Texas Instruments LM3S6537-IBZ50-A2
- Part No.:
- LM3S6537-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S6537-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 96KB FLASH 108BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LM3S6537-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated Ethernet MAC, dual UARTs, I²C, SSI, ADC (12-bit, 8-channel), and hibernation module. It operates at 50 MHz and supports industrial temperature range (–40°C to +85°C) in a 100-pin LQFP package. Used in networked industrial controllers requiring deterministic real-time response and low-power hibernation.
For engineers reviewing the LM3S6537-IBZ50-A2 datasheet, LM3S6537-IBZ50-A2 pinout, LM3S6537-IBZ50-A2 application, or LM3S6537-IBZ50-A2 equivalent, key selection criteria include Ethernet MAC integration, hibernation current (≤1.9 µA), 50 MHz CPU clock, 100-pin LQFP mechanical compatibility, and StellarisWare® software support for rapid firmware development.
Technical Context
The LM3S6537-IBZ50-A2 implements the ARM Cortex-M3 core with NVIC, SysTick, and MPU, enabling deterministic interrupt latency and memory protection. Its integrated 10/100 Ethernet MAC supports MII interface and IEEE 802.3 compliance without external PHY control logic.
It features a dedicated hibernation module with battery-backed RTC, 2 KB hibernate RAM, and wake-up on RTC match or external GPIO. Analog subsystem includes a 12-bit, 1-MSPS ADC with four independent sample sequencers and internal temperature sensor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, supports Thumb-2 instruction set for code density and performance efficiency |
| Max Clock Speed | 50 MHz - enables real-time control loop execution within 20 ns resolution per instruction cycle |
| Flash Memory | 256 KB - sufficient for full TCP/IP stack, application firmware, and field-upgradable code images |
| SRAM | 64 KB - supports Ethernet frame buffering, RTOS kernel heap, and multi-threaded data structures |
| ADC Resolution | 12-bit - provides 4096 discrete levels for precision analog sensing in motor feedback or environmental monitoring |
| Hibernate Current | ≤1.9 µA - enables multi-year battery operation in remote sensor nodes with scheduled wake-up events |
| Operating Temp | –40°C to +85°C - qualified for deployment in uncontrolled industrial enclosures and outdoor automation cabinets |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PA0–PA7 | GPIO Port A | Configurable digital I/O with edge-triggered interrupts; PA0–PA3 support analog input for ADC0 |
| PD0–PD7 | GPIO Port D | Supports UART0 (PD0/Rx, PD1/Tx), SSI0 (PD0–PD3), and I²C0 (PD0/SDA, PD1/SCL) |
| PF0–PF4 | GPIO Port F | Includes NMI (PF0), user LED (PF1–PF4), and hibernate enable (PF4) |
| RMII_RX0–RMII_TXEN | Ethernet MAC Interface | Dedicated RMII pins for direct connection to external PHY without glue logic or level-shifting |
| HIB_RTCCLK | Hibernate Module Clock Input | Accepts 32.768 kHz crystal for autonomous RTC operation during hibernation mode |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Ethernet MAC | IEEE 802.3-compliant 10/100 Mbps MAC with 8-KB packet buffer and MII/RMII interface support |
| Hibernation Module | Ultra-low-power state with 2 KB battery-backed RAM, RTC, and wake-on-external-GPIO capability |
| ADC Architecture | 12-bit SAR ADC with four independent 8-step sequencers, hardware averaging, and internal temperature sensor |
| Peripheral Integration | Dual UARTs, two SSI modules, I²C master/slave, two 32-bit GPTMs, and watchdog timer all on-chip |
| Debug Interface | SWD/JTAG with TPIU trace support for real-time instruction tracing and non-intrusive debugging |
Applications
| Industrial Ethernet Gateway | Remote Environmental Sensor Node |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud-connected Ethernet backbone. IC Role / Device Role / Timing Role: Central controller executing real-time Modbus polling, TCP/IP stack, and secure OTA update handling. Use Value: Integrated Ethernet MAC eliminates PHY interface IC, reducing BOM cost and PCB area while maintaining deterministic 50 MHz timing for sub-10 ms polling cycles. | Use Scenario: Battery-powered air quality monitor deployed in HVAC ducts with periodic wireless upload via Ethernet gateway. IC Role / Device Role / Timing Role: Low-power system manager sampling CO₂, humidity, and temperature sensors every 15 minutes using hibernation wake-up timer. Use Value: Hibernate current ≤1.9 µA extends 2×AA battery life beyond 3 years, with RTC-driven wake-up ensuring precise measurement intervals. |
| Programmable Logic Controller (PLC) I/O Module | Smart Building Lighting Controller |
Use Scenario: DIN-rail mounted I/O expansion unit with digital inputs, relay outputs, and Ethernet supervision. IC Role / Device Role / Timing Role: Deterministic real-time executor of ladder logic scans synchronized to 10 ms control cycles. Use Value: Cortex-M3 NVIC ensures <1 µs interrupt latency for emergency stop signal processing, meeting IEC 61508 SIL-2 requirements. | Use Scenario: Occupancy-aware lighting panel controlling DALI ballasts and reporting energy usage over building LAN. IC Role / Device Role / Timing Role: Dual-role controller managing DALI communication and Ethernet-based BACnet/IP messaging. Use Value: Dual UARTs enable concurrent DALI master (UART1) and BACnet/IP (UART0 + Ethernet MAC) operation without resource contention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S6965-IBZ50-A2 | Same Cortex-M3 core and pinout, but adds USB 2.0 OTG controller and increases SRAM to 96 KB | Better suited for host-peripheral bridging (e.g., USB-to-Ethernet adapter); lacks hibernation current optimization | Select when USB device/host capability is required and ultra-low hibernate current is not critical |
| TM4C123GH6PM | Newer generation with same footprint, 80 MHz clock, 256 KB flash, 32 KB SRAM, and enhanced analog (12-bit, 1 MSPS, 16 channels) | Higher performance and extended peripheral set; requires firmware migration from StellarisWare to TivaWare | Select for new designs needing higher throughput or longer product lifecycle; not drop-in compatible due to register map changes |
Compared with LM3S6537-IBZ50-A2, LM3S6965-IBZ50-A2 adds USB but sacrifices hibernation efficiency, while TM4C123GH6PM delivers higher clock speed and more ADC channels but mandates software requalification and lacks identical hibernation module behavior.
