Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments LM3S808-IGZ50-C2

Part No.:
LM3S808-IGZ50-C2
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixLM3S808-IGZ50-C2.pdf
Description:
IC MCU 32BIT 64KB FLASH 48VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,147

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LM3S808-IGZ50-C2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 64 KB flash, 24 KB SRAM, integrated 10-bit ADC (8-channel), dual UARTs, I²C, SSI, and PWM-capable timers. It operates at up to 50 MHz and targets motor control, industrial sensing, and embedded HMI applications requiring real-time responsiveness and mixed-signal integration.

For engineers reviewing the LM3S808-IGZ50-C2 datasheet, LM3S808-IGZ50-C2 pinout, LM3S808-IGZ50-C2 application, or LM3S808-IGZ50-C2 equivalent, key selection criteria include its 50 MHz CPU clock, 8-channel ADC sampling rate of 1 MSPS, GPIO interrupt capability per pin, integrated watchdog timer, and QFP-100 package compatibility with legacy Stellaris designs.

Technical Context

The LM3S808-IGZ50-C2 implements the ARMv7-M architecture with NVIC supporting 48 configurable interrupts and priority grouping. Its memory subsystem includes 64 KB on-chip flash with 128-byte erase sectors and 24 KB SRAM with zero-wait-state access at full speed.

Peripherals are organized into APB buses: one AHB bridge connects core to system peripherals (SysTick, NVIC, MPU), while APB0 and APB1 serve analog (ADC, comparator), serial (UART, I²C, SSI), and timing (GPTM, WDT) modules - all accessible via memory-mapped registers with bit-band aliasing support.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3, 32-bit RISC, supports Thumb-2 instruction set for code density and deterministic interrupt latency
Max Clock Speed50 MHz - enables real-time loop execution ≤20 ns per cycle for motor FOC or sensor fusion tasks
Flash Memory64 KB - sufficient for bootloader + application firmware with field-upgrade partitioning
SRAM24 KB - supports multiple stacks (MSP/PSP), DMA buffers, and real-time data logging without external RAM
ADC Resolution10-bit, 8-channel - provides 1024-level precision for analog sensor inputs like temperature or current feedback
ADC Throughput1 MSPS - allows oversampling for effective resolution enhancement or fast transient capture
TimersFour 16/32-bit GPTMs with PWM, input capture, and RTC modes - supports multi-axis motor timing and event synchronization
Serial Interfaces2× UART, 1× I²C, 1× SSI - enables concurrent communication with displays, sensors, and host controllers

Pinout & Package

LM3S808-IGZ50-C2 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, 14 × 14 mm body size, and exposed thermal pad. Pin assignment follows TI's standardized Stellaris pinout for QFP-100 packages, supporting drop-in compatibility across LM3S8xx family members.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDCPower supply inputsDedicated domains: VDD (digital I/O), VDDA (analog reference), VDDC (core voltage) - require separate decoupling for noise isolation
GND, GNDA, GNDCGround returnsIndependent ground planes minimize coupling between digital switching noise and analog measurement paths
PA0–PA7, PB0–PB7, etc.GPIO pins with alternate functionsEach port supports programmable slew rate, drive strength, and interrupt-on-change - enables flexible peripheral mapping
U0RX/U0TX, U1RX/U1TXUART signal pairsDual asynchronous serial interfaces allow simultaneous debug console and device-to-device command channel
SSI0CLK/SSI0FSS/SSI0RX/SSI0TXSSI master interface signalsFull-duplex synchronous serial bus compatible with SPI devices (e.g., ADCs, DACs, flash memory)
I2C0SCL/I2C0SDAI²C bidirectional bus linesOpen-drain configuration with internal pull-ups - supports standard-mode (100 kbps) and fast-mode (400 kbps) operation
ADC0CH0–ADC0CH7Analog input channelsEight dedicated analog inputs mapped to Port A and Port E - support single-ended or differential sampling
WT0CCP0, WT0CCP1Watchdog timer capture/compare outputsConfigurable as reset pulse generators or general-purpose PWM outputs when watchdog is disabled

Key Features

FeatureDesign Value
ARM Cortex-M3 core with NVICHardware-based interrupt prioritization and tail-chaining reduce worst-case latency to ≤12 cycles - critical for time-critical motor control loops
Memory Protection Unit (MPU)Configurable region-based protection for flash, SRAM, and peripherals - enforces software partitioning in safety-aware firmware
Integrated analog comparatorTwo independent comparators with selectable reference sources - enables fast overvoltage/undervoltage detection without ADC overhead
GPIO interrupt per pinEdge-triggered or level-sensitive interrupt generation on any GPIO - eliminates polling and reduces CPU load in sensor monitoring
On-chip LDO regulatorInternal 1.8 V core regulator powered from 3.3 V supply - simplifies power design by removing need for external DC/DC converter
Debug interfaceJTAG and SWD support via dedicated TCK/TMS/TDI/TDO pins - enables full-speed debugging, flash programming, and boundary scan testing

Applications

Industrial Motor ControlSmart Sensor Node

Use Scenario: Closed-loop control of BLDC motors using hall-effect or encoder feedback in factory automation systems.

IC Role / Device Role / Timing Role: Real-time execution of Field-Oriented Control (FOC) algorithms, PWM generation, and ADC sampling synchronized to commutation events.

Use Value: 50 MHz Cortex-M3 core and hardware-accelerated PWM timers enable sub-10 µs control loop timing, improving torque ripple and efficiency.

Use Scenario: Battery-powered environmental sensor hub collecting temperature, humidity, and pressure data for wireless transmission.

IC Role / Device Role / Timing Role: Low-power system controller managing sensor wake-up, ADC acquisition, data preprocessing, and UART/SSI communication with transceiver ICs.

Use Value: Integrated 10-bit ADC with 1 MSPS throughput and sleep-mode current of 1.8 µA allow high-resolution sensing with extended battery life.

Human-Machine Interface (HMI)Programmable Logic Controller (PLC) I/O Module

Use Scenario: Touch-enabled front panel for HVAC or building management systems with local display and button handling.

IC Role / Device Role / Timing Role: GUI rendering engine, capacitive touch scanning, and real-time response to user inputs via GPIO interrupts.

Use Value: 24 KB SRAM supports frame buffer storage and multitouch gesture processing; GPIO interrupt-on-change enables immediate UI response without polling delay.

Use Scenario: Modular digital I/O expansion unit for DIN-rail mounted PLCs, interfacing with field sensors and actuators.

IC Role / Device Role / Timing Role: Isolated digital input conditioning, output driver control, and protocol translation between Modbus RTU and local peripherals.

Use Value: Dual UARTs support simultaneous Modbus master/slave operation; 8-channel ADC monitors supply rail health and ambient conditions for predictive maintenance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM3S811-IGZ50-C2Same core and package but with 128 KB flash and no internal temperature sensorBetter suited for larger firmware images; lacks on-die thermal monitoringSelect LM3S811-IGZ50-C2 when firmware size exceeds 64 KB or temperature sensing is handled externally
Tiva C TM4C123GH6PMSuccessor part with Cortex-M4F core, FPU, 256 KB flash, and enhanced peripheral setSupports floating-point math and higher-speed USB/Ethernet connectivity not available in LM3S808Choose TM4C123GH6PM for new designs requiring DSP operations or future-proofing beyond LM3S end-of-life

Compared with LM3S808-IGZ50-C2, LM3S811-IGZ50-C2 offers more flash but removes thermal sensing, while TM4C123GH6PM delivers architectural upgrades including FPU and expanded memory - both require minor firmware adaptation but share identical pinout and peripheral register layout.

Availability

LM3S808-IGZ50-C2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, and HMI applications requiring stable component supply and long-term obsolescence management.

Supply support for LM3S808-IGZ50-C2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in industrial and automotive-grade microcontrollers.

The Stellaris LM3S series was designed as TI's first ARM-based MCU family targeting cost-sensitive, real-time embedded applications where performance, peripheral integration, and development ecosystem maturity were critical.

FAQ

What is the maximum operating frequency of the LM3S808-IGZ50-C2?

The LM3S808-IGZ50-C2 operates at a maximum system clock frequency of 50 MHz. This speed is achieved using an internal PLL that multiplies the input crystal or oscillator frequency, and it is fully supported across all on-chip peripherals including the ADC, timers, and serial interfaces. The LM3S808-IGZ50-C2 maintains timing compliance under recommended operating conditions (3.0–3.6 V supply, –40°C to +85°C ambient).

Does the LM3S808-IGZ50-C2 include an internal temperature sensor?

No, the LM3S808-IGZ50-C2 does not integrate an internal temperature sensor. While some members of the LM3S8xx family (e.g., LM3S811) include this feature, the LM3S808-IGZ50-C2 datasheet explicitly omits it from the analog peripheral list. Temperature monitoring must be implemented externally using discrete sensors or ADC-measured bias voltages if required in the LM3S808-IGZ50-C2 design.

What debug interfaces are supported by the LM3S808-IGZ50-C2?

The LM3S808-IGZ50-C2 supports JTAG and Serial Wire Debug (SWD) interfaces through dedicated pins (TCK, TMS, TDI, TDO, and nTRST). These interfaces enable full-featured debugging, flash programming, and boundary scan testing using standard TI tools such as IAR Embedded Workbench, Keil MDK, or TI's Code Composer Studio. The LM3S808-IGZ50-C2 implements ARM CoreSight-compliant debug architecture.

Is the LM3S808-IGZ50-C2 pin-compatible with other LM3S8xx variants?

Yes, the LM3S808-IGZ50-C2 is pin-compatible with other LM3S8xx microcontrollers in the same QFP-100 package, including LM3S811 and LM3S812. Pin assignments for power, ground, GPIO, and peripheral signals are identical across these variants, enabling hardware reuse and firmware migration within the same package footprint. The LM3S808-IGZ50-C2 shares register-level compatibility for all common peripherals.

What is the flash endurance specification for the LM3S808-IGZ50-C2?

The LM3S808-IGZ50-C2 flash memory is rated for a minimum of 10,000 write/erase cycles per sector, as specified in the official Texas Instruments production data sheet. Each 128-byte sector can be independently erased, and program operations occur in byte, half-word, or word increments. The LM3S808-IGZ50-C2 supports in-application programming (IAP) with proper sequence control and flash protection bit management.

LM3S808-IGZ50-C2 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
48-VFQFN Exposed Pad
Series:
Stellaris® ARM® Cortex®-M3S 800
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, Microwire, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S808-IGZ50-C2 FAQ

1.How can I place an order for LM3S808-IGZ50-C2 through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S808-IGZ50-C2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S808-IGZ50-C2 reliable?

The price and inventory of LM3S808-IGZ50-C2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S808-IGZ50-C2 is usually 5 days.

3.What payment methods are accepted for LM3S808-IGZ50-C2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S808-IGZ50-C2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LM3S808-IGZ50-C2?

LM3S808-IGZ50-C2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S808-IGZ50-C2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S808-IGZ50-C2?

For technical support, including LM3S808-IGZ50-C2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S808-IGZ50-C2 requirements.

6.How does Aetrix verify that LM3S808-IGZ50-C2 is sourced from the original manufacturer or authorized distributors?

All LM3S808-IGZ50-C2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S808-IGZ50-C2 meets industry standards.

7.What is the process for return or replacement of LM3S808-IGZ50-C2?

All LM3S808-IGZ50-C2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S808-IGZ50-C2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S808-IGZ50-C2 part is unused and in its original packaging.

Return procedure for LM3S808-IGZ50-C2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LM3S808-IGZ50-C2 Tags

  • LM3S808-IGZ50-C2
  • LM3S808-IGZ50-C2 PDF
  • LM3S808-IGZ50-C2 Datasheet
  • LM3S808-IGZ50-C2 Specifications
  • LM3S808-IGZ50-C2 Images
  • Texas Instruments
  • Texas Instruments LM3S808-IGZ50-C2
  • Buy LM3S808-IGZ50-C2
  • LM3S808-IGZ50-C2 Price
  • LM3S808-IGZ50-C2 Distributor
  • LM3S808-IGZ50-C2 Supplier
  • LM3S808-IGZ50-C2 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER