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Texas Instruments LM3S8938-IBZ50-A2

Part No.:
LM3S8938-IBZ50-A2
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
108-LFBGA
Datasheet:
AetrixLM3S8938-IBZ50-A2.pdf
Description:
IC MCU 32BIT 256KB FLASH 108BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,880

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Product details

Overview

LM3S8938-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0B controller, 12-bit ADC (up to 1 MSPS), and hibernation module supporting RTC and battery-backed memory. It operates at 50 MHz and targets industrial motor control, building automation, and embedded HMI systems.

For engineers reviewing the LM3S8938-IBZ50-A2 datasheet, LM3S8938-IBZ50-A2 pinout, LM3S8938-IBZ50-A2 application, or LM3S8938-IBZ50-A2 equivalent, key selection criteria include its integrated CAN interface, hibernation power management, dual UARTs with IrDA support, and hardware-accelerated PWM timing for motor drive control.

Technical Context

The LM3S8938-IBZ50-A2 implements the ARM Cortex-M3 core with NVIC, SysTick, MPU, and debug interfaces including JTAG and SWD. Its system architecture integrates peripheral bus matrix, clock gating, and power domains enabling selective peripheral shutdown during hibernation.

It features a dedicated hibernation module with independent 32.768 kHz RTC oscillator, battery-switchover circuitry, and 2 KB of battery-backed SRAM. The CAN module supports full CAN 2.0B protocol with 32 message objects, programmable FIFO, and automatic retransmission-designed for deterministic real-time fieldbus communication.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM Cortex-M3 @ 50 MHz - delivers deterministic interrupt latency & Thumb-2 instruction efficiency for real-time control loops.
Flash / SRAM 256 KB flash + 64 KB SRAM - sufficient for bootloader, application firmware, and runtime data buffers in standalone motor controllers.
ADC 12-bit, 1 MSPS, 8-channel - enables simultaneous sampling of current/voltage feedback signals in three-phase motor drives.
CAN Interface CAN 2.0B compliant, 32 message objects - supports multi-node industrial networks with prioritized message arbitration and error confinement.
Hibernation Module RTC + 2 KB battery-backed SRAM + wake-on-external-interrupt - maintains timekeeping and critical state during main power loss without external components.
Timers 6 × 16-bit GPTMs (configurable as 3 × 32-bit), WDT - provides PWM generation, input capture, quadrature encoding, and safety watchdog coverage.
Communication 2 × UART (IrDA/SIR), 2 × SSI, 1 × I²C, 1 × CAN - enables concurrent serial sensor interfacing, display control, and fieldbus connectivity.

Pinout & Package

LM3S8938-IBZ50-A2 is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments are defined per TI SPMS174I datasheet Rev I, Section 5.1 and Table 5-1.

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VDDC Power supply inputs Dedicated analog (VDDA), digital (VDD), and core (VDDC) rails enable noise isolation for ADC and CPU operation.
GND, GNDA, GNDC Ground returns Separate analog/digital/core ground planes reduce coupling noise and improve ADC SNR and timing stability.
PD0–PD7, PE0–PE5, PF0–PF4, etc. GPIO bank pins Configurable as digital I/O, alternate function (UART/SSI/I²C/CAN), or analog inputs - supports flexible board layout and peripheral multiplexing.
USB0VBUS, USB0ID, USB0DM, USB0DP USB OTG interface Full-speed USB 2.0 device/host/OTG capability with on-chip transceiver - eliminates need for external PHY in diagnostic or firmware update interfaces.
CAN0RX, CAN0TX CAN physical layer interface Differential CAN bus transceiver interface - requires external CAN transceiver (e.g., SN65HVD230) for bus connection and ESD protection.

Key Features

Feature Design Value
Hibernation with RTC & battery backup Enables <1 µA deep-sleep current with timekeeping and 2 KB retained RAM - reduces need for external RTC and nonvolatile storage in energy-constrained nodes.
Integrated CAN 2.0B controller Supports bit rates up to 1 Mbps with hardware message filtering and FIFO buffering - simplifies CAN node design and improves real-time determinism vs software-based stacks.
Dual UART with IrDA/SIR Enables infrared remote diagnostics and legacy serial communication without external level shifters or IR encoder ICs.
Hardware PWM and quadrature encoder input 6 × general-purpose timers configurable for center-aligned PWM, edge counting, and position/speed measurement - offloads CPU in motor control applications.
On-chip USB OTG transceiver Eliminates external USB PHY; supports device, host, and OTG modes - enables field firmware updates and PC-based commissioning via standard USB cable.

Applications

Industrial Motor Control Building Automation Node

Use Scenario: Closed-loop control of BLDC or stepper motors in HVAC actuators and pump drives.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM generation, current sensing via ADC, and CAN-based command reception.

Use Value: Integrated hibernation preserves fault logs and calibration data during power interruption; CAN interface enables interoperability with BACnet MS/TP gateways.

Use Scenario: Smart thermostat or lighting controller with occupancy sensing, temperature monitoring, and network reporting.

IC Role / Device Role / Timing Role: Sensor hub aggregating analog (temp/humidity), digital (PIR), and serial (CO₂ sensor) inputs; communicates via CAN or UART to central panel.

Use Value: Low-power hibernation mode extends battery life in wireless variants; dual UARTs support both local debug and RS-485 fieldbus communication.

Embedded HMI Controller Programmable Logic Controller (PLC) I/O Module

Use Scenario: Local operator interface with LCD, keypad, and status LEDs for machinery or test equipment.

IC Role / Device Role / Timing Role: Graphics rendering engine (via external driver), touch response handler, and USB-based firmware update endpoint.

Use Value: On-chip USB OTG allows drag-and-drop firmware updates; 64 KB SRAM accommodates frame buffer and GUI stack without external memory.

Use Scenario: DIN-rail mounted digital I/O expansion module with CAN backbone and isolated inputs/outputs.

IC Role / Device Role / Timing Role: Fieldbus gateway translating discrete I/O states to CAN messages; manages watchdog supervision and diagnostics.

Use Value: Hardware CRC and message object filtering ensure robust CAN messaging; hibernation module retains last-known I/O state during brownout events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
Tiva C TM4C123GH6PM Successor part with same Cortex-M4F core, enhanced peripherals (USB HS, Ethernet MAC), 256 KB flash, but no hibernation module with battery-backed RAM. Lacks integrated RTC + battery backup; requires external RTC for timekeeping during power loss. Select when higher floating-point performance or Ethernet is required, and hibernation with battery retention is not mandatory.
STM32F103VET6 ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, CAN 2.0B, but no dedicated hibernation module or battery-switchover circuitry. No native RTC with battery backup; relies on external coin cell and discrete RTC IC for timekeeping in sleep. Choose for cost-sensitive designs where CAN + USB + ADC are needed but ultra-low-power hibernation is handled externally.

Compared with LM3S8938-IBZ50-A2, TM4C123GH6PM offers higher CPU performance and richer connectivity but sacrifices hibernation integrity, while STM32F103VET6 provides larger flash and higher clock speed but requires external components to replicate battery-backed RTC functionality.

Availability

LM3S8938-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, building automation, embedded HMI, and programmable logic controller I/O modules requiring stable component supply and long-term lifecycle support.

Supply support for LM3S8938-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and digital signal processing technologies.

The Stellaris LM3S series was designed as the first ARM Cortex-M3-based MCU family for industrial and automotive-qualified embedded applications, emphasizing integration, low-power hibernation, and fieldbus-ready peripherals like CAN and USB OTG.

FAQ

What is the maximum operating frequency of the LM3S8938-IBZ50-A2?

The LM3S8938-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz, derived from an internal PLL that can be configured to multiply the crystal or external clock source. This frequency is specified under industrial temperature range (–40°C to +85°C) and 3.3 V supply conditions per the SPMS174I datasheet.

Does the LM3S8938-IBZ50-A2 include an integrated CAN transceiver?

No, the LM3S8938-IBZ50-A2 contains only the CAN protocol controller (CAN 2.0B compliant). It requires an external CAN physical-layer transceiver such as the SN65HVD230 or TJA1042 to connect to the CAN bus. The device provides CAN0RX and CAN0TX signals compatible with industry-standard transceivers.

How much battery-backed memory does the LM3S8938-IBZ50-A2 provide in hibernation mode?

The LM3S8938-IBZ50-A2 includes 2 KB of battery-backed SRAM accessible during hibernation mode. This memory retains data when main VDD is removed and backup power (VBAT) is applied, enabling preservation of critical state, calibration values, or event logs without external nonvolatile storage.

Is USB functionality on the LM3S8938-IBZ50-A2 limited to device mode?

No, the LM3S8938-IBZ50-A2 supports USB On-The-Go (OTG) with integrated transceiver, enabling device, host, and OTG operation. It complies with USB 2.0 Full-Speed (12 Mbps) specification and includes dedicated USB DMA, endpoint buffers, and session request protocol (SRP) support for dual-role operation.

What ADC resolution and sampling rate does the LM3S8938-IBZ50-A2 support?

The LM3S8938-IBZ50-A2 features a 12-bit successive-approximation ADC with up to 1 MSPS conversion rate across 8 input channels. It supports hardware averaging, differential sampling, and internal temperature sensor readout - all configurable via dedicated ADC control registers in the SPMS174I datasheet.

LM3S8938-IBZ50-A2 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
108-LFBGA
Series:
Stellaris® ARM® Cortex®-M3S 8000
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S8938-IBZ50-A2 FAQ

1.How can I place an order for LM3S8938-IBZ50-A2 through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S8938-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S8938-IBZ50-A2 reliable?

The price and inventory of LM3S8938-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S8938-IBZ50-A2 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S8938-IBZ50-A2 transactions.

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LM3S8938-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S8938-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S8938-IBZ50-A2?

For technical support, including LM3S8938-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S8938-IBZ50-A2 requirements.

6.How does Aetrix verify that LM3S8938-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?

All LM3S8938-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S8938-IBZ50-A2 meets industry standards.

7.What is the process for return or replacement of LM3S8938-IBZ50-A2?

All LM3S8938-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S8938-IBZ50-A2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S8938-IBZ50-A2 part is unused and in its original packaging.

Return procedure for LM3S8938-IBZ50-A2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LM3S8938-IBZ50-A2 Tags

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