Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments LM3S6965-IBZ50-A2

Part No.:
LM3S6965-IBZ50-A2
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
108-LFBGA
Datasheet:
AetrixLM3S6965-IBZ50-A2.pdf
Description:
IC MCU 32BIT 256KB FLASH 108BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,011

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LM3S6965-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated Ethernet MAC, dual UARTs, I²C, SSI, ADC (10-bit, 8-channel), and hibernation module. It operates at 50 MHz and supports industrial temperature range (–40°C to +85°C) in a 100-pin LQFP package. It serves as main system controller in networked industrial sensors and programmable logic controllers.

For engineers reviewing the LM3S6965-IBZ50-A2 datasheet, LM3S6965-IBZ50-A2 pinout, LM3S6965-IBZ50-A2 application, or LM3S6965-IBZ50-A2 equivalent, key selection criteria include Ethernet MAC integration, hibernation mode current (1.7 µA), 50 MHz clock speed, 100-pin LQFP mechanical compatibility, and Cortex-M3 debug support via JTAG/SWD.

Technical Context

The LM3S6965-IBZ50-A2 implements the ARMv7-M architecture with NVIC, SysTick, MPU, and integrated TPIU for trace. Its system-level interface includes AMBA AHB/APB buses connecting CPU to peripherals including Ethernet MAC, dual UARTs, and SSI controllers.

It integrates a dedicated hibernation module with battery-backed RTC, 2 KB hibernate memory, and wake-up capability from GPIO, RTC match, or external interrupt. The ADC subsystem supports hardware averaging across up to 64 samples per channel and differential input mode on selected channels.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3, 32-bit RISC, 50 MHz max operation - enables deterministic real-time control with Thumb-2 instruction set and low-latency interrupt handling.
Memory256 KB flash + 64 KB SRAM - sufficient for standalone firmware with Ethernet stack, RTOS, and sensor processing without external memory.
PeripheralsEthernet MAC (MII/RMII), 2× UART, I²C, SSI, 8-channel 10-bit ADC, hibernation module - supports wired industrial networking and low-power remote monitoring.
Package100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard PCB assembly processes and provides full peripheral pin access.
Temperature Range–40°C to +85°C - qualified for deployment in uncontrolled industrial enclosures and outdoor automation equipment.
Hibernate Current1.7 µA typical - enables multi-year battery life in wireless sensor nodes when combined with RTC wake-up and GPIO event triggers.

Pinout & Package

LM3S6965-IBZ50-A2 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm lead pitch and exposed thermal pad. Pin assignments follow TI's standardized Stellaris LM3S6965 pinout layout for consistent board design across the family.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDCPower supply inputsDigital (VDD), analog (VDDA), and core (VDDC) rails require independent 3.3 V regulation and local decoupling for noise isolation.
GND, GNDA, GNDCGround returnsAnalog (GNDA) and core (GNDC) grounds must be star-connected to digital ground to minimize ADC noise coupling.
PD0–PD7, PE0–PE5, PF0–PF4, etc.GPIO banksConfigurable as digital I/O, alternate function (UART/SSI/I²C), or analog input - enables flexible peripheral routing without redesign.
RMII_TXD0, RMII_TXD1, RMII_TXEN, RMII_RXD0, RMII_RXD1, RMII_CRS_DV, RMII_REF_CLKEthernet RMII interfaceDirect connection to RMII-compliant PHY (e.g., DP83848) with no external glue logic required.
HIB, HIB_RTCCLK, HIB_WAKEHibernation controlEnables ultra-low-power sleep state entry/exit using external battery backup and wake-on-event capability.

