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Texas Instruments LM3S811-EGZ50-C2
- Part No.:
- LM3S811-EGZ50-C2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
LM3S811-EGZ50-C2.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,876
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Product details
Overview
LM3S811-EGZ50-C2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 64 KB flash, 8 KB SRAM, and integrated peripherals including UART, I²C, SSI, ADC (8-channel, 12-bit), PWM, and analog comparator. It operates at up to 50 MHz and supports industrial temperature range (–40°C to +105°C) in a 100-pin LQFP package. It targets real-time embedded control in motor drives and sensor interfaces.
For engineers reviewing the LM3S811-EGZ50-C2 datasheet, LM3S811-EGZ50-C2 pinout, LM3S811-EGZ50-C2 application, or LM3S811-EGZ50-C2 equivalent, key selection criteria include its 50 MHz CPU clock, on-chip flash/SRAM configuration, peripheral set (especially dual UARTs and hardware PWM), and industrial-grade thermal rating.
Technical Context
The LM3S811-EGZ50-C2 implements the ARMv7-M architecture with Thumb-2 instruction set, NVIC for low-latency interrupt handling, and SysTick timer for OS tick generation. Its memory map includes bit-band aliasing for atomic peripheral bit manipulation and MPU support for memory protection in safety-critical tasks.
Peripherals are accessed via APB bus with configurable clock gating. The ADC supports hardware averaging and internal temperature sensing; the PWM module includes dead-band generation and fault shutdown-features critical for motor control timing integrity and system safety.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set - enables deterministic real-time execution and efficient code density. |
| Max Clock Speed | 50 MHz - defines maximum instruction throughput and peripheral timing margins for time-critical control loops. |
| Flash Memory | 64 KB - sufficient for firmware with bootloader, communication stacks, and application logic in compact embedded systems. |
| SRAM | 8 KB - supports stack/heap allocation for RTOS use and real-time data buffering without external memory. |
| ADC Resolution | 12-bit, 8-channel - provides sub-1 mV measurement resolution for analog sensor inputs like current/voltage feedback. |
| Operating Temp | –40°C to +105°C - validated for deployment in industrial enclosures and motor drive cabinets without derating. |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard PCB assembly processes and offers full peripheral signal access. |
Pinout & Package
LM3S811-EGZ50-C2 is housed in a 100-pin LQFP package (JEDEC MO-152AC) with exposed thermal pad. Pin functions are multiplexed across GPIO, UART, I²C, SSI, PWM, ADC, and system control signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | 3.3 V nominal input; requires local 100 nF decoupling per power domain to maintain stable core voltage under dynamic load. |
| GND | Ground reference | Multiple dedicated pins ensure low-impedance return paths for digital, analog, and I/O sections to minimize noise coupling. |
| GPIOA0–7 | General-purpose I/O bank A | Configurable as digital input/output, UART0 RX/TX, SSI0 clock/data, or PWM outputs - enables flexible peripheral routing. |
| GPIOB0–7 | General-purpose I/O bank B | Supports I²C0 SCL/SDA, ADC0 inputs, and PWM fault inputs - critical for sensor interface and safety monitoring. |
| USB0VBUS | USB VBUS detection | Direct connection to USB host VBUS line for plug-detection and power management state transitions. |
| OSC0/OSC1 | External crystal oscillator inputs | Accepts 4–25 MHz crystal for precise system clock generation; internal PLL supports 50 MHz operation from 8 MHz source. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware PWM with dead-band | Enables safe complementary gate driving for H-bridge inverters without external logic, reducing BOM count and layout complexity. |
| Integrated temperature sensor | Provides on-die die temperature measurement (±5°C accuracy) for thermal monitoring in motor control and power supply applications. |
| Bit-band alias region | Allows atomic single-bit read-modify-write operations on peripheral registers - eliminates race conditions in interrupt-driven I/O control. |
| Dual UART with FIFO | Each UART has 16-byte TX/RX FIFO and programmable baud rate generator - supports robust serial diagnostics and host communication at up to 3 Mbps. |
| MPU support | Configurable memory protection unit enforces privilege-level access rules - essential for certified firmware partitions in industrial safety systems. |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop speed/torque control of 3-phase BLDC motors using space-vector PWM and current feedback. IC Role / Device Role / Timing Role: Real-time controller executing FOC algorithm, generating synchronized PWM outputs, sampling ADC channels, and managing fault shutdown. Use Value: Integrated dead-band generator and PWM fault inputs enable immediate gate driver disable on overcurrent, preventing IGBT shoot-through. | Use Scenario: Battery-powered environmental sensor node measuring temperature, humidity, and pressure with wireless telemetry. IC Role / Device Role / Timing Role: System-on-chip managing sensor acquisition, data preprocessing, low-power sleep scheduling, and UART-based data upload. Use Value: 8 KB SRAM allows local buffering of multi-sensor readings; 64 KB flash accommodates sensor fusion algorithms and lightweight protocol stack. |
| Programmable Logic Controller (PLC) I/O Module | Industrial Human-Machine Interface (HMI) |
Use Scenario: DIN-rail mounted I/O expansion module with digital input filtering, relay output control, and Modbus RTU communication. IC Role / Device Role / Timing Role: Central controller handling discrete I/O scanning, timer-based debounce, CRC calculation, and UART-based Modbus slave protocol. Use Value: Dual UARTs allow simultaneous debug port and fieldbus interface; GPIO pin muxing simplifies board design for multiple I/O configurations. | Use Scenario: Touch-enabled panel PC front-end with local display refresh, button polling, and alarm logging. IC Role / Device Role / Timing Role: Embedded controller managing resistive touch ADC, LED backlight PWM, buzzer tone generation, and non-volatile event storage. Use Value: On-chip 12-bit ADC resolves touch position with <1% linearity error; hardware PWM dimming ensures flicker-free backlight control at 1 kHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S811-IQC50-C2 | Same core/peripherals but in 100-pin TQFP package with commercial temp range (–40°C to +85°C); no thermal pad. | Suitable for cost-sensitive consumer or lab equipment where extended temperature is not required. | Select when industrial temperature grade is unnecessary and PCB thermal management is less demanding. |
| TM4C123GH6PM | Successor part with 80 MHz Cortex-M4F core, 256 KB flash, floating-point unit, and enhanced peripheral set (USB OTG, CAN). | Required for applications needing higher compute throughput, DSP operations, or automotive-grade CAN connectivity. | Choose for new designs requiring longer lifecycle support, enhanced performance, or future-proof peripheral compatibility. |
Compared with LM3S811-EGZ50-C2, LM3S811-IQC50-C2 trades industrial temperature tolerance for lower cost and simpler thermal design, while TM4C123GH6PM delivers significantly higher processing capability and expanded peripheral integration at the expense of increased power and BOM cost.
Availability
LM3S811-EGZ50-C2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, PLC I/O modules, and HMI panels requiring stable component supply and long-term production continuity.
Supply support for LM3S811-EGZ50-C2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in industrial and automotive markets.
The Stellaris LM3S series was designed specifically for cost-sensitive, real-time embedded control applications requiring high integration, deterministic response, and industrial reliability - targeting motor drives, sensor hubs, and programmable logic subsystems.
FAQ
What is the maximum operating frequency of the LM3S811-EGZ50-C2?
The LM3S811-EGZ50-C2 operates at a maximum system clock frequency of 50 MHz, achieved via its internal PLL that multiplies an external crystal input (e.g., 8 MHz) to generate the core clock. This frequency is fully supported across the full industrial temperature range (–40°C to +105°C), and all timing specifications in the datasheet are guaranteed at this speed.
Does the LM3S811-EGZ50-C2 include an internal temperature sensor?
Yes, the LM3S811-EGZ50-C2 integrates an on-die temperature sensor connected to ADC channel 0. It provides calibrated readings with ±5°C accuracy over the full operating temperature range and is accessible through standard ADC configuration - enabling thermal monitoring without external components in motor control or power supply designs.
How many UART interfaces does the LM3S811-EGZ50-C2 support?
The LM3S811-EGZ50-C2 supports two independent UART peripherals (UART0 and UART1), each with 16-byte transmit and receive FIFOs, programmable baud-rate generators, and full modem control signaling. Both UARTs are accessible via GPIO multiplexing and can operate simultaneously - ideal for concurrent debug output and fieldbus communication in industrial systems.
Is the LM3S811-EGZ50-C2 pin-compatible with other Stellaris LM3S devices?
No, the LM3S811-EGZ50-C2 is not pin-compatible with other LM3S family members such as the LM3S8962 or LM3S9B92. While it shares the same 100-pin LQFP footprint, signal assignments differ significantly across variants due to varying peripheral sets and internal routing - requiring unique PCB layout for each specific part number.
What debug interface does the LM3S811-EGZ50-C2 use?
The LM3S811-EGZ50-C2 uses a 4-pin JTAG interface (TCK, TMS, TDI, TDO) compliant with IEEE 1149.1 for boundary-scan testing and full-featured debugging. It supports SWD (Serial Wire Debug) mode via TCK/TMS pins, enabling connection to standard ARM debug probes like TI's XDS100v3 or Segger J-Link for flash programming and real-time trace.
LM3S811-EGZ50-C2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- Stellaris® ARM® Cortex®-M3S 800
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S811-EGZ50-C2 FAQ
1.How can I place an order for LM3S811-EGZ50-C2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S811-EGZ50-C2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S811-EGZ50-C2 reliable?
The price and inventory of LM3S811-EGZ50-C2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S811-EGZ50-C2 is usually 5 days.
3.What payment methods are accepted for LM3S811-EGZ50-C2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S811-EGZ50-C2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S811-EGZ50-C2?
LM3S811-EGZ50-C2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S811-EGZ50-C2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S811-EGZ50-C2?
For technical support, including LM3S811-EGZ50-C2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S811-EGZ50-C2 requirements.
6.How does Aetrix verify that LM3S811-EGZ50-C2 is sourced from the original manufacturer or authorized distributors?
All LM3S811-EGZ50-C2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S811-EGZ50-C2 meets industry standards.
7.What is the process for return or replacement of LM3S811-EGZ50-C2?
All LM3S811-EGZ50-C2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S811-EGZ50-C2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S811-EGZ50-C2 part is unused and in its original packaging.
Return procedure for LM3S811-EGZ50-C2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S811-EGZ50-C2 Tags
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