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Texas Instruments LM3S6911-IBZ50-A2T
- Part No.:
- LM3S6911-IBZ50-A2T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S6911-IBZ50-A2T.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,042
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Product details
Overview
LM3S6911-IBZ50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated Ethernet MAC, dual UARTs, I²C, SSI, analog comparators, and hibernation module. It operates at 50 MHz, supports -40°C to +85°C industrial temperature range, and targets embedded control in networked industrial sensors and motor drives.
For engineers reviewing the LM3S6911-IBZ50-A2T datasheet, LM3S6911-IBZ50-A2T pinout, LM3S6911-IBZ50-A2T application, or LM3S6911-IBZ50-A2T equivalent, key selection criteria include Ethernet MAC integration, hibernation power management, 50 MHz real-time performance, and LQFP-100 package compatibility with StellarisWare firmware support.
Technical Context
The LM3S6911-IBZ50-A2T implements the ARM Cortex-M3 core with NVIC, SysTick, MPU, and debug interfaces (JTAG/SWD). Its system-level architecture integrates a dedicated hibernation module with RTC, battery-backed memory, and wake-on-external-event capability.
Peripherals include a full Ethernet MAC (MII interface), two UARTs with IrDA/SIR support, one I²C master/slave, two SSI controllers, eight GPIO ports, four general-purpose timers (including RTC mode), and two analog comparators - all clocked from a configurable PLL-based system clock up to 50 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, 50 MHz max operation |
| Memory | 256 KB on-chip flash (programmable in 1 KB sectors), 64 KB SRAM |
| Temperature Range | -40°C to +85°C industrial grade, qualified per TI production data |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant |
| Ethernet Interface | Integrated MAC layer only (no PHY); requires external MII PHY for 10/100 Mbps connectivity |
| Hibernation Module | Dedicated low-power domain with RTC, battery-backed 256-byte RAM, and wake-on-interrupt capability |
| Timers | Four 32/16-bit GPTMs: two 32-bit (one configurable as RTC), two 16-bit (PWM/capture) |
Pinout & Package
LM3S6911-IBZ50-A2T is housed in a 100-pin LQFP package (package code "BZ") with exposed thermal pad. Pin assignments are defined per TI SPMS139I datasheet Section 16 (Pin Diagram) and Section 17 (Signal Tables).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Separate digital (VDD), analog (VDDA), and core (VDDC) rails enable noise isolation for ADC/comparator operation |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO port pins | Eight configurable GPIO ports (A–H) with programmable drive strength, slew rate, and pull-up/down |
| EMAC0_RX, EMAC0_TX | Ethernet MAC signals | MII interface pins (RXD[3:0], TXD[3:0], TXEN, CRS, COL, RXER, TXER, MDIO, MDC) for external PHY connection |
| HIBERNATE | Hibernation control | Active-low input enabling hibernation entry; asserts internal reset and powers down non-hibernate domains |
| RTCCLK, HIBRTCVDD | Hibernation timing | External 32.768 kHz crystal input and dedicated hibernate rail for RTC/battery-backed memory retention |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Ethernet MAC | Enables deterministic real-time networking without external controller; reduces BOM count and PCB area vs. external MAC+PHY solutions |
| Hibernation Module | Reduces system standby current to ~1.5 µA while retaining RTC time and 256 bytes of memory - critical for battery-powered remote sensors |
| ARM Cortex-M3 Core | Delivers 1.25 DMIPS/MHz efficiency with hardware divide, single-cycle multiply, and bit-band addressing for atomic peripheral register access |
| Dual UART with SIR/IrDA | Supports infrared communication and serial protocol bridging without external transceivers - simplifies human-interface and legacy device integration |
| Configurable Clock System | Internal precision oscillator (±1.5%), PLL with 5–200 MHz output, and multiple clock sources allow dynamic trade-offs between performance and power |
Applications
| Industrial Ethernet Sensor Node | Smart Motor Control Module |
|---|---|
Use Scenario: Remote temperature/pressure sensor node with wired Ethernet backhaul in factory automation. IC Role / Device Role / Timing Role: Main controller executing sensor acquisition, local PID loop, and TCP/IP stack via StellarisWare Ethernet libraries. Use Value: Integrated MAC eliminates external Ethernet controller; hibernation extends battery life during idle periods between scheduled readings. | Use Scenario: Compact BLDC motor driver with position feedback, current sensing, and fieldbus connectivity. IC Role / Device Role / Timing Role: Real-time motion controller managing PWM generation, encoder capture, and EtherNet/IP messaging. Use Value: 50 MHz Cortex-M3 ensures sub-10 µs interrupt latency for commutation timing; dual UARTs support debugging and host command interface. |
| Programmable Logic Controller (PLC) I/O Module | Building Automation Gateway |
Use Scenario: DIN-rail mounted I/O expansion module with digital inputs, relay outputs, and Modbus TCP connectivity. IC Role / Device Role / Timing Role: Protocol gateway translating Modbus RTU over RS-485 to Modbus TCP over Ethernet. Use Value: Dual UARTs handle isolated RS-485 channels; Ethernet MAC enables direct IP stack integration without external NIC. | Use Scenario: HVAC controller aggregating BACnet MS/TP devices and connecting to building management system via Ethernet. IC Role / Device Role / Timing Role: Network-aware edge controller running BACnet/IP stack and local scheduling logic. Use Value: On-chip hibernation maintains time-of-day and schedule state during AC power loss; I²C and GPIO support sensor/actuator interfacing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S6965-IBZ50-A2T | Same core, package, and temp grade; adds 10/100 Ethernet PHY, USB 2.0 OTG, and 12-bit 1-MSPS ADC | Eliminates need for external PHY and USB transceiver; supports higher-resolution analog sensing | Select when USB host/device capability or integrated PHY is required - increases cost and power vs. LM3S6911-IBZ50-A2T |
| TM4C123GH6PGE | Successor family (Tiva C); same Cortex-M4F core, 80 MHz, enhanced peripherals, but different pinout and memory map | Requires PCB redesign and firmware migration; offers FPU, CAN, and advanced PWM features | Select for new designs needing floating-point math or CAN bus - not drop-in compatible with LM3S6911-IBZ50-A2T |
Compared with LM3S6911-IBZ50-A2T, LM3S6965-IBZ50-A2T provides integrated Ethernet PHY and USB, reducing external components but increasing BOM cost; TM4C123GH6PGE delivers higher performance and new peripherals but mandates full hardware and software redesign.
