Texas Instruments LM3S5732-IQR50-A0
- Part No.:
- LM3S5732-IQR50-A0
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
LM3S5732-IQR50-A0.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LM3S5732-IQR50-A0 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated ADC (12-bit, 1 MSPS), dual UARTs, SSI, I²C, and hibernation module. It operates at 50 MHz and supports industrial temperature range (–40°C to +105°C) in a 100-pin LQFP package. Used in motor control, sensor hubs, and programmable logic controllers.
For engineers reviewing the LM3S5732-IQR50-A0 datasheet, LM3S5732-IQR50-A0 pinout, LM3S5732-IQR50-A0 application, or LM3S5732-IQR50-A0 equivalent, key selection criteria include its hibernation-capable real-time clock, μDMA controller for peripheral offload, and integrated analog front-end for direct sensor interfacing without external signal conditioning.
Technical Context
The LM3S5732-IQR50-A0 implements the ARMv7-M architecture with NVIC supporting up to 68 interrupt lines, SysTick timer, and Memory Protection Unit (MPU). Its system-level design integrates a hibernation module with battery-backed RTC and 2 KB of hibernate memory, enabling sub-1 µA deep-sleep operation.
Peripherals include a 12-bit ADC with four sample sequencers and hardware averaging, two UARTs with IrDA/SIR support, one SSI port, and one I²C master/slave interface. Clocking is managed via internal precision oscillator (±1% over temperature), PLL, and multiple gated clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 50 MHz max operation - enables deterministic real-time execution with Thumb-2 instruction set and hardware divide. |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface - supports in-application programming and secure code protection via ROM-based bootloader. |
| SRAM | 64 KB general-purpose SRAM - sufficient for RTOS stacks, protocol buffers, and control loop variables in closed-loop systems. |
| ADC | 12-bit, 1 MSPS, 8-channel SAR ADC with four independent sequencers - allows concurrent sampling of multiple sensors with configurable trigger sources. |
| Hibernate Module | Battery-backed RTC + 2 KB hibernate RAM + wake-on-RTC/external-pin - enables energy harvesting and battery-powered applications with precise timekeeping during ultra-low-power sleep. |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard surface-mount reflow processes and provides full peripheral pin access including JTAG debug signals. |
| Temperature Range | –40°C to +105°C industrial grade - qualified for use in motor drives, factory automation, and outdoor embedded controls without derating. |
Pinout & Package
LM3S5732-IQR50-A0 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with exposed thermal pad, JEDEC MS-026AC compliant. Pinout validated per TI SPMS090H datasheet Rev H (July 2014), Table 4-1 "Signal Descriptions" and Figure 1-3 "High-Level Block Diagram".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Dedicated digital (VDD), analog (VDDA), and core (VDDC) rails - enable noise isolation between CPU, peripherals, and ADC sections. |
| GND, GNDA, GNDC | Ground returns | Separate analog (GNDA), digital (GND), and core (GNDC) grounds - critical for maintaining ADC accuracy and reducing switching noise coupling. |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO banks | Configurable 5-V-tolerant I/O with slew-rate control and weak pull-up/down - supports direct connection to industrial sensors and actuators without level shifters. |
| PA0–PA3, PB0–PB1 | UART0/1, SSI0, I²C0 | Multiplexed peripheral functions - allows flexible board layout with shared pins for serial interfaces and GPIO fallback. |
| PC0–PC5 | ADC0 inputs | Analog input channels with dedicated sample-and-hold - supports simultaneous sampling across up to 8 channels using hardware sequencer triggers. |
| TCK, TMS, TDI, TDO, nTRST | JTAG debug interface | Fully compliant IEEE 1149.1 boundary-scan interface - enables non-intrusive debugging, flash programming, and production test without requiring SWD or custom bootloaders. |
Key Features
| Feature | Design Value |
|---|---|
