Texas Instruments LM3S6918-IBZ50-A2
- Part No.:
- LM3S6918-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S6918-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,829
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S6918-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated Ethernet MAC, dual UARTs, I²C, SSI, ADC (10-bit, 1 MSPS), and hibernation module. It operates at 50 MHz and supports industrial motor control and networked sensor nodes.
For engineers reviewing the LM3S6918-IBZ50-A2 datasheet, LM3S6918-IBZ50-A2 pinout, LM3S6918-IBZ50-A2 application, or LM3S6918-IBZ50-A2 equivalent, key selection criteria include Ethernet MAC integration, hibernation power management, 50 MHz CPU clock, and QFP-100 package compatibility for space-constrained industrial gateways.
Technical Context
The LM3S6918-IBZ50-A2 implements the ARM Cortex-M3 core with NVIC, SysTick, and MPU-enabling deterministic real-time interrupt handling and memory protection. Its system-level peripherals include a full IEEE 802.3-compliant Ethernet MAC with MII interface and internal PHY support logic.
It integrates a hibernation module with RTC, battery-backed RAM (2 KB), and wake-on-external-pin capability, enabling sub-5 µA deep-sleep operation. Analog subsystem includes eight-channel 10-bit ADC with hardware averaging and temperature sensor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs at up to 50 MHz |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface and 128-byte erase blocks |
| SRAM | 64 KB on-chip SRAM with single-cycle access |
| Ethernet Interface | IEEE 802.3-compliant MAC with MII interface and integrated PHY control logic |
| ADC | 10-bit SAR ADC, 1 MSPS sampling rate, 8-channel input with hardware averaging |
| Hibernation Module | Supports sub-5 µA deep-sleep mode with RTC, battery-backed 2 KB RAM, and external wake-up |
| Package | 100-pin LQFP (14 mm × 14 mm), RoHS-compliant, Pb-free |
Pinout & Package
LM3S6918-IBZ50-A2 is housed in a 100-pin LQFP (14 mm × 14 mm) package with exposed thermal pad. Pin functions are defined per TI SPMS140I datasheet revision July 2014.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital core (VDD), analog (VDDA), and clock domain (VDDC) supplies-each require local 0.1 µF decoupling |
| GND | Ground reference | Multiple dedicated GND pins for analog/digital separation and EMI reduction |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO banks | Configurable digital I/O with slew-rate control, weak pull-up/down, and interrupt capability per pin |
| RMII_TXD0, RMII_TXD1, RMII_TXEN, RMII_RXD0, RMII_RXD1, RMII_CRS_DV, RMII_REF_CLK | Ethernet MII/RMII interface | Direct connection to external PHY without glue logic; supports both MII and reduced-pin RMII modes |
| HIB_RTCCLK, HIB_WAKE, HIB_NRES | Hibernation control | Enable RTC timekeeping during sleep, external wake-up trigger, and hibernate reset assertion |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Ethernet MAC | Enables standalone wired connectivity without external MAC controller or protocol stack offload |
| Hibernation with RTC & Battery-Backed RAM | Allows long-term data logging in battery-powered remote sensors with precise time-stamping |
| Hardware-Averaged 10-bit ADC | Reduces firmware overhead for noise-sensitive industrial analog measurements (e.g., current sensing) |
| ARM Cortex-M3 with MPU | Supports memory isolation between firmware modules-critical for certified industrial safety applications |
| Dual UART + I²C + SSI | Provides concurrent serial communication paths for sensor aggregation, diagnostics, and host interfacing |
Applications
| Industrial Motor Control Gateway | Networked Environmental Sensor Node |
|---|---|
Use Scenario: Central controller aggregating feedback from multiple BLDC drives via UART/SSI while relaying status over Ethernet. IC Role / Device Role / Timing Role: Real-time motor sequencing coordinator with deterministic interrupt latency and Ethernet-based telemetry upload. Use Value: Eliminates need for external Ethernet PHY driver IC and reduces BOM count by integrating MAC + hibernation + ADC in one die. | Use Scenario: Battery-powered outdoor air quality monitor transmitting CO₂, humidity, and temperature data hourly via Ethernet. IC Role / Device Role / Timing Role: Low-power system manager that samples sensors, timestamps readings via RTC, and wakes only to transmit. Use Value: Achieves multi-year battery life using sub-5 µA hibernate mode and hardware-averaged ADC for stable sensor readings. |
| Programmable Logic Controller (PLC) I/O Module | Building Automation Controller |
Use Scenario: DIN-rail mounted I/O expansion unit with digital inputs, analog inputs, and Ethernet backhaul to SCADA. IC Role / Device Role / Timing Role: Deterministic I/O processor executing ladder logic scan cycles with synchronized timestamping of edge events. Use Value: MPU-enforced memory partitioning isolates control logic from communication stacks-meeting IEC 61131-3 runtime safety requirements. | Use Scenario: HVAC zone controller managing thermostats, dampers, and occupancy sensors across a commercial floor. IC Role / Device Role / Timing Role: Multi-protocol hub supporting I²C sensors, UART-connected actuators, and Ethernet-based BACnet/IP gateway. Use Value: Dual UARTs and I²C allow concurrent commissioning and field maintenance while maintaining real-time HVAC loop timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S8962-IQC50-A2 | Same Cortex-M3 core, 256 KB flash, but adds CAN controller and removes Ethernet MAC | Better suited for automotive body control or industrial fieldbus networks where CAN dominates over Ethernet | Select when CAN bus integration is required and Ethernet is unnecessary |
| TM4C123GH6PM | Successor family with same pinout, 256 KB flash, 32 KB SRAM, added USB OTG, higher clock (80 MHz), no hibernation module | Preferred for USB-hosted human interfaces or higher-performance control loops; lacks sub-5 µA hibernate | Select for new designs needing USB or higher CPU throughput; not drop-in due to hibernation removal |
Compared with LM3S6918-IBZ50-A2, LM3S8962-IQC50-A2 trades Ethernet for CAN-making it ideal for vehicle networks-while TM4C123GH6PM offers USB and speed at the cost of ultra-low-power hibernation, requiring redesign if deep-sleep energy budget is critical.
