Texas Instruments LM3S6537-IBZ50-A2T
- Part No.:
- LM3S6537-IBZ50-A2T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S6537-IBZ50-A2T.pdf
- Description:
- IC MCU 32BIT 96KB FLASH 108BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,118
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S6537-IBZ50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated Ethernet MAC, dual UARTs, I²C, SSI, ADC (8-channel, 12-bit), and hibernation module. It operates at 50 MHz and supports industrial temperature range (–40°C to +85°C) in a 100-pin LQFP package. Used in networked industrial controllers requiring real-time control and wired connectivity.
For engineers reviewing the LM3S6537-IBZ50-A2T datasheet, LM3S6537-IBZ50-A2T pinout, LM3S6537-IBZ50-A2T application, or LM3S6537-IBZ50-A2T equivalent, key selection criteria include Ethernet MAC integration, hibernation support for low-power wake-up, 50 MHz CPU clock, industrial-grade thermal rating, and peripheral set alignment with deterministic motor or sensor node designs.
Technical Context
The LM3S6537-IBZ50-A2T implements the ARM Cortex-M3 core with NVIC, SysTick, and MPU, enabling deterministic interrupt handling and memory protection. Its system-level peripherals include a hibernation module with RTC, battery-backed RAM, and wake-on-external-event capability.
It integrates an IEEE 802.3-compliant Ethernet MAC with MII interface, two UARTs supporting IrDA/SIR, one I²C master/slave, two SSI modules, and an 8-channel 12-bit ADC with hardware averaging-enabling single-chip networked sensing and control without external PHY or protocol offload.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 50 MHz maximum operation - enables real-time deterministic execution with Thumb-2 instruction set and <12-cycle interrupt latency. |
| Memory | 256 KB on-chip flash + 64 KB SRAM - sufficient for standalone Ethernet stack (e.g., uIP/LwIP) and application firmware without external memory. |
| Temperature Range | –40°C to +85°C - qualified for industrial environments including factory automation and remote monitoring enclosures. |
| Ethernet Interface | Integrated MAC with MII pins - eliminates need for external MAC/PHY IC; requires external 10/100 PHY (e.g., DP83848) for physical layer. |
| ADC | 8-channel, 12-bit SAR with hardware averaging - supports precision analog input sampling (e.g., current/voltage sensing) with configurable sample sequencing. |
| Hibernation Module | RTC + battery-backed 2 KB RAM + wake-on-RTC-match/external-pin - enables ultra-low-power sleep states with sub-µA current draw and fast wake-up. |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard PCB assembly processes and provides full peripheral pin access. |
Pinout & Package
LM3S6537-IBZ50-A2T is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with exposed thermal pad, JEDEC MS-026AC compliant. Pinout supports full multiplexing of GPIO, UART, I²C, SSI, Ethernet MII, ADC, and timer functions across Port A–F.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital core (VDD), analog (VDDA), and regulator bypass (VDDC) rails - require separate 3.3 V filtering per section to ensure ADC accuracy and digital stability. |
| PD0–PD7, PE0–PE5, PF0–PF4 | Ethernet MII interface | Direct connection to external PHY (e.g., TXD[3:0], RXD[3:0], TX_EN, CRS, COL, RX_ER) - no glue logic needed for MII timing compliance. |
| PA0–PA7, PB0–PB7 | UART0/UART1 signals | Configurable as UART0 (PA0/PA1) or UART1 (PB0/PB1); also support SSI/I²C alternate functions - enables flexible serial peripheral routing. |
| PC0–PC7 | ADC input channels | Eight dedicated analog inputs (AIN0–AIN7) with internal reference - supports simultaneous sampling via sequencer-triggered conversion without software polling. |
| HIB, RTCCLK, HIBRST | Hibernation control | Enable deep-sleep entry (HIB), external RTC clock input (RTCCLK), and hibernate reset (HIBRST) - allows autonomous wake-up without main CPU intervention. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Ethernet MAC | Reduces BOM count by eliminating external MAC; supports MII interface with full-duplex 10/100 Mbps operation and DMA-assisted packet buffering. |
| Hibernation Module with RTC | Enables sub-µA sleep current with battery-backed RAM retention and precise wake-up timing - critical for battery-powered remote nodes. |
| Hardware ADC Averaging | Performs up to 64-sample averaging in hardware to improve effective resolution and reduce noise without CPU overhead. |
| Nested Vectored Interrupt Controller (NVIC) | Supports 64 interrupt sources with 8 priority levels and tail-chaining - ensures minimal latency for time-critical events like PWM fault detection or encoder capture. |
| Memory Protection Unit (MPU) | Enforces privilege-based access to flash, SRAM, and peripherals - enhances reliability in safety-aware applications such as industrial PLCs. |
Applications
| Industrial Ethernet Node | Smart Sensor Hub |
|---|---|
Use Scenario: Standalone field device collecting analog sensor data and transmitting over wired Ethernet to SCADA systems. IC Role / Device Role / Timing Role: Primary controller executing real-time acquisition, protocol stack (LwIP), and Ethernet frame generation with deterministic timing. Use Value: Integrated MAC and hibernation enable compact, low-power, self-contained node design without external networking ICs or sleep controllers. | Use Scenario: Multi-sensor aggregator (temperature, pressure, humidity) with local preprocessing and Ethernet backhaul in HVAC systems. IC Role / Device Role / Timing Role: Central data fusion unit managing concurrent ADC sampling, I²C sensor reads, and buffered Ethernet transmission. Use Value: Hardware ADC averaging and 64 KB SRAM allow high-fidelity sensor data processing before transmission, reducing host-side computational load. |
| Programmable Logic Controller (PLC) I/O Module | Networked Motor Controller |
Use Scenario: DIN-rail mounted I/O expansion module with digital input/output, analog input, and Ethernet connectivity for distributed control. IC Role / Device Role / Timing Role: Real-time I/O scheduler coordinating GPIO state changes, ADC conversions, and cyclic Ethernet messaging (e.g., Modbus TCP). Use Value: NVIC priority grouping and 50 MHz Cortex-M3 core guarantee sub-millisecond response to fieldbus events and hardware interrupts. | Use Scenario: Brushless DC motor drive with current sensing, commutation logic, and remote configuration via Ethernet. IC Role / Device Role / Timing Role: Motion control processor executing FOC algorithms, PWM generation, and closed-loop feedback using ADC and timer peripherals. Use Value: Dual general-purpose timers with PWM and capture modes support precise three-phase gate driving and rotor position tracking. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S6965-IBZ50-A2T | Same core and package, but includes USB OTG controller and lacks hibernation module; 256 KB flash, 64 KB SRAM. | Better suited for USB-hosted human interface devices; not suitable where battery-backed RTC wake-up is required. | Select LM3S6537-IBZ50-A2T when hibernation and Ethernet-only connectivity are prioritized over USB. |
| TM4C123GH6PM | Successor family with enhanced peripherals (USB, CAN), higher clock (80 MHz), same 100-pin LQFP, but no hibernation module; 256 KB flash, 32 KB SRAM. | Offers broader interface support and higher performance, but requires redesign for hibernation-dependent power management. | Choose TM4C123GH6PM for new designs needing USB/CAN or higher throughput; retain LM3S6537-IBZ50-A2T for legacy hibernation-critical deployments. |
Compared with LM3S6537-IBZ50-A2T, LM3S6965-IBZ50-A2T trades hibernation for USB, while TM4C123GH6PM upgrades performance and interface breadth but removes hibernation - making LM3S6537-IBZ50-A2T uniquely suited for low-power, Ethernet-only industrial endpoints requiring autonomous RTC wake-up.
Availability
LM3S6537-IBZ50-A2T is available at Aetrix Electronics and suitable for industrial Ethernet nodes, smart sensor hubs, programmable logic controller (PLC) I/O modules, and networked motor controllers requiring stable component supply and long-term lifecycle support.
Supply support for LM3S6537-IBZ50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with decades of industrial and automotive qualification expertise.