Availability
LM3S6911-IBZ50-A2T is available at Aetrix Electronics and suitable for industrial Ethernet gateways, motor control modules, PLC I/O expansions, and battery-backed sensor nodes requiring stable component supply across extended product lifecycles.
Supply support for LM3S6911-IBZ50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and wireless technologies since 1930.
The Stellaris LM3S series was designed as the industry's first ARM Cortex-M3-based microcontroller family, targeting real-time industrial control with integrated connectivity, low-power hibernation, and deterministic interrupt response.
FAQ
Does LM3S6911-IBZ50-A2T include an integrated Ethernet PHY?
No, LM3S6911-IBZ50-A2T contains only the Ethernet MAC layer. An external MII-compatible PHY (e.g., DP83848) is required for physical-layer connectivity. This separation allows design flexibility in PHY selection, voltage levels, and ESD protection while maintaining consistent MAC firmware across variants.
What is the maximum operating frequency of LM3S6911-IBZ50-A2T?
The LM3S6911-IBZ50-A2T operates at a maximum system clock frequency of 50 MHz, achieved via its on-chip PLL driven by either the internal precision oscillator or an external crystal. This frequency is specified across the full -40°C to +85°C industrial temperature range and 3.0–3.6 V supply.
How does the hibernation module in LM3S6911-IBZ50-A2T reduce power consumption?
The hibernation module in LM3S6911-IBZ50-A2T powers down the main CPU, flash, SRAM, and most peripherals while retaining RTC timekeeping and 256 bytes of battery-backed memory. In hibernate mode, typical current draw is 1.5 µA (with RTC active), enabling multi-year battery life in intermittent-sensing applications.
Is LM3S6911-IBZ50-A2T pin-compatible with other Stellaris LM3S devices?
LM3S6911-IBZ50-A2T uses a 100-pin LQFP package shared with several LM3S devices (e.g., LM3S6965), but pin functions differ significantly - especially for Ethernet, USB, and analog peripherals. Direct replacement requires verification of signal mapping, power sequencing, and firmware compatibility; it is not guaranteed pin-compatible across the family.
What development tools support LM3S6911-IBZ50-A2T firmware development?
LM3S6911-IBZ50-A2T is supported by TI's StellarisWare Peripheral Driver Library, Keil MDK-ARM, IAR Embedded Workbench, and GCC-based toolchains. Debugging uses JTAG or SWD via TI XDS100v2 or Segger J-Link probes; evaluation is possible on the original Stellaris DK-LM3S9B96 development kit.
LM3S6911-IBZ50-A2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 6000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 46
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S6911-IBZ50-A2T FAQ
1.How can I place an order for LM3S6911-IBZ50-A2T through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S6911-IBZ50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S6911-IBZ50-A2T reliable?
The price and inventory of LM3S6911-IBZ50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S6911-IBZ50-A2T is usually 5 days.
3.What payment methods are accepted for LM3S6911-IBZ50-A2T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S6911-IBZ50-A2T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S6911-IBZ50-A2T?
LM3S6911-IBZ50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S6911-IBZ50-A2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S6911-IBZ50-A2T?
For technical support, including LM3S6911-IBZ50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S6911-IBZ50-A2T requirements.
6.How does Aetrix verify that LM3S6911-IBZ50-A2T is sourced from the original manufacturer or authorized distributors?
All LM3S6911-IBZ50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S6911-IBZ50-A2T meets industry standards.
7.What is the process for return or replacement of LM3S6911-IBZ50-A2T?
All LM3S6911-IBZ50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S6911-IBZ50-A2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S6911-IBZ50-A2T part is unused and in its original packaging.
Return procedure for LM3S6911-IBZ50-A2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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