Availability
LM3S6918-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control gateways, networked environmental sensor nodes, programmable logic controller (PLC) I/O modules, and building automation controllers requiring stable component supply and long-term lifecycle support.
Supply support for LM3S6918-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and wireless technologies for industrial, automotive, and consumer markets.
The Stellaris LM3S series was designed as the first ARM Cortex-M3-based microcontroller family targeting cost-sensitive, real-time industrial control applications with integrated connectivity and low-power operation.
FAQ
What is the maximum operating frequency of the LM3S6918-IBZ50-A2?
The LM3S6918-IBZ50-A2 operates at a maximum CPU clock frequency of 50 MHz, as specified in the Texas Instruments SPMS140I datasheet. This frequency is achieved using the internal PLL with an external crystal or oscillator input. The device maintains full peripheral functionality-including Ethernet MAC and ADC-at this rated speed, and all timing parameters in the datasheet assume operation at 50 MHz.
Does the LM3S6918-IBZ50-A2 include an integrated Ethernet PHY?
No, the LM3S6918-IBZ50-A2 includes only an IEEE 802.3-compliant Ethernet MAC with MII/RMII interface logic-it does not integrate a physical layer (PHY). An external PHY chip (e.g., DP83848) must be used. The LM3S6918-IBZ50-A2 provides all necessary MAC control signals, clock outputs, and data lanes to interface directly with standard 10/100 Mbps PHYs without additional glue logic.
What power modes does the LM3S6918-IBZ50-A2 support, and what is its lowest sleep current?
The LM3S6918-IBZ50-A2 supports Sleep, Deep-Sleep, and Hibernate modes. In Hibernate mode-with RTC running and 2 KB battery-backed RAM active-the typical current draw is less than 5 µA, as measured under specified conditions in the SPMS140I datasheet. This mode retains state across power loss and enables wake-up via external pin, RTC alarm, or HIB_WAKE signal.
Is the LM3S6918-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
The LM3S6918-IBZ50-A2 uses a 100-pin LQFP package shared with several LM3S devices (e.g., LM3S8962), but pin functions differ significantly across variants. While mechanical footprint matches, signal mapping-including Ethernet, hibernation, and peripheral assignments-is unique to the LM3S6918-IBZ50-A2. Migration requires full pinout validation and schematic review; it is not a drop-in replacement for other LM3S parts.
What development tools and software support are available for the LM3S6918-IBZ50-A2?
Texas Instruments provided official support for the LM3S6918-IBZ50-A2 via StellarisWare Peripheral Driver Library, Code Composer Studio v5.x, and IAR Embedded Workbench. TI discontinued active development after the TM4C transition, but legacy tools remain functional. Aetrix Electronics supplies archived binaries, datasheets, and hardware design guides-including schematics for EK-LM3S6965 evaluation kit-to support ongoing maintenance and legacy production.
LM3S6918-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 6000
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S6918-IBZ50-A2 FAQ
1.How can I place an order for LM3S6918-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S6918-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S6918-IBZ50-A2 reliable?
The price and inventory of LM3S6918-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S6918-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S6918-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S6918-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S6918-IBZ50-A2?
LM3S6918-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S6918-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S6918-IBZ50-A2?
For technical support, including LM3S6918-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S6918-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S6918-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S6918-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S6918-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S6918-IBZ50-A2?
All LM3S6918-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S6918-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S6918-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S6918-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S6918-IBZ50-A2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