The Stellaris LM3S series was designed specifically for cost-sensitive, real-time industrial control applications requiring integrated connectivity (Ethernet, UART, I²C), low-power operation, and deterministic interrupt response - targeting factory automation, building control, and remote monitoring.
FAQ
What is the maximum operating frequency of the LM3S6537-IBZ50-A2T?
The LM3S6537-IBZ50-A2T operates at a maximum CPU frequency of 50 MHz, as specified in its production data sheet. This speed is achieved using the internal PLL with a crystal or external clock source. The 50 MHz rating applies across the full industrial temperature range (–40°C to +85°C) and is validated under worst-case voltage and process corners. LM3S6537-IBZ50-A2T maintains timing compliance without derating in typical 3.3 V supply conditions.
Does the LM3S6537-IBZ50-A2T include an integrated Ethernet PHY?
No, the LM3S6537-IBZ50-A2T integrates only the Ethernet MAC layer and requires an external PHY IC (e.g., TI DP83848 or Microchip LAN8720) for physical layer signaling. Its MII interface provides all necessary signals (TXD/RXD, TX_EN, CRS, COL, etc.) with timing compliant to IEEE 802.3. LM3S6537-IBZ50-A2T does not support RMII or internal PHY functionality.
What power-saving features does the LM3S6537-IBZ50-A2T support?
The LM3S6537-IBZ50-A2T includes a dedicated hibernation module with RTC, battery-backed 2 KB RAM, and wake-on-RTC-match or external pin assertion. In hibernate mode, it draws less than 1.5 µA (typical) from VBAT. Additional low-power modes include sleep and deep-sleep, controlled via the Cortex-M3 SCB. LM3S6537-IBZ50-A2T's hibernation capability is hardware-automated and does not require CPU intervention to maintain time or memory state.
Is the LM3S6537-IBZ50-A2T pin-compatible with other Stellaris LM3S devices?
No, the LM3S6537-IBZ50-A2T is not universally pin-compatible with other LM3S devices. While it shares the 100-pin LQFP package with some variants (e.g., LM3S6965), pin functions differ significantly - especially for Ethernet MII, hibernation, and peripheral mapping. LM3S6537-IBZ50-A2T has unique signal assignments for HIB, RTCCLK, and PD/PE MII pins that are not replicated identically in other family members.
What development tools are supported for the LM3S6537-IBZ50-A2T?
The LM3S6537-IBZ50-A2T is supported by Texas Instruments' StellarisWare Peripheral Driver Library, Code Composer Studio v5–6, and IAR Embedded Workbench. TI's LM3S811 Evaluation Kit and EK-LM3S6965 kits provide hardware reference platforms, though direct LM3S6537-IBZ50-A2T evaluation boards were discontinued after 2014. LM3S6537-IBZ50-A2T firmware can be debugged via JTAG/SWD using XDS100v2 or Segger J-Link adapters.
LM3S6537-IBZ50-A2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 6000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 41
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S6537-IBZ50-A2T FAQ
1.How can I place an order for LM3S6537-IBZ50-A2T through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S6537-IBZ50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S6537-IBZ50-A2T reliable?
The price and inventory of LM3S6537-IBZ50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S6537-IBZ50-A2T is usually 5 days.
3.What payment methods are accepted for LM3S6537-IBZ50-A2T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S6537-IBZ50-A2T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S6537-IBZ50-A2T?
LM3S6537-IBZ50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S6537-IBZ50-A2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S6537-IBZ50-A2T?
For technical support, including LM3S6537-IBZ50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S6537-IBZ50-A2T requirements.
6.How does Aetrix verify that LM3S6537-IBZ50-A2T is sourced from the original manufacturer or authorized distributors?
All LM3S6537-IBZ50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S6537-IBZ50-A2T meets industry standards.
7.What is the process for return or replacement of LM3S6537-IBZ50-A2T?
All LM3S6537-IBZ50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S6537-IBZ50-A2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S6537-IBZ50-A2T part is unused and in its original packaging.
Return procedure for LM3S6537-IBZ50-A2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S6537-IBZ50-A2T Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