| Hibernate module with RTC | Enables <1 µA deep-sleep current with time-stamped wake events - eliminates need for external RTC IC and reduces BOM count in battery-critical designs. |
| μDMA controller | 32-channel micro-DMA with scatter-gather support - offloads CPU from high-bandwidth peripheral transfers (e.g., ADC-to-memory, UART-to-buffer), freeing cycles for control algorithms. |
| Integrated analog front-end | 12-bit ADC with hardware averaging, temperature sensor, and differential input mode - permits direct connection of thermocouples, strain gauges, and bridge sensors without external op-amps or filters. |
| ROM-based StellarisWare® bootloader | Factory-programmed firmware supporting In-Application Programming (IAP) and UART/SSI-based firmware updates - simplifies field upgrades and eliminates requirement for external programmer hardware. |
| Industrial temperature qualification | Full functionality verified from –40°C to +105°C - ensures reliable operation in motor drive enclosures, solar inverters, and railway control cabinets without thermal throttling. |
Applications
| Motor Control System | Sensor Data Aggregator |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers and industrial pumps using PWM outputs, current sensing, and position feedback. IC Role / Device Role / Timing Role: Real-time controller executing FOC (Field-Oriented Control) algorithm with synchronized ADC sampling and PWM generation at 20 kHz. Use Value: Integrated hibernation module enables automatic shutdown during idle periods, reducing standby power by >99% versus always-on MCU solutions. | Use Scenario: Multi-sensor node collecting temperature, humidity, pressure, and vibration data for predictive maintenance in factory equipment. IC Role / Device Role / Timing Role: Sensor hub aggregating asynchronous analog/digital inputs, performing local preprocessing, and transmitting compressed data via UART to gateway. Use Value: On-chip 12-bit ADC with hardware averaging delivers ±0.5°C temperature accuracy without external calibration components. |
| Programmable Logic Controller (PLC) | Energy Harvesting Node |
Use Scenario: DIN-rail mounted PLC module handling discrete I/O, analog inputs, and Modbus RTU communication in industrial automation. IC Role / Device Role / Timing Role: Deterministic real-time controller managing scan cycle timing, I/O state updates, and serial protocol stack with <100 µs jitter. Use Value: MPU and NVIC priority grouping ensure critical I/O interrupts preempt lower-priority communication tasks, guaranteeing cycle consistency. | Use Scenario: Wireless sensor node powered by solar cell and supercapacitor, logging environmental data every 15 minutes. IC Role / Device Role / Timing Role: Ultra-low-power coordinator waking from hibernation on RTC alarm, acquiring sensor data, transmitting via UART to LPWAN modem, then returning to <1 µA sleep. Use Value: Battery-backed hibernate RAM retains configuration and last-read sensor values across power loss, eliminating reinitialization delay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S5742-IQR50-A0 | Same core, package, and memory; adds CAN 2.0B controller and additional GPIOs. | Required where industrial fieldbus (CANopen, DeviceNet) integration is mandatory. | Select LM3S5742-IQR50-A0 only if CAN interface is needed; otherwise LM3S5732-IQR50-A0 offers lower cost and identical performance for UART/SSI/I²C-based systems. |
| TM4C123GH6PM | Successor family with enhanced peripherals (USB, Ethernet MAC), higher clock (80 MHz), and larger memory (256 KB flash, 32 KB SRAM). | Targeted at next-generation designs requiring USB device/host or Ethernet connectivity. | TM4C123GH6PM is not pin-compatible; requires PCB redesign but provides migration path with StellarisWare compatibility and extended lifecycle support. |
Compared with LM3S5742-IQR50-A0 and TM4C123GH6PM, the LM3S5732-IQR50-A0 delivers optimal cost/performance for UART/SSI-based industrial control where CAN or USB are unnecessary, while maintaining full software compatibility with legacy StellarisWare drivers and tools.
