My Inquiry
My Account
Texas Instruments LM3S6911-IBZ50-A2
- Part No.:
- LM3S6911-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S6911-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,008
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S6911-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated Ethernet MAC, dual UARTs, I²C, SSI, analog comparators, and hibernation module. It operates at 50 MHz, supports -40°C to +85°C industrial temperature range, and targets embedded control in networked industrial devices.
For engineers reviewing the LM3S6911-IBZ50-A2 datasheet, LM3S6911-IBZ50-A2 pinout, LM3S6911-IBZ50-A2 application, or LM3S6911-IBZ50-A2 equivalent, key selection criteria include Ethernet MAC integration, hibernation power management, 100-pin LQFP package, 50 MHz operation, and industrial-grade temperature rating.
Technical Context
The LM3S6911-IBZ50-A2 implements the ARM Cortex-M3 core with NVIC, SysTick, MPU, and debug support including JTAG and SWD interfaces. Its system-level architecture integrates a dedicated hibernation module with RTC, battery-backed memory, and wake-up sources independent of main power.
Peripherals include a full 10/100 Ethernet MAC (no PHY), two UARTs with IrDA/SIR support, one I²C master/slave interface, two SSI controllers, eight GPIO ports, four general-purpose timers (including RTC mode), and two analog comparators with internal voltage reference.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, supports Thumb-2 instruction set for code density and performance efficiency |
| Max Clock Speed | 50 MHz - determines real-time response latency and peripheral throughput limits |
| Flash Memory | 256 KB - sufficient for standalone firmware with protocol stacks (e.g., TCP/IP, Modbus) |
| SRAM | 64 KB - supports Ethernet frame buffering, stack allocation, and real-time data processing |
| Operating Temp | -40°C to +85°C - qualified for uncontrolled industrial environments without forced cooling |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard surface-mount assembly and thermal relief design |
| Supply Voltage | 3.3 V ±10% - single-rail operation simplifies power design versus multi-voltage MCUs |
Pinout & Package
LM3S6911-IBZ50-A2 is housed in a 100-pin LQFP package (JEDEC MS-026AC) with exposed thermal pad. Pin functions are defined per TI SPMS139I datasheet Section 16 (Pin Diagram) and Section 17 (Signal Tables).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital, analog, and core domains each have dedicated 3.3 V inputs to minimize noise coupling and ensure ADC/timer accuracy |
| GND, GNDA, GNDC | Ground returns | Separate ground planes for digital, analog, and core reduce return-path interference in mixed-signal operation |
| ETH0_RX+, ETH0_RX−, ETH0_TX+, ETH0_TX− | Ethernet differential pairs | Direct connection to external PHY; requires impedance-controlled PCB routing (100 Ω differential) |
| PA0–PA7, PB0–PB7, etc. | GPIO port pins | Configurable as digital I/O, alternate functions (UART, SSI, I²C), or timer capture/compare outputs |
| HIB, RTCCLK, HIBRST | Hibernation control signals | Enable ultra-low-power sleep state with RTC wake-up and battery-backed RAM retention |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Ethernet MAC | Enables direct connection to external PHY without external controller; supports IEEE 802.3 10/100 Mbps base-T operation |
| Hibernation Module | Reduces current draw to 1.7 µA typical while retaining RTC time, wake-up capability, and 2 KB battery-backed SRAM |
| Dual UART with IrDA/SIR | Supports serial diagnostics, legacy device interfacing, and infrared remote control via hardware-encoded pulse modulation |
| Analog Comparators | Two independent comparators with programmable reference (internal 1.65 V or external) for threshold detection without ADC overhead |
| ARM Cortex-M3 Core | Delivers deterministic interrupt latency (<12 cycles), memory protection unit (MPU), and integrated debug infrastructure (SWD/JTAG) |
Applications
| Industrial Ethernet Gateway | Smart Sensor Node |
|---|---|
Use Scenario: Protocol translation between fieldbus (Modbus RTU) and Ethernet/IP in factory automation cabinets. IC Role / Device Role / Timing Role: Central controller executing real-time task scheduling, TCP/IP stack, and dual-protocol bridging logic. Use Value: Integrated Ethernet MAC eliminates external MAC+PHY IC, reducing BOM count and PCB area while maintaining deterministic timing via Cortex-M3 NVIC. | Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and motion data with periodic Ethernet upload. IC Role / Device Role / Timing Role: Low-power host managing sensor interfaces, hibernation scheduling, and burst-mode Ethernet transmission. Use Value: Hibernation module enables 1.7 µA sleep current with RTC wake-up, extending battery life to >5 years on AA cells. |
| Networked Motor Controller | Building Automation Panel |
Use Scenario: Compact drive interface receiving speed commands over Ethernet and generating PWM for BLDC motor commutation. IC Role / Device Role / Timing Role: Real-time executor of closed-loop control algorithms with precise timer-triggered PWM generation and Ethernet command parsing. Use Value: Four general-purpose timers (including 32-bit RTC mode) provide synchronized PWM, input capture, and watchdog supervision without external timing ICs. | Use Scenario: Wall-mounted HVAC controller integrating local UI, sensor inputs, relay outputs, and centralized BACnet/IP communication. IC Role / Device Role / Timing Role: System-on-chip managing display refresh, button debounce, relay timing, and Ethernet packet handling. Use Value: Dual UARTs support simultaneous RS-485 (BACnet MS/TP) and debug console; I²C interfaces ambient sensors and EEPROM for configuration storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S6965-IBZ50-A2 | Same core and peripherals but adds USB 2.0 OTG controller and increases SRAM to 96 KB; no hibernation module | Better suited for USB-hosted human interface devices; lacks battery-backed RTC and low-power hibernation | Select when USB connectivity is required and ultra-low-power sleep is not critical |
| TM4C123GH6PM | Successor family with same Cortex-M4F core, 256 KB flash, 32 KB SRAM, integrated PHY option, and enhanced analog features | Higher floating-point performance and updated peripheral set; requires layout revision due to different pinout and package (64-pin LQFP vs. 100-pin) | Select for new designs needing higher computational throughput or integrated Ethernet PHY support |
Compared with LM3S6911-IBZ50-A2, LM3S6965-IBZ50-A2 trades hibernation capability for USB functionality, while TM4C123GH6PM offers architectural upgrades and modern toolchain support but requires PCB redesign - making LM3S6911-IBZ50-A2 optimal for legacy-compatible, Ethernet-enabled, ultra-low-power industrial control.
