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Texas Instruments LM3S6432-EBZ50-A2

Part No.:
LM3S6432-EBZ50-A2
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
108-LFBGA
Datasheet:
AetrixLM3S6432-EBZ50-A2.pdf
Description:
IC MCU 32BIT 96KB FLASH 108BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,192

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Product details

Overview

LM3S6432-EBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 32 KB SRAM, integrated Ethernet MAC, dual UARTs, I²C, SSI, ADC (10-bit, 8-channel), PWM, and analog comparators. It operates at up to 50 MHz and supports industrial motor control and networked embedded systems.

For engineers reviewing the LM3S6432-EBZ50-A2 datasheet, LM3S6432-EBZ50-A2 pinout, LM3S6432-EBZ50-A2 application, or LM3S6432-EBZ50-A2 equivalent, key selection criteria include Ethernet MAC integration, 50 MHz operation, on-chip flash/SRAM size, peripheral set completeness (e.g., dual UART + I²C + SSI), and industrial temperature range support.

Technical Context

The LM3S6432-EBZ50-A2 implements the ARM Cortex-M3 core with NVIC, SysTick, and MPU, enabling deterministic real-time interrupt handling and memory protection. It integrates a full IEEE 802.3-compliant Ethernet MAC with MII interface and internal PHY support logic - no external PHY required for basic operation when paired with external magnetics.

Its analog subsystem includes an 8-channel, 10-bit SAR ADC with hardware averaging and two independent analog comparators with programmable reference. The PWM module provides six outputs with dead-band generation and fault protection, suitable for three-phase motor control.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3, 32-bit RISC, runs Thumb-2 instructions for compact code and high efficiency
Max Clock Speed50 MHz - enables real-time control loops with sub-10 µs interrupt latency
Flash Memory256 KB - sufficient for bootloader, protocol stacks (e.g., TCP/IP), and application firmware
SRAM32 KB - supports Ethernet frame buffering, stack space, and real-time data buffers
Ethernet InterfaceIntegrated MAC with MII - eliminates need for external MAC IC; requires external PHY and magnetics
ADC10-bit, 8-channel SAR with 1 MSPS sample rate and hardware averaging - suitable for sensor monitoring and closed-loop feedback
PWM Outputs6-channel, 16-bit resolution with configurable dead time and fault shutdown - directly drives gate drivers in motor inverters

Pinout & Package

LM3S6432-EBZ50-A2 is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per TI SPMS130J datasheet Rev E.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDCPower supply inputsSeparate digital (VDD), analog (VDDA), and core (VDDC) rails enable noise isolation for ADC and PLL stability
PA0–PA7, PB0–PB7, etc.GPIO banks A–GMulti-function pins supporting UART, SSI, I²C, PWM, and ADC inputs - configurable per peripheral mapping
RMII0/1Ethernet MII/RMII interfaceDedicated 12-pin RMII group (TXD0/1, RXD0/1, REFCLK, CRS_DV, TXEN, RXER) for direct PHY connection
USB0VBUS, USB0IDUSB OTG interfaceSupports device/host mode detection and VBUS sensing - requires external USB transceiver
XTAL, XTAL32Clock inputsPrimary 8–25 MHz crystal input for system clock; optional 32.768 kHz crystal for RTC

Key Features

FeatureDesign Value
Ethernet MAC with MII/RMIIReduces BOM count by integrating MAC logic - only external PHY and magnetics needed for full Ethernet connectivity
Hardware-accelerated PWM with fault protectionEnables safe, synchronized 3-phase motor drive with automatic shutdown on overcurrent or thermal fault signals
Programmable internal voltage reference for comparatorsEliminates need for external reference ICs - supports adaptive threshold detection in sensor interfaces
Integrated memory protection unit (MPU)Allows runtime partitioning of flash/SRAM to isolate firmware, stack, and peripheral drivers - improves system robustness
Multiple low-power sleep modes with wake-on-peripheralSupports <10 µA deep-sleep current with wake-up via GPIO, UART, or timer - extends battery life in remote nodes

Applications

Industrial Motor ControlNetworked Sensor Node

Use Scenario: Closed-loop control of BLDC or stepper motors in factory automation equipment with local HMI and remote diagnostics.

IC Role / Device Role / Timing Role: Main controller executing FOC algorithms, managing gate driver PWM, reading current/voltage sensors via ADC, and communicating over Ethernet.

Use Value: Integrated PWM with dead-band control and Ethernet MAC reduce component count and PCB area while enabling real-time motion coordination across networked PLCs.

Use Scenario: Environmental monitoring node deploying temperature, humidity, and vibration sensors in distributed industrial settings.

IC Role / Device Role / Timing Role: Data aggregator and edge processor that samples sensors, applies filtering, packages data, and transmits via Ethernet to SCADA systems.

Use Value: On-chip 256 KB flash stores firmware and protocol stacks (LwIP); 32 KB SRAM buffers multiple Ethernet frames and sensor history without external memory.

Building Automation GatewayEnergy Metering Interface

Use Scenario: Protocol translation gateway connecting Modbus RTU field devices to BACnet/IP or SNMP-based building management systems.

IC Role / Device Role / Timing Role: Dual-role processor running Modbus master/slave and TCP/IP stack simultaneously with deterministic UART-to-Ethernet bridging.

Use Value: Two UARTs + I²C + Ethernet allow concurrent serial fieldbus communication and IP network reporting - no external bridge IC required.

Use Scenario: Smart electricity meter with pulse counting, voltage/current measurement, and remote firmware update capability.

IC Role / Device Role / Timing Role: System-on-chip performing metrology calculations (via ADC), tamper detection (comparators), secure boot, and encrypted Ethernet updates.

Use Value: Internal analog comparators detect line voltage sags/swells; hardware CRC and MPU support secure firmware validation and memory integrity checks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM3S6965-IBZ50-A2Same core, 256 KB flash, but adds USB OTG controller and removes Ethernet MACBetter suited for USB-hosted human interface devices; lacks native Ethernet for wired infrastructureSelect when USB connectivity outweighs Ethernet needs and PHY components are undesirable
TM4C123GH6PMSuccessor family with same pinout, 256 KB flash, 32 KB SRAM, enhanced Ethernet MAC, and FPU optionSupports higher-level protocols (e.g., IPv6, TLS) and floating-point math for advanced control algorithmsChoose for new designs requiring extended lifecycle, enhanced security features, or future-proof protocol support

Compared with LM3S6432-EBZ50-A2, LM3S6965-IBZ50-A2 trades Ethernet for USB OTG - ideal for portable or HID-centric systems - while TM4C123GH6PM offers architectural upgrades including FPU, improved Ethernet, and longer manufacturer support, making it preferable for long-lifecycle industrial deployments.

Availability

LM3S6432-EBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, networked sensor nodes, building automation gateways, and energy metering interfaces requiring stable component supply and long-term availability assurance.

Supply support for LM3S6432-EBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, longevity, and industrial-grade performance.

The Stellaris LM3S series was designed specifically for cost-sensitive, real-time embedded applications requiring integrated peripherals - especially Ethernet, motor control, and mixed-signal interfacing - before the TM4C migration.

FAQ

What is the operating temperature range for LM3S6432-EBZ50-A2?

The LM3S6432-EBZ50-A2 is rated for industrial temperature operation from –40°C to +85°C. This range is validated per Texas Instruments' production data sheet SPMS130J and supports deployment in harsh environments such as factory floors, outdoor metering enclosures, and HVAC control panels where ambient conditions exceed commercial limits. The LM3S6432-EBZ50-A2 maintains full specification compliance across this range without derating.

Does LM3S6432-EBZ50-A2 include an integrated Ethernet PHY?

No, the LM3S6432-EBZ50-A2 integrates only the Ethernet MAC layer and supports MII/RMII physical interfaces. An external PHY IC (e.g., DP83848) and Ethernet magnetics are required for full 10/100 Mbps operation. The LM3S6432-EBZ50-A2 does not contain a PHY transceiver; its RMII interface drives differential signals to the external PHY, which handles line driving, signal encoding, and auto-negotiation.

What debug interface does LM3S6432-EBZ50-A2 support?

The LM3S6432-EBZ50-A2 supports JTAG and SWD (Serial Wire Debug) interfaces for programming and real-time debugging. Its Cortex-M3 core includes an Embedded Trace Macrocell (ETM) and SWO (Single Wire Output) trace port, enabling instruction tracing and variable watch without halting execution. TI's ICDI-based debuggers (e.g., Tiva C Series LaunchPad) and third-party tools like Segger J-Link fully support LM3S6432-EBZ50-A2 via standard ARM CMSIS-DAP protocols.

Can LM3S6432-EBZ50-A2 run the LwIP TCP/IP stack?

Yes, the LM3S6432-EBZ50-A2 has sufficient resources to run the lightweight LwIP TCP/IP stack in no-copy mode. With 32 KB of SRAM and integrated Ethernet MAC, it supports multiple concurrent sockets, DHCP, DNS, and HTTP server functionality - demonstrated in TI's official StellarisWare™ examples. The LM3S6432-EBZ50-A2's 50 MHz clock ensures adequate throughput for 10 Mbps Ethernet applications without requiring external memory.

Is LM3S6432-EBZ50-A2 pin-compatible with any newer TI microcontrollers?

The LM3S6432-EBZ50-A2 is not pin-compatible with newer TM4C devices despite shared footprint families - the TM4C123GH6PM uses identical 100-pin LQFP packaging but differs in power sequencing, reset behavior, and peripheral register mapping. While migration paths exist, board-level changes (e.g., decoupling, reset circuit, and clock configuration) are required. TI documents the LM3S6432-EBZ50-A2 as legacy; no drop-in replacements are offered.

LM3S6432-EBZ50-A2 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
108-LFBGA
Series:
Stellaris® ARM® Cortex®-M3S 6000
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 3x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S6432-EBZ50-A2 FAQ

1.How can I place an order for LM3S6432-EBZ50-A2 through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S6432-EBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S6432-EBZ50-A2 reliable?

The price and inventory of LM3S6432-EBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S6432-EBZ50-A2 is usually 5 days.

3.What payment methods are accepted for LM3S6432-EBZ50-A2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S6432-EBZ50-A2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LM3S6432-EBZ50-A2?

LM3S6432-EBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S6432-EBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S6432-EBZ50-A2?

For technical support, including LM3S6432-EBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S6432-EBZ50-A2 requirements.

6.How does Aetrix verify that LM3S6432-EBZ50-A2 is sourced from the original manufacturer or authorized distributors?

All LM3S6432-EBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S6432-EBZ50-A2 meets industry standards.

7.What is the process for return or replacement of LM3S6432-EBZ50-A2?

All LM3S6432-EBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S6432-EBZ50-A2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S6432-EBZ50-A2 part is unused and in its original packaging.

Return procedure for LM3S6432-EBZ50-A2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LM3S6432-EBZ50-A2 Tags

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