Texas Instruments LM3S801-EQN50-C2
- Part No.:
- LM3S801-EQN50-C2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
LM3S801-EQN50-C2.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 48LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LM3S801-EQN50-C2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 8 kB flash, 2 kB SRAM, and integrated peripherals including UART, I²C, SSI, PWM, QEI, analog comparator, and watchdog timer. It operates at up to 50 MHz and targets low-cost, space-constrained embedded control applications such as motor drive monitoring and sensor interface modules.
For engineers reviewing the LM3S801-EQN50-C2 datasheet, LM3S801-EQN50-C2 pinout, LM3S801-EQN50-C2 application, or LM3S801-EQN50-C2 equivalent, key selection criteria include its 50 MHz CPU clock, 24-pin QFN package, single UART channel, absence of ADC, and fixed 8 kB flash/2 kB RAM configuration - all critical for legacy Stellaris-based BOM continuity and footprint-limited designs.
Technical Context
The LM3S801-EQN50-C2 implements the ARMv7-M architecture with Thumb-2 instruction set, NVIC supporting up to 32 interrupt lines, and SysTick timer. Its memory map includes 8 kB on-chip flash (programmable in 1-kB sectors) and 2 kB SRAM, both accessible at full CPU speed without wait states.
Peripherals are register-mapped into the APB bus hierarchy: UART0, I²C0, SSI0, two 16/32-bit GPTM timers, one watchdog timer, one analog comparator, one QEI module, and eight GPIO pins with alternate functions. No USB, CAN, or Ethernet interfaces are integrated.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, supports Thumb-2 instructions and hardware divide |
| Max Clock Frequency | 50 MHz - determines real-time response latency and peripheral throughput ceiling |
| Flash Memory | 8 kB - sufficient for small firmware images; no bootloader pre-installed |
| SRAM | 2 kB - limits stack depth and dynamic data allocation in bare-metal or RTOS use |
| Package | 24-pin QFN (4×4 mm, 0.5 mm pitch) - surface-mount, thermally enhanced, no exposed pad |
| Operating Voltage | 3.3 V nominal (2.25 V to 3.63 V) - requires stable LDO supply; no internal voltage regulator for core logic |
| Temperature Range | –40°C to +85°C - qualified for industrial ambient environments |
Pinout & Package
LM3S801-EQN50-C2 is housed in a 24-pin QFN package (4 mm × 4 mm, 0.5 mm pitch), with no thermal pad. Pin assignments are defined per TI SPMS146I datasheet Section 16 (Pin Diagram) and Section 17.1 (Signals by Pin Number).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O Supply | 3.3 V main power input; must be decoupled locally with 0.1 µF ceramic capacitor |
| GND | Ground Reference | Digital ground return; shared with analog ground (no separate AGND pin) |
| GPIOA0 / U0RX | UART0 Receive Input | Primary serial receive path; also configurable as general-purpose digital input/output |
| GPIOA1 / U0TX | UART0 Transmit Output | Primary serial transmit path; open-drain capable only when configured as GPIO |
| GPIOA2 / I2C0SCL | I²C Clock Output/Input | Open-drain output with internal pull-up; requires external 4.7 kΩ pull-up for I²C operation |
| GPIOA3 / I2C0SDA | I²C Data Input/Output | Open-drain bidirectional line; shares same external pull-up requirement as SCL |
| GPIOA4 / SSI0CLK | SSI Clock Output | Master-mode clock output for SPI-compatible synchronous serial communication |
| GPIOA5 / SSI0FSS | SSI Frame Select Output | Active-low chip select for slave device synchronization in SSI master mode |
| GPIOA6 / SSI0RX | SSI Receive Input | Serial data input from slave device; sampled on SSI0CLK rising edge |
| GPIOA7 / SSI0TX | SSI Transmit Output | Serial data output to slave device; driven on SSI0CLK falling edge |
| GPIOB0 / WDOG0 | Watchdog Reset Output | Active-low reset signal asserted if watchdog timer expires without service |
| GPIOB1 / QEI0PHAA | Quadrature Encoder Phase A Input | Dedicated input for incremental encoder position sensing; supports edge counting and direction detection |
| GPIOB2 / QEI0PHBA | Quadrature Encoder Phase B Input | Complementary quadrature input; phase shift relative to PHAA determines rotation direction |
| GPIOB3 / QEI0IDX | Index Pulse Input | Optional homing/reference pulse input for absolute position alignment in motion systems |
| GPIOB4 / COMP0 | Analog Comparator Output | Digital output reflecting comparison result between internal reference and selected analog input |
