My Inquiry
My Account
Texas Instruments LM3S808-EGZ50-C2
- Part No.:
- LM3S808-EGZ50-C2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
LM3S808-EGZ50-C2.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,378
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S808-EGZ50-C2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 64 KB flash, 24 KB SRAM, integrated ADC (10-bit, 1 MSPS), dual UARTs, I²C, SSI, and PWM-capable timers. It operates at 50 MHz and supports motor control and industrial sensing applications.
For engineers reviewing the LM3S808-EGZ50-C2 datasheet, LM3S808-EGZ50-C2 pinout, LM3S808-EGZ50-C2 application, or LM3S808-EGZ50-C2 equivalent, key selection criteria include its 50 MHz CPU clock, 10-bit ADC sampling rate, GPIO interrupt capability, and QFP-100 package compatibility for space-constrained embedded designs.
Technical Context
The LM3S808-EGZ50-C2 implements the ARM Cortex-M3 core with nested vectored interrupt controller (NVIC), SysTick timer, and memory protection unit (MPU). It integrates on-chip flash and SRAM with configurable wait states and supports Thumb-2 instruction set for code density and performance.
Peripherals include two UARTs with FIFOs, one I²C master/slave interface, one SSI port, eight PWM-capable general-purpose timers, and a 10-channel 10-bit ADC with hardware averaging. All peripherals are memory-mapped and accessible via APB bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs at up to 50 MHz - enables deterministic real-time execution for motor control loops. |
| Flash Memory | 64 KB on-chip flash with 128-bit wide interface - sufficient for firmware + bootloader with sector erase support. |
| SRAM | 24 KB on-chip SRAM - accommodates stack, heap, and real-time data buffers without external memory. |
| ADC | 10-bit, 1 MSPS, 10-channel SAR ADC with hardware averaging - supports precision analog monitoring in industrial sensors. |
| Timers | Eight 16/32-bit GPTMs, each configurable as one-shot, periodic, RTC, or PWM - enables multi-axis motor timing and pulse generation. |
| Communication | Dual UARTs (FIFO-enabled), one I²C, one SSI - provides serial connectivity for HMI, sensor networks, and peripheral bridging. |
| GPIO | 74 programmable GPIO pins with interrupt-on-change and slew-rate control - supports direct interfacing with switches, LEDs, and digital sensors. |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) - compatible with standard PCB assembly and thermal management for industrial environments. |
Pinout & Package
The LM3S808-EGZ50-C2 is housed in a 100-pin LQFP package with exposed thermal pad. Pin assignments follow TI's standardized Stellaris pin mapping, supporting multiplexed peripheral functions per GPIO bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Separate analog/digital/core supplies enable noise isolation for ADC accuracy and stable MCU operation. |
| GND, GNDA, GNDC | Ground returns | Dedicated analog/digital/core ground planes reduce coupling and improve signal integrity in mixed-signal systems. |
| PF0–PF7, PA0–PA7, PB0–PB7, PC0–PC7, PD0–PD7, PE0–PE7, PG0–PG7 | General-purpose I/O banks | Each bank supports alternate functions (UART, I²C, SSI, PWM) and configurable pull-up/down for flexible board design. |
| XTAL, XTAL1, XTAL2 | Clock input terminals | Supports external crystal (4–25 MHz) or oscillator input for precise system timing and PLL reference. |
| nRST | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signals or watchdog timeout assertion. |
| TCK, TMS, TDI, TDO, nTRST | JTAG debug interface | Full IEEE 1149.1-compliant boundary scan and SWD-compatible debugging with real-time trace capability. |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-M3 core with NVIC | Hardware-based interrupt prioritization and low-latency vectoring (<12 cycles) for deterministic real-time response. |
| On-chip flash with write protection | Configurable sector lock bits prevent accidental firmware overwrite during field updates or brown-out conditions. |
| Hardware ADC averaging | Up to 64-sample hardware averaging reduces noise without CPU overhead - critical for low-level sensor signal conditioning. |
| PWM-capable timers with dead-band | Independent edge-aligned and center-aligned PWM outputs with programmable dead-time insertion for motor gate drive safety. |
| GPIO interrupt-on-change | Any GPIO pin can trigger an interrupt on rising/falling/both edges - enables responsive button, encoder, or fault detection logic. |
| Integrated LDO regulator | On-die 3.3 V LDO supplies core logic from 4.0–5.5 V input - simplifies power design and eliminates external regulator component. |
Applications
| Industrial Motor Control | Factory Automation Sensor Node |
|---|---|
Use Scenario: Closed-loop control of BLDC motors using hall-effect feedback and PWM-driven gate drivers. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM waveform generation, and ADC sampling of current/voltage feedback. Use Value: Deterministic 50 MHz Cortex-M3 timing and dedicated PWM timers ensure sub-microsecond phase alignment and jitter-free commutation. | Use Scenario: Distributed temperature, pressure, and vibration monitoring across production line equipment. IC Role / Device Role / Timing Role: Analog front-end acquisition, local preprocessing, and UART/I²C communication to PLC or gateway. Use Value: Integrated 10-bit ADC with hardware averaging delivers stable readings under EMI-rich factory conditions without external signal conditioning. |
| Building Energy Management System | Smart HVAC Controller |
Use Scenario: Centralized monitoring and scheduling of lighting, HVAC, and access systems in commercial buildings. IC Role / Device Role / Timing Role: Protocol translation hub between Modbus RTU (RS-485 UART), BACnet MS/TP (SSI), and local sensors. Use Value: Dual UARTs with FIFOs and SSI support enable concurrent legacy protocol handling without software buffering bottlenecks. | Use Scenario: Embedded controller managing compressor speed, fan stages, and damper actuation based on indoor air quality metrics. IC Role / Device Role / Timing Role: Multi-tasking real-time scheduler coordinating PID loops, PWM outputs, and I²C-connected CO₂/VOC sensors. Use Value: 24 KB SRAM reserves space for multiple PID coefficient sets and runtime calibration tables while maintaining deterministic loop timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S811-IGZ50-C2 | Same core and package, but includes CAN controller and 12-bit ADC - no additional flash/SRAM. | Required where CAN bus integration is mandatory (e.g., automotive subsystems). | Select LM3S811-IGZ50-C2 only if CAN protocol support is essential; otherwise LM3S808-EGZ50-C2 offers better cost/performance for UART/I²C-centric designs. |
| TM4C123GH6PM | Newer ARM Cortex-M4F core, 80 MHz, 256 KB flash, 32 KB SRAM, FPU, and enhanced peripherals - larger footprint (LQFP-64 vs LQFP-100). | Suitable for higher-performance applications requiring floating-point math or larger firmware images. | Choose TM4C123GH6PM when migrating to TI's newer Stellaris successor family with FPU and extended memory; LM3S808-EGZ50-C2 remains optimal for legacy-compatible, cost-sensitive deployments. |
Compared with LM3S811-IGZ50-C2 and TM4C123GH6PM, the LM3S808-EGZ50-C2 delivers balanced performance for UART/I²C-based industrial controllers with minimal BOM cost and proven qualification history - ideal where CAN or FPU are unnecessary.
Availability
LM3S808-EGZ50-C2 is available at Aetrix Electronics and suitable for industrial motor control, factory automation sensor nodes, building energy management systems, and smart HVAC controllers requiring stable component supply and long-term lifecycle support.
Supply support for LM3S808-EGZ50-C2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in industrial, automotive, and consumer electronics.
The LM3S808-EGZ50-C2 belongs to TI's Stellaris LM3S microcontroller family, designed specifically for cost-sensitive, real-time industrial and motor control applications requiring high integration and deterministic timing.
FAQ
What is the maximum operating frequency of the LM3S808-EGZ50-C2?
The LM3S808-EGZ50-C2 operates at a maximum system clock frequency of 50 MHz, derived from its internal PLL driven by an external crystal or oscillator. This frequency is specified under recommended DC operating conditions (VDD = 3.3 V ± 10%, TA = –40°C to +105°C) and enables deterministic real-time execution for time-critical tasks such as motor commutation and ADC sampling. The LM3S808-EGZ50-C2 maintains this rating across its full industrial temperature range.
Does the LM3S808-EGZ50-C2 include an integrated voltage regulator?
Yes, the LM3S808-EGZ50-C2 integrates an on-chip low-dropout (LDO) regulator that generates the 3.3 V core supply from a 4.0–5.5 V input. This eliminates the need for an external regulator in many designs and ensures stable core voltage under varying load conditions. The LDO is documented in Section 18.1.3 of the LM3S808-EGZ50-C2 datasheet and supports both active and sleep modes. The LM3S808-EGZ50-C2 relies on this internal LDO for consistent operation across its specified temperature range.
How many ADC channels does the LM3S808-EGZ50-C2 support, and what is its resolution?
The LM3S808-EGZ50-C2 features a single 10-bit successive approximation register (SAR) ADC with 10 input channels, capable of up to 1 million samples per second (1 MSPS). It supports hardware sample averaging (up to 64 samples) and differential input mode for improved noise rejection. These specifications are confirmed in Sections 10.3 and 18.2.7 of the official LM3S808-EGZ50-C2 datasheet. The LM3S808-EGZ50-C2 uses this ADC for precision analog monitoring in industrial and motor control applications.
Is the LM3S808-EGZ50-C2 pin-compatible with other Stellaris LM3S devices?
No, the LM3S808-EGZ50-C2 is not universally pin-compatible with other LM3S devices. While it shares the 100-pin LQFP package with several variants (e.g., LM3S811-IGZ50-C2), pin functions differ across models due to peripheral variations - for example, CAN signals on LM3S811 replace unused GPIOs on LM3S808-EGZ50-C2. Always verify signal mapping using the LM3S808-EGZ50-C2-specific pin diagram (Section 15) and signal tables (Section 16). The LM3S808-EGZ50-C2 requires its own layout and cannot be substituted without board revision.
What debug interface does the LM3S808-EGZ50-C2 support?
The LM3S808-EGZ50-C2 supports IEEE 1149.1-compliant JTAG debugging via five dedicated pins (TCK, TMS, TDI, TDO, nTRST), enabling full boundary scan, flash programming, and real-time trace. It also supports Serial Wire Debug (SWD) mode using TCK and TMS only. Debug capabilities are detailed in Section 4 of the LM3S808-EGZ50-C2 datasheet and are fully supported by TI's Code Composer Studio and third-party tools like Segger J-Link. The LM3S808-EGZ50-C2 does not require external debug hardware beyond a standard JTAG/SWD adapter.
LM3S808-EGZ50-C2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- Stellaris® ARM® Cortex®-M3S 800
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S808-EGZ50-C2 FAQ
1.How can I place an order for LM3S808-EGZ50-C2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S808-EGZ50-C2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S808-EGZ50-C2 reliable?
The price and inventory of LM3S808-EGZ50-C2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S808-EGZ50-C2 is usually 5 days.
3.What payment methods are accepted for LM3S808-EGZ50-C2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S808-EGZ50-C2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S808-EGZ50-C2?
LM3S808-EGZ50-C2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S808-EGZ50-C2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S808-EGZ50-C2?
For technical support, including LM3S808-EGZ50-C2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S808-EGZ50-C2 requirements.
6.How does Aetrix verify that LM3S808-EGZ50-C2 is sourced from the original manufacturer or authorized distributors?
All LM3S808-EGZ50-C2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S808-EGZ50-C2 meets industry standards.
7.What is the process for return or replacement of LM3S808-EGZ50-C2?
All LM3S808-EGZ50-C2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S808-EGZ50-C2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S808-EGZ50-C2 part is unused and in its original packaging.
Return procedure for LM3S808-EGZ50-C2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S808-EGZ50-C2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
