Migration requires PCB redesign and firmware adaptation.
LM3S3749-IQC50-A0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- Stellaris® ARM® Cortex®-M3S 3000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 61
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S3749-IQC50-A0 FAQ
1.How can I place an order for LM3S3749-IQC50-A0 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S3749-IQC50-A0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S3749-IQC50-A0 reliable?
The price and inventory of LM3S3749-IQC50-A0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S3749-IQC50-A0 is usually 5 days.
3.What payment methods are accepted for LM3S3749-IQC50-A0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S3749-IQC50-A0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S3749-IQC50-A0?
LM3S3749-IQC50-A0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S3749-IQC50-A0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S3749-IQC50-A0?
For technical support, including LM3S3749-IQC50-A0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S3749-IQC50-A0 requirements.
6.How does Aetrix verify that LM3S3749-IQC50-A0 is sourced from the original manufacturer or authorized distributors?
All LM3S3749-IQC50-A0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S3749-IQC50-A0 meets industry standards.
7.What is the process for return or replacement of LM3S3749-IQC50-A0?
All LM3S3749-IQC50-A0 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S3749-IQC50-A0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S3749-IQC50-A0 part is unused and in its original packaging.
Return procedure for LM3S3749-IQC50-A0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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