Key Features

FeatureDesign Value
Integrated Ethernet MACFull MII/RMII support eliminates need for external MAC controller; reduces BOM count and PCB area in networked edge devices.
Hibernation Module1.7 µA hibernate current with battery-backed RTC and 2 KB SRAM retention - enables long-life battery operation in remote telemetry systems.
ADC Hardware AveragingUp to 64-sample hardware averaging per conversion - improves effective resolution and reduces software filtering overhead in noisy industrial environments.
Cortex-M3 Debug InterfaceJTAG and SWD support with TPIU trace - enables real-time code profiling, breakpoint debugging, and production firmware validation.
Peripheral MultiplexingMultiple alternate functions per GPIO pin (e.g., UART0TX on PA0 or PD6) - increases layout flexibility and simplifies routing in dense 100-pin LQFP designs.

Applications

Industrial Ethernet NodeRemote Sensor Gateway

Use Scenario: Standalone PLC I/O module communicating over Ethernet to SCADA host.

IC Role / Device Role / Timing Role: Main system controller executing real-time I/O scanning, protocol stack (Modbus TCP), and Ethernet frame handling.

Use Value: Integrated Ethernet MAC avoids external PHY+MAC IC, reducing latency and component count while maintaining deterministic 50 MHz timing for cycle-accurate I/O updates.

Use Scenario: Battery-powered environmental sensor node aggregating temperature, humidity, and vibration data.

IC Role / Device Role / Timing Role: Central data acquisition and low-power scheduler managing ADC sampling, wireless transmission intervals, and hibernation cycles.

Use Value: 1.7 µA hibernate current and RTC wake-up enable >5-year battery life; hardware ADC averaging ensures stable readings without CPU intervention.

Programmable Logic ControllerNetworked Motor Control

Use Scenario: Compact DIN-rail mounted PLC with discrete I/O, analog inputs, and Ethernet connectivity.

IC Role / Device Role / Timing Role: Real-time execution engine for ladder logic, motion control loops, and deterministic communication scheduling.

Use Value: 50 MHz Cortex-M3 core with NVIC priority grouping ensures sub-millisecond response to emergency stop signals and precise PWM timing for servo drive interfaces.

Use Scenario: Brushless DC motor controller with position feedback, current sensing, and EtherCAT slave interface.

IC Role / Device Role / Timing Role: Motion control processor coordinating PWM generation, ADC-based current loop sampling, and Ethernet synchronization.

Use Value: Dual UARTs support encoder feedback and host diagnostics; SSI interface connects to absolute position sensors; 100-pin LQFP provides dedicated PWM and ADC pins with minimal crosstalk.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM3S8962-IQC50-A2Same Cortex-M3 core, 256 KB flash, but adds CAN controller and removes Ethernet MAC; 144-pin LQFP package.Better suited for automotive body control or industrial fieldbus networks requiring CAN FD, not Ethernet.Select when CAN bus integration is mandatory and Ethernet is unnecessary; requires PCB redesign due to larger package and different pinout.
TM4C123GH6PMSuccessor device with same pinout, 256 KB flash, 32 KB SRAM, enhanced Ethernet PHY interface, and FPU option; operates up to 80 MHz.Supports higher-performance real-time control and IEEE 1588 PTP timestamping for synchronized motion systems.Preferred for new designs needing extended lifecycle, FPU for floating-point math, or IEEE 1588 compliance; drop-in replacement only if using TM4C-compatible firmware stack.

Compared with LM3S8962-IQC50-A2, the LM3S6965-IBZ50-A2 trades CAN for Ethernet and uses a smaller 100-pin footprint; compared with TM4C123GH6PM, it lacks FPU and IEEE 1588 support but maintains legacy StellarisWare compatibility and lower power in hibernate mode.

Availability

LM3S6965-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial automation, networked sensor systems, and programmable logic controllers requiring stable component supply, long-term obsolescence management, and verified second-source alternatives.

Supply support for LM3S6965-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 90 years of innovation in industrial and automotive electronics.

The Stellaris LM3S series was designed as the first ARM Cortex-M3-based microcontroller family for cost-sensitive, real-time industrial control applications-emphasizing integrated connectivity, low-power hibernation, and deterministic peripheral timing.

FAQ

What is the maximum operating frequency of the LM3S6965-IBZ50-A2?