| GPIOB5 / NMI | Non-Maskable Interrupt Input | Edge-triggered input for highest-priority system fault or emergency event handling |
| GPIOB6 / FAULT0 | PWM Fault Input | Asynchronous shutdown trigger for PWM outputs during overcurrent or thermal fault conditions |
| GPIOB7 / PWM0 | PWM Output Channel 0 | Configurable duty-cycle and frequency output; supports dead-band generation when paired with PWM1 |
| RESET | Active-Low Reset Input | Hardware reset assertion; internal pull-up ensures valid state during power-up |
| OSC0 / OSC1 | Crystal Oscillator Inputs | Accepts 4–8 MHz crystal; internal oscillator circuit provides system clock source |
| SWCLK / SWDIO | ARM Serial Wire Debug Interface | Two-pin debug interface replacing JTAG; enables programming and real-time debugging via SWD protocol |
| TEST / NMI | Test Mode Entry / NMI Input | Multi-function pin: held low during power-up to enter ROM bootloader mode; otherwise serves as NMI |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-M3 Core | Single-cycle 32-bit multiply, hardware divide, and bit-band addressing for efficient peripheral register access |
| Integrated Peripherals | UART0, I²C0, SSI0, two GPTMs, WDT, QEI, analog comparator, and eight GPIOs - eliminates need for external support ICs in basic control nodes |
| No ADC Included | Reduces die size and cost; design must use external ADC or rely on comparator-based threshold detection |
| ROM Bootloader | Factory-programmed 2 kB bootloader supports UART-based firmware update without debugger hardware |
| Low-Power Sleep Modes | Three sleep modes (sleep, deep-sleep, power-down) with wake-on-GPIO, UART, or timer events - extends battery life in portable devices |
Applications
| Motor Control Monitoring | Sensor Interface Node |
|---|---|
|
Use Scenario: Compact feedback controller for BLDC motor drives using quadrature encoder signals and PWM gate timing. IC Role / Device Role / Timing Role: Real-time QEI position capture, PWM waveform generation with fault shutdown, and UART-based telemetry reporting. Use Value: Enables closed-loop commutation without external logic; 50 MHz clock ensures sub-microsecond timing resolution for 20 kHz PWM switching. |
Use Scenario: Low-power environmental sensor aggregator collecting data from I²C temperature/humidity sensors and transmitting via UART to host MCU. IC Role / Device Role / Timing Role: I²C master for sensor polling, UART transmitter for data relay, and watchdog supervision for system reliability. Use Value: Integrates essential communication and supervision functions in 4×4 mm footprint; eliminates discrete level-shifters or bus buffers. |
| Industrial Panel Controller | Legacy Equipment Retrofit |
|
Use Scenario: Standalone HMI front-end for machine status display and button-driven mode selection in factory automation panels. IC Role / Device Role / Timing Role: GPIO-managed pushbutton scanning, UART-connected display driver, and periodic watchdog refresh. Use Value: Provides deterministic response to user inputs with <10 µs GPIO interrupt latency; 2 kB SRAM suffices for state-machine-based UI logic. |
Use Scenario: Drop-in replacement for obsolete 8-bit MCUs in field-deployed equipment requiring minimal PCB rework. IC Role / Device Role / Timing Role: Firmware-executing control unit with identical pinout compatibility to legacy 24-pin DIP/SOIC packages via adapter board. Use Value: Maintains existing signal routing while enabling C-based firmware upgrades and improved EMI immunity over older architectures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Tiva C TM4C123GH6PM | ARM Cortex-M4F core, 256 kB flash, 32 kB SRAM, integrated ADC, USB, and CAN - significantly higher resource count and feature set | Supports complex signal processing, USB HID devices, and automotive diagnostics; not pin-compatible | Select when upgrading legacy LM3S801 designs requiring more memory, analog acquisition, or modern connectivity |
| LM3S328-EQN50-C2 | Same package and pinout; 64 kB flash, 8 kB SRAM, added ADC and additional UART/SSI/I²C channels | Enables analog sensor integration and multi-interface communication without layout change | Choose for drop-in hardware upgrade where board space is constrained but firmware complexity increases |
Compared with LM3S801-EQN50-C2, TM4C123GH6PM offers scalable performance and modern peripherals but requires full redesign, while LM3S328-EQN50-C2 delivers immediate memory and analog capability uplift within identical mechanical constraints.
Availability
LM3S801-EQN50-C2 is available at Aetrix Electronics and suitable for motor control monitoring, sensor interface nodes, industrial panel controllers, and legacy equipment retrofit requiring stable component supply and long-term obsolescence management.
Supply support for LM3S801-EQN50-C2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of industrial-grade MCU development expertise.
The Stellaris LM3S series was designed specifically for cost-sensitive, real-time embedded control applications demanding ARM architecture benefits in compact footprints - targeting industrial, building automation, and appliance markets.
FAQ
What is the maximum operating frequency of the LM3S801-EQN50-C2?
The LM3S801-EQN50-C2 operates at a maximum system clock frequency of 50 MHz. This rating is validated across the full industrial temperature range (–40°C to +85°C) and 3.3 V supply. The clock is derived from an internal PLL fed by an external 4–8 MHz crystal connected to OSC0/OSC1, and the 50 MHz limit reflects guaranteed timing closure for all on-chip logic and peripherals in the LM3S801-EQN50-C2 silicon revision.
Does the LM3S801-EQN50-C2 include an analog-to-digital converter (ADC)?
No, the LM3S801-EQN50-C2 does not integrate an ADC. Its analog peripheral set is limited to a single analog comparator (COMP0) with programmable internal voltage reference. Designers requiring analog signal digitization must add an external ADC, as confirmed in the "Peripheral Summary" table (Section 1.1) and electrical characteristics (Section 19.1.6) of the LM3S801-EQN50-C2 datasheet.
What debug interface does the LM3S801-EQN50-C2 support?
The LM3S801-EQN50-C2 supports ARM Serial Wire Debug (SWD) via dedicated SWCLK and SWDIO pins. It does not implement full JTAG; the debug port uses a two-wire interface compatible with standard ARM Cortex-M debug probes. This is documented in Section 4 ("JTAG Interface") of the LM3S801-EQN50-C2 datasheet, which clarifies SWD as the primary debug method for this device family.
Is the LM3S801-EQN50-C2 pin-compatible with other Stellaris devices?
The LM3S801-EQN50-C2 shares the same 24-pin QFN package and pinout with other LM3Sxx devices in the EQN50 variant group, including LM3S328-EQN50-C2 and LM3S101-EQN50-C2. Pin compatibility is explicitly verified in TI's "Pin Diagram" (Section 16) and "Signals by Pin Number" (Section 17.1) for the LM3S801-EQN50-C2 datasheet, enabling direct substitution where peripheral requirements align.
What is the purpose of the TEST/NMI pin on the LM3S801-EQN50-C2?
The TEST/NMI pin on the LM3S801-EQN50-C2 serves dual roles: during power-up, it enters ROM bootloader mode when held low, enabling UART-based firmware updates; otherwise, it functions as a non-maskable interrupt input. This behavior is defined in Section 5.2.1 ("Device Identification") and Section 17.5 ("Connections for Unused Signals") of the LM3S801-EQN50-C2 datasheet.
LM3S801-EQN50-C2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-LQFP
- Series:
- Stellaris® ARM® Cortex®-M3S 800
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S801-EQN50-C2 FAQ
1.How can I place an order for LM3S801-EQN50-C2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S801-EQN50-C2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S801-EQN50-C2 reliable?
The price and inventory of LM3S801-EQN50-C2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S801-EQN50-C2 is usually 5 days.
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Once your LM3S801-EQN50-C2 order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for LM3S801-EQN50-C2?
For technical support, including LM3S801-EQN50-C2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S801-EQN50-C2 requirements.
6.How does Aetrix verify that LM3S801-EQN50-C2 is sourced from the original manufacturer or authorized distributors?
All LM3S801-EQN50-C2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S801-EQN50-C2 meets industry standards.
7.What is the process for return or replacement of LM3S801-EQN50-C2?
All LM3S801-EQN50-C2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S801-EQN50-C2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S801-EQN50-C2 part is unused and in its original packaging.
Return procedure for LM3S801-EQN50-C2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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