Availability
LM3S6911-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial gateways, smart sensor nodes, networked motor controllers, and building automation panels requiring stable component supply and long-term lifecycle support.
Supply support for LM3S6911-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and wireless technologies for industrial, automotive, and consumer markets.
The Stellaris LM3S series was designed as the first ARM Cortex-M3-based microcontroller family for cost-sensitive, connected industrial applications - emphasizing integrated Ethernet, deterministic real-time control, and low-power operation.
FAQ
What is the maximum operating frequency of the LM3S6911-IBZ50-A2?
The LM3S6911-IBZ50-A2 operates at a maximum clock frequency of 50 MHz, as specified in the Texas Instruments SPMS139I datasheet. This speed is achieved using the internal PLL with an external crystal or oscillator input. The 50 MHz rating applies across the full industrial temperature range (-40°C to +85°C) and 3.3 V supply, ensuring consistent real-time performance in demanding embedded environments. All peripherals-including Ethernet MAC, UARTs, and timers-are fully functional at this rate.
Does the LM3S6911-IBZ50-A2 include an integrated Ethernet PHY?
No, the LM3S6911-IBZ50-A2 includes only an Ethernet MAC layer-not a physical layer (PHY). It provides differential transmit and receive pairs (ETH0_TX±, ETH0_RX±) that must connect to an external 10/100BASE-TX PHY IC. This architecture allows design flexibility in PHY selection (e.g., for ESD robustness or transformerless operation) and avoids fixed PHY limitations. The LM3S6911-IBZ50-A2 handles MAC-layer framing, filtering, and DMA, but relies on external components for signal conditioning and line driving.
What power-saving features does the LM3S6911-IBZ50-A2 support?
The LM3S6911-IBZ50-A2 features a dedicated hibernation module enabling ultra-low-power operation: it achieves 1.7 µA typical current draw while retaining RTC time, wake-up capability, and 2 KB of battery-backed SRAM. Additional modes include sleep (core clock gated), deep-sleep (peripheral clocks gated), and shutdown (all clocks off except hibernation domain). Wake-up sources include GPIO edges, RTC match, and external hibernate reset-making LM3S6911-IBZ50-A2 suitable for battery-powered remote monitoring where energy efficiency is critical.
Which development tools are officially supported for the LM3S6911-IBZ50-A2?
Texas Instruments officially supports Keil MDK-ARM, IAR Embedded Workbench for ARM, and TI's Code Composer Studio v5.x for the LM3S6911-IBZ50-A2. Debugging uses standard ARM Cortex-M3 interfaces: SWD (2-pin) and JTAG (5-pin), both supported by TI's ICDI-based debug probes (e.g., Tiva C Series LaunchPad debug circuitry). StellarisWare Peripheral Driver Library and pre-certified TCP/IP stack (FreeRTOS + lwIP) are provided for rapid firmware development targeting LM3S6911-IBZ50-A2 applications.
Is the LM3S6911-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
The LM3S6911-IBZ50-A2 is not universally pin-compatible across the LM3S family. While it shares the 100-pin LQFP package with several variants (e.g., LM3S6965), pin functions differ significantly-especially for USB, hibernation, and analog peripherals. For example, LM3S6965 repurposes hibernation pins for USB D+/D−, and LM3S811 uses a different pinout entirely. Therefore, LM3S6911-IBZ50-A2 requires its own validated layout; migration to other LM3S parts demands schematic and PCB revision, even within the same package footprint.
LM3S6911-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 6000
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 46
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S6911-IBZ50-A2 FAQ
1.How can I place an order for LM3S6911-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S6911-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S6911-IBZ50-A2 reliable?
The price and inventory of LM3S6911-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S6911-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S6911-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S6911-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S6911-IBZ50-A2?
LM3S6911-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S6911-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S6911-IBZ50-A2?
For technical support, including LM3S6911-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S6911-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S6911-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S6911-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S6911-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S6911-IBZ50-A2?
All LM3S6911-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S6911-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S6911-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S6911-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S6911-IBZ50-A2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