Availability
LM3S5732-IQR50-A0 is available at Aetrix Electronics and suitable for motor control systems, sensor data aggregators, programmable logic controllers, and energy harvesting nodes requiring stable component supply and long-term industrial availability.
Supply support for LM3S5732-IQR50-A0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 90 years of innovation in industrial and automotive electronics.
The Stellaris LM3S series was designed specifically for cost-sensitive, real-time industrial control applications requiring robust analog integration, low-power hibernation, and deterministic interrupt response - targeting factory automation, building control, and motor drive markets.
FAQ
What is the maximum operating frequency of the LM3S5732-IQR50-A0?
The LM3S5732-IQR50-A0 operates at a maximum system clock frequency of 50 MHz, achieved using its internal PLL with an external crystal or internal precision oscillator. This frequency is fully supported across the entire industrial temperature range (–40°C to +105°C) and enables real-time execution of control loops with sub-microsecond latency. The LM3S5732-IQR50-A0 maintains timing compliance per TI SPMS090H datasheet Section 5.2.5.
Does the LM3S5732-IQR50-A0 support in-system programming via UART?
Yes, the LM3S5732-IQR50-A0 includes a factory-programmed ROM bootloader that supports UART-based in-application programming (IAP). This allows firmware updates without JTAG hardware, using only a standard RS-232 or TTL-level UART connection. The LM3S5732-IQR50-A0 bootloader is documented in TI Application Report SPMA075 and requires no external memory or custom loader code.
What is the purpose of the hibernate module in the LM3S5732-IQR50-A0?
The hibernate module in the LM3S5732-IQR50-A0 provides ultra-low-power operation with battery-backed real-time clock (RTC), 2 KB of hibernate RAM, and wake-on-alarm capability. It enables current draw below 1 µA while retaining timekeeping and critical state data - essential for battery-powered remote sensors and energy harvesting systems. The LM3S5732-IQR50-A0 hibernate module is detailed in Section 6 of the SPMS090H datasheet.
How many analog input channels does the LM3S5732-IQR50-A0 ADC support?
The LM3S5732-IQR50-A0 features a single 12-bit SAR ADC with eight analog input channels (AIN0–AIN7), organized into four independent sample sequencers. Each sequencer can be triggered by software, timer, or peripheral events, enabling flexible multi-channel acquisition. The LM3S5732-IQR50-A0 ADC also includes an internal temperature sensor and supports differential input mode for noise rejection.
Is the LM3S5732-IQR50-A0 pin-compatible with other Stellaris LM3S devices?
No, the LM3S5732-IQR50-A0 is not universally pin-compatible across the LM3S family. While it shares the 100-pin LQFP package with several variants (e.g., LM3S5742), pin functions differ - particularly for CAN, additional UARTs, or GPIO mappings. Direct substitution requires verification against each device's specific signal mapping table in the respective datasheet. The LM3S5732-IQR50-A0 pinout is defined in Table 4-1 of SPMS090H.
LM3S5732-IQR50-A0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-LQFP
- Series:
- Stellaris® ARM® Cortex®-M3S 5000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 33
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 6x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S5732-IQR50-A0 FAQ
1.How can I place an order for LM3S5732-IQR50-A0 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S5732-IQR50-A0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of LM3S5732-IQR50-A0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S5732-IQR50-A0 is usually 5 days.
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5.How can I obtain technical support or documentation for LM3S5732-IQR50-A0?
For technical support, including LM3S5732-IQR50-A0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S5732-IQR50-A0 requirements.
6.How does Aetrix verify that LM3S5732-IQR50-A0 is sourced from the original manufacturer or authorized distributors?
All LM3S5732-IQR50-A0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S5732-IQR50-A0 meets industry standards.
7.What is the process for return or replacement of LM3S5732-IQR50-A0?
All LM3S5732-IQR50-A0 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S5732-IQR50-A0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S5732-IQR50-A0 part is unused and in its original packaging.
Return procedure for LM3S5732-IQR50-A0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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