The LM3S6965-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz. This speed is achieved using the internal PLL driven by the precision 12 MHz crystal oscillator or external clock source. The 50 MHz rating applies across the full industrial temperature range (–40°C to +85°C) and is validated in TI's production test flow for the LM3S6965-IBZ50-A2 part number specifically.

Does the LM3S6965-IBZ50-A2 include an integrated Ethernet PHY?

No, the LM3S6965-IBZ50-A2 integrates only the Ethernet MAC layer-not the physical layer (PHY). It supports both MII and RMII interfaces and requires an external PHY such as the DP83848 or LAN8720 for physical Ethernet connectivity. The LM3S6965-IBZ50-A2 provides all necessary MAC registers, DMA buffers, and interrupt signaling for full TCP/IP stack implementation.

What is the hibernate current specification for the LM3S6965-IBZ50-A2?

The LM3S6965-IBZ50-A2 achieves a typical hibernate current of 1.7 µA when the hibernation module is active, RTC is running from external battery, and 2 KB of SRAM is retained. This value is measured under specified conditions in the official Texas Instruments datasheet DS-LM3S6965-15852.2743 and applies to the LM3S6965-IBZ50-A2 variant with its factory-programmed trim settings.

Which development tools support the LM3S6965-IBZ50-A2?

The LM3S6965-IBZ50-A2 is supported by Texas Instruments' StellarisWare Peripheral Driver Library, Code Composer Studio v5.x, and IAR Embedded Workbench for ARM. It is also compatible with the original Stellaris DK-LM3S9B92 and EK-LM3S8962 evaluation kits via socket adapter or PCB redesign. Debugging uses standard JTAG or SWD interfaces present on the LM3S6965-IBZ50-A2 silicon.

Is the LM3S6965-IBZ50-A2 pin-compatible with other LM3S devices?

The LM3S6965-IBZ50-A2 shares the same 100-pin LQFP package and core pinout with LM3S618, LM3S6432, and LM3S6610 variants, but peripheral pin mappings differ significantly across the family. For example, Ethernet RMII signals appear on different GPIO banks in LM3S618 versus LM3S6965-IBZ50-A2. Therefore, direct PCB reuse is not guaranteed without verification against each device's specific pin configuration table.

LM3S6965-IBZ50-A2 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
108-LFBGA
Series:
Stellaris® ARM® Cortex®-M3S 6000
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
Ethernet, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
42
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S6965-IBZ50-A2 FAQ

1.How can I place an order for LM3S6965-IBZ50-A2 through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S6965-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S6965-IBZ50-A2 reliable?

The price and inventory of LM3S6965-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S6965-IBZ50-A2 is usually 5 days.

3.What payment methods are accepted for LM3S6965-IBZ50-A2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S6965-IBZ50-A2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LM3S6965-IBZ50-A2?

LM3S6965-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S6965-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S6965-IBZ50-A2?

For technical support, including LM3S6965-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S6965-IBZ50-A2 requirements.

6.How does Aetrix verify that LM3S6965-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?

All LM3S6965-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S6965-IBZ50-A2 meets industry standards.

7.What is the process for return or replacement of LM3S6965-IBZ50-A2?

All LM3S6965-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S6965-IBZ50-A2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S6965-IBZ50-A2 part is unused and in its original packaging.

Return procedure for LM3S6965-IBZ50-A2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LM3S6965-IBZ50-A2 Tags

  • LM3S6965-IBZ50-A2
  • LM3S6965-IBZ50-A2 PDF
  • LM3S6965-IBZ50-A2 Datasheet
  • LM3S6965-IBZ50-A2 Specifications
  • LM3S6965-IBZ50-A2 Images
  • Texas Instruments
  • Texas Instruments LM3S6965-IBZ50-A2
  • Buy LM3S6965-IBZ50-A2
  • LM3S6965-IBZ50-A2 Price
  • LM3S6965-IBZ50-A2 Distributor
  • LM3S6965-IBZ50-A2 Supplier
  • LM3S6965-IBZ50-A2 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER