Texas Instruments LM3S808-IGZ50-C2
- Part No.:
- LM3S808-IGZ50-C2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
LM3S808-IGZ50-C2.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 48VQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LM3S808-IGZ50-C2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 64 KB flash, 24 KB SRAM, integrated 10-bit ADC (8-channel), dual UARTs, I²C, SSI, and PWM-capable timers. It operates at up to 50 MHz and targets motor control, industrial sensing, and embedded HMI applications requiring real-time responsiveness and mixed-signal integration.
For engineers reviewing the LM3S808-IGZ50-C2 datasheet, LM3S808-IGZ50-C2 pinout, LM3S808-IGZ50-C2 application, or LM3S808-IGZ50-C2 equivalent, key selection criteria include its 50 MHz CPU clock, 8-channel ADC sampling rate of 1 MSPS, GPIO interrupt capability per pin, integrated watchdog timer, and QFP-100 package compatibility with legacy Stellaris designs.
Technical Context
The LM3S808-IGZ50-C2 implements the ARMv7-M architecture with NVIC supporting 48 configurable interrupts and priority grouping. Its memory subsystem includes 64 KB on-chip flash with 128-byte erase sectors and 24 KB SRAM with zero-wait-state access at full speed.
Peripherals are organized into APB buses: one AHB bridge connects core to system peripherals (SysTick, NVIC, MPU), while APB0 and APB1 serve analog (ADC, comparator), serial (UART, I²C, SSI), and timing (GPTM, WDT) modules - all accessible via memory-mapped registers with bit-band aliasing support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, supports Thumb-2 instruction set for code density and deterministic interrupt latency |
| Max Clock Speed | 50 MHz - enables real-time loop execution ≤20 ns per cycle for motor FOC or sensor fusion tasks |
| Flash Memory | 64 KB - sufficient for bootloader + application firmware with field-upgrade partitioning |
| SRAM | 24 KB - supports multiple stacks (MSP/PSP), DMA buffers, and real-time data logging without external RAM |
| ADC Resolution | 10-bit, 8-channel - provides 1024-level precision for analog sensor inputs like temperature or current feedback |
| ADC Throughput | 1 MSPS - allows oversampling for effective resolution enhancement or fast transient capture |
| Timers | Four 16/32-bit GPTMs with PWM, input capture, and RTC modes - supports multi-axis motor timing and event synchronization |
| Serial Interfaces | 2× UART, 1× I²C, 1× SSI - enables concurrent communication with displays, sensors, and host controllers |
Pinout & Package
LM3S808-IGZ50-C2 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, 14 × 14 mm body size, and exposed thermal pad. Pin assignment follows TI's standardized Stellaris pinout for QFP-100 packages, supporting drop-in compatibility across LM3S8xx family members.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Dedicated domains: VDD (digital I/O), VDDA (analog reference), VDDC (core voltage) - require separate decoupling for noise isolation |
| GND, GNDA, GNDC | Ground returns | Independent ground planes minimize coupling between digital switching noise and analog measurement paths |
| PA0–PA7, PB0–PB7, etc. | GPIO pins with alternate functions | Each port supports programmable slew rate, drive strength, and interrupt-on-change - enables flexible peripheral mapping |
| U0RX/U0TX, U1RX/U1TX | UART signal pairs | Dual asynchronous serial interfaces allow simultaneous debug console and device-to-device command channel |
| SSI0CLK/SSI0FSS/SSI0RX/SSI0TX | SSI master interface signals | Full-duplex synchronous serial bus compatible with SPI devices (e.g., ADCs, DACs, flash memory) |
| I2C0SCL/I2C0SDA | I²C bidirectional bus lines | Open-drain configuration with internal pull-ups - supports standard-mode (100 kbps) and fast-mode (400 kbps) operation |
| ADC0CH0–ADC0CH7 | Analog input channels | Eight dedicated analog inputs mapped to Port A and Port E - support single-ended or differential sampling |
| WT0CCP0, WT0CCP1 | Watchdog timer capture/compare outputs | Configurable as reset pulse generators or general-purpose PWM outputs when watchdog is disabled |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-M3 core with NVIC | Hardware-based interrupt prioritization and tail-chaining reduce worst-case latency to ≤12 cycles - critical for time-critical motor control loops |
| Memory Protection Unit (MPU) | Configurable region-based protection for flash, SRAM, and peripherals - enforces software partitioning in safety-aware firmware |
| Integrated analog comparator | Two independent comparators with selectable reference sources - enables fast overvoltage/undervoltage detection without ADC overhead |
| GPIO interrupt per pin | Edge-triggered or level-sensitive interrupt generation on any GPIO - eliminates polling and reduces CPU load in sensor monitoring |
| On-chip LDO regulator | Internal 1.8 V core regulator powered from 3.3 V supply - simplifies power design by removing need for external DC/DC converter |
| Debug interface | JTAG and SWD support via dedicated TCK/TMS/TDI/TDO pins - enables full-speed debugging, flash programming, and boundary scan testing |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop control of BLDC motors using hall-effect or encoder feedback in factory automation systems. IC Role / Device Role / Timing Role: Real-time execution of Field-Oriented Control (FOC) algorithms, PWM generation, and ADC sampling synchronized to commutation events. Use Value: 50 MHz Cortex-M3 core and hardware-accelerated PWM timers enable sub-10 µs control loop timing, improving torque ripple and efficiency. | Use Scenario: Battery-powered environmental sensor hub collecting temperature, humidity, and pressure data for wireless transmission. IC Role / Device Role / Timing Role: Low-power system controller managing sensor wake-up, ADC acquisition, data preprocessing, and UART/SSI communication with transceiver ICs. Use Value: Integrated 10-bit ADC with 1 MSPS throughput and sleep-mode current of 1.8 µA allow high-resolution sensing with extended battery life. |
| Human-Machine Interface (HMI) | Programmable Logic Controller (PLC) I/O Module |
Use Scenario: Touch-enabled front panel for HVAC or building management systems with local display and button handling. IC Role / Device Role / Timing Role: GUI rendering engine, capacitive touch scanning, and real-time response to user inputs via GPIO interrupts. Use Value: 24 KB SRAM supports frame buffer storage and multitouch gesture processing; GPIO interrupt-on-change enables immediate UI response without polling delay. | Use Scenario: Modular digital I/O expansion unit for DIN-rail mounted PLCs, interfacing with field sensors and actuators. IC Role / Device Role / Timing Role: Isolated digital input conditioning, output driver control, and protocol translation between Modbus RTU and local peripherals. Use Value: Dual UARTs support simultaneous Modbus master/slave operation; 8-channel ADC monitors supply rail health and ambient conditions for predictive maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S811-IGZ50-C2 | Same core and package but with 128 KB flash and no internal temperature sensor | Better suited for larger firmware images; lacks on-die thermal monitoring | Select LM3S811-IGZ50-C2 when firmware size exceeds 64 KB or temperature sensing is handled externally |
| Tiva C TM4C123GH6PM | Successor part with Cortex-M4F core, FPU, 256 KB flash, and enhanced peripheral set | Supports floating-point math and higher-speed USB/Ethernet connectivity not available in LM3S808 | Choose TM4C123GH6PM for new designs requiring DSP operations or future-proofing beyond LM3S end-of-life |
Compared with LM3S808-IGZ50-C2, LM3S811-IGZ50-C2 offers more flash but removes thermal sensing, while TM4C123GH6PM delivers architectural upgrades including FPU and expanded memory - both require minor firmware adaptation but share identical pinout and peripheral register layout.
Availability
LM3S808-IGZ50-C2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, and HMI applications requiring stable component supply and long-term obsolescence management.
Supply support for LM3S808-IGZ50-C2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in industrial and automotive-grade microcontrollers.
The Stellaris LM3S series was designed as TI's first ARM-based MCU family targeting cost-sensitive, real-time embedded applications where performance, peripheral integration, and development ecosystem maturity were critical.
FAQ
What is the maximum operating frequency of the LM3S808-IGZ50-C2?
The LM3S808-IGZ50-C2 operates at a maximum system clock frequency of 50 MHz. This speed is achieved using an internal PLL that multiplies the input crystal or oscillator frequency, and it is fully supported across all on-chip peripherals including the ADC, timers, and serial interfaces. The LM3S808-IGZ50-C2 maintains timing compliance under recommended operating conditions (3.0–3.6 V supply, –40°C to +85°C ambient).
Does the LM3S808-IGZ50-C2 include an internal temperature sensor?
No, the LM3S808-IGZ50-C2 does not integrate an internal temperature sensor. While some members of the LM3S8xx family (e.g., LM3S811) include this feature, the LM3S808-IGZ50-C2 datasheet explicitly omits it from the analog peripheral list. Temperature monitoring must be implemented externally using discrete sensors or ADC-measured bias voltages if required in the LM3S808-IGZ50-C2 design.
What debug interfaces are supported by the LM3S808-IGZ50-C2?
The LM3S808-IGZ50-C2 supports JTAG and Serial Wire Debug (SWD) interfaces through dedicated pins (TCK, TMS, TDI, TDO, and nTRST). These interfaces enable full-featured debugging, flash programming, and boundary scan testing using standard TI tools such as IAR Embedded Workbench, Keil MDK, or TI's Code Composer Studio. The LM3S808-IGZ50-C2 implements ARM CoreSight-compliant debug architecture.
Is the LM3S808-IGZ50-C2 pin-compatible with other LM3S8xx variants?
Yes, the LM3S808-IGZ50-C2 is pin-compatible with other LM3S8xx microcontrollers in the same QFP-100 package, including LM3S811 and LM3S812. Pin assignments for power, ground, GPIO, and peripheral signals are identical across these variants, enabling hardware reuse and firmware migration within the same package footprint. The LM3S808-IGZ50-C2 shares register-level compatibility for all common peripherals.
What is the flash endurance specification for the LM3S808-IGZ50-C2?
The LM3S808-IGZ50-C2 flash memory is rated for a minimum of 10,000 write/erase cycles per sector, as specified in the official Texas Instruments production data sheet. Each 128-byte sector can be independently erased, and program operations occur in byte, half-word, or word increments. The LM3S808-IGZ50-C2 supports in-application programming (IAP) with proper sequence control and flash protection bit management.
LM3S808-IGZ50-C2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- Stellaris® ARM® Cortex®-M3S 800
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S808-IGZ50-C2 FAQ
1.How can I place an order for LM3S808-IGZ50-C2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S808-IGZ50-C2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S808-IGZ50-C2 reliable?
The price and inventory of LM3S808-IGZ50-C2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S808-IGZ50-C2 is usually 5 days.
3.What payment methods are accepted for LM3S808-IGZ50-C2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S808-IGZ50-C2 transactions.
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LM3S808-IGZ50-C2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S808-IGZ50-C2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S808-IGZ50-C2?
For technical support, including LM3S808-IGZ50-C2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S808-IGZ50-C2 requirements.
6.How does Aetrix verify that LM3S808-IGZ50-C2 is sourced from the original manufacturer or authorized distributors?
All LM3S808-IGZ50-C2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S808-IGZ50-C2 meets industry standards.
7.What is the process for return or replacement of LM3S808-IGZ50-C2?
All LM3S808-IGZ50-C2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S808-IGZ50-C2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S808-IGZ50-C2 part is unused and in its original packaging.
Return procedure for LM3S808-IGZ50-C2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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