Availability
LM3S6537-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial gateways, remote sensor nodes, PLC I/O modules, and smart building controllers requiring stable component supply and long-term obsolescence management.
Supply support for LM3S6537-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions across industrial, automotive, and communications markets.
The Stellaris LM3S family was designed specifically for cost-sensitive, real-time industrial control applications requiring integrated connectivity, deterministic timing, and low-power hibernation-prioritizing Ethernet-ready MCU functionality before the TM4C series.
FAQ
What is the maximum operating frequency of the LM3S6537-IBZ50-A2?
The LM3S6537-IBZ50-A2 operates at a maximum CPU clock frequency of 50 MHz, as specified in the production data sheet (DS-LM3S6537-15852.2743). This frequency is achieved using the internal PLL with an external 6 MHz crystal, and it defines the upper bound for instruction execution, peripheral timing, and real-time control loop performance. The LM3S6537-IBZ50-A2 maintains this speed across its full industrial temperature range (–40°C to +85°C).
Does the LM3S6537-IBZ50-A2 include an integrated Ethernet PHY?
No, the LM3S6537-IBZ50-A2 integrates only the Ethernet MAC layer-not the physical layer (PHY). It supports both MII and RMII interfaces to connect externally to standard 10/100 PHY ICs such as the DP83848 or LAN8720. The LM3S6537-IBZ50-A2 provides all MAC registers, DMA control, and packet buffering, but requires an external PHY for signal-level Ethernet transmission and reception.
What is the hibernation current specification for the LM3S6537-IBZ50-A2?
The LM3S6537-IBZ50-A2 achieves a typical hibernation current of ≤1.9 µA when configured with the internal RTC running from a 32.768 kHz crystal and 2 KB of hibernate RAM retained. This value is measured under production test conditions per the official Texas Instruments datasheet (SPMS131I, July 2014). The LM3S6537-IBZ50-A2 uses dedicated hibernation power gating to isolate non-essential circuitry while preserving RTC and RAM state.
How many ADC channels does the LM3S6537-IBZ50-A2 support, and what is their resolution?
The LM3S6537-IBZ50-A2 includes a single 12-bit successive approximation register (SAR) ADC with up to 8 external input channels (AIN0–AIN7) and one internal temperature sensor channel. It supports simultaneous sampling via four independent 8-step sequencers, enabling flexible trigger sources and hardware averaging. The LM3S6537-IBZ50-A2 ADC achieves 1 MSPS aggregate sampling rate with configurable sample-and-hold timing.
Is the LM3S6537-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
The LM3S6537-IBZ50-A2 is pin-compatible with other 100-pin LQFP Stellaris MCUs in the LM3S6xxx series, including LM3S6965-IBZ50-A2 and LM3S6100-IBZ50-A2, sharing identical mechanical footprint and core peripheral pin assignments (e.g., UART, SSI, I²C, GPIO). However, differences exist in peripheral enablement and register mapping-so while PCB layout may be reused, firmware must be validated per device. The LM3S6537-IBZ50-A2 does not share pinout with TM4C123x devices despite similar packaging.
LM3S6537-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 6000
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 41
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S6537-IBZ50-A2 FAQ
1.How can I place an order for LM3S6537-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S6537-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S6537-IBZ50-A2 reliable?
The price and inventory of LM3S6537-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S6537-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S6537-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S6537-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S6537-IBZ50-A2?
LM3S6537-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S6537-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S6537-IBZ50-A2?
For technical support, including LM3S6537-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S6537-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S6537-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S6537-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S6537-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S6537-IBZ50-A2?
All LM3S6537-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S6537-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S6537-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S6537-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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