Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments LM3S8962-EQC50-A2

Part No.:
LM3S8962-EQC50-A2
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixLM3S8962-EQC50-A2.pdf
Description:
IC MCU 32BIT 256KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,479

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LM3S8962-EQC50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, 12-bit ADC (up to 1 MSPS), and hibernation module supporting RTC and battery-backed memory. It operates at 50 MHz and targets embedded control in industrial automation and motor drive systems.

For engineers reviewing the LM3S8962-EQC50-A2 datasheet, LM3S8962-EQC50-A2 pinout, LM3S8962-EQC50-A2 application, or LM3S8962-EQC50-A2 equivalent, key selection criteria include its integrated CAN interface, hibernation power management, 50 MHz clock speed, and QFP-100 package compatibility for space-constrained industrial designs.

Technical Context

The LM3S8962-EQC50-A2 implements the ARM Cortex-M3 core with NVIC, SysTick, MPU, and debug support via JTAG. It integrates dual UARTs, two SSI modules, I²C, and a dedicated CAN 2.0A/B controller with 32 message objects and programmable FIFOs.

Its analog subsystem includes an 8-channel, 12-bit ADC with hardware averaging and internal temperature sensor; digital peripherals include eight GPIO ports with interrupt capability per pin, six general-purpose timers (including RTC mode), and watchdog with windowed operation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3, 32-bit RISC, supports Thumb-2 instruction set and deterministic interrupt latency
Max Clock Speed50 MHz - enables real-time control loop execution within ≤20 ns timing resolution
Flash Memory256 KB - sufficient for complex firmware with bootloader, communication stacks, and safety monitoring code
SRAM64 KB - supports multi-threaded RTOS operation and buffered CAN/UART message queues
ADC Resolution & Rate12-bit, up to 1 MSPS - captures fast transients in motor current sensing or power supply monitoring
CAN InterfaceCAN 2.0A/B compliant with 32 message objects - handles full automotive or industrial fieldbus traffic without external controller
Hibernation ModuleRTC + battery-backed RAM + wake-on-interrupt - maintains timekeeping and state during main power loss

Pinout & Package

LM3S8962-EQC50-A2 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, RoHS-compliant, and thermally enhanced for industrial ambient temperatures up to 105°C.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDCPower supply inputsDigital (VDD), analog (VDDA), and core (VDDC) rails require separate decoupling for noise isolation and stable ADC/CPU operation
GND, GNDA, GNDCGround returnsAnalog ground (GNDA) must be star-connected to minimize coupling into sensitive ADC reference paths
PA0–PA7, PB0–PB7, etc.GPIO port pinsConfigurable as inputs/outputs with slew-rate control, pull-up/down, and edge-triggered interrupts per pin
CAN0RX / CAN0TXCAN physical layer interfaceDedicated differential pair for CAN bus connection; requires external transceiver and 120 Ω termination
SSI0CLK / SSI0FSS / SSI0RX / SSI0TXSynchronous serial interfaceSupports SPI-compatible master/slave operation with programmable bit rate and frame format
U0RX / U0TX / U1RX / U1TXUART transmit/receiveTwo independent UARTs with FIFOs, IrDA/SIR support, and baud-rate generation via system clock dividers
ADC0CH0–ADC0CH7Analog input channelsEight single-ended or four differential inputs tied to internal 12-bit SAR ADC with sample-and-hold
HIBRST / HIBACKHibernation module controlEnable hibernate entry/exit and monitor hibernation status; interface with external backup battery

Key Features

FeatureDesign Value
Integrated CAN 2.0A/B ControllerReduces BOM count by eliminating external CAN controller; supports priority-based arbitration and error handling per ISO 11898
Hibernation Module with RTCEnables ultra-low-power sleep states (<1 µA) while maintaining accurate time and retaining critical data in battery-backed RAM
ARM Cortex-M3 with NVICDelivers <8 µs worst-case interrupt latency and nested interrupt handling essential for deterministic motor control loops
12-bit ADC with Hardware AveragingImproves effective resolution to ~13.5 bits for precision current/voltage measurement without CPU overhead
Multiple Communication PeripheralsSimultaneous use of CAN, dual UARTs, I²C, and dual SSI allows consolidated connectivity in distributed industrial nodes

Applications

Industrial Motor ControlBuilding Automation Gateway

Use Scenario: Closed-loop control of BLDC motors using PWM outputs, current feedback via ADC, and position sensing via quadrature encoder inputs.

IC Role / Device Role / Timing Role: Real-time executive managing PWM generation, ADC sampling synchronization, and CAN-based command distribution.

Use Value: Deterministic 50 MHz Cortex-M3 execution and integrated CAN enable precise torque control and fieldbus interoperability without external protocol translation.

Use Scenario: Aggregating sensor data (temperature, occupancy, lighting status) from RS-485 and I²C devices and forwarding to BACnet/IP or Modbus TCP networks.

IC Role / Device Role / Timing Role: Protocol bridge and data concentrator with dual UARTs, I²C master, and Ethernet-ready GPIO interfacing.

Use Value: On-chip hibernation and RTC allow scheduled wake-up for low-duty-cycle polling, reducing average power in battery-backed gateways.

Energy Metering NodeProgrammable Logic Controller (PLC) I/O Module

Use Scenario: Measuring voltage, current, and power factor in single-phase utility meters with tamper detection and secure firmware updates.

IC Role / Device Role / Timing Role: High-accuracy analog front-end controller with calibrated ADC, flash-based secure boot, and CAN/UART for firmware delivery.

Use Value: 12-bit ADC with hardware averaging achieves Class 0.5 metering accuracy; 256 KB flash supports cryptographic libraries and update rollback mechanisms.

Use Scenario: Digital input/output expansion module for modular PLC chassis, accepting discrete signals and driving relays or indicators over CANopen or proprietary fieldbus.

IC Role / Device Role / Timing Role: Fieldbus endpoint with configurable GPIO, interrupt-driven edge detection, and deterministic CAN message scheduling.

Use Value: Integrated CAN controller with 32 message objects supports concurrent process I/O, diagnostics, and configuration traffic without host CPU intervention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM3S811-EQC50-A2Same Cortex-M3 core and package, but only 64 KB flash and 256-byte hibernation RAM; no CAN controllerLacks CAN interface and reduced memory - suitable for non-fieldbus sensor nodes or simple UI controllersSelect when CAN is unnecessary and cost-sensitive design requires minimal feature set
Tiva C TM4C123GH6PMSuccessor family with 80 MHz CPU, 256 KB flash, 32 KB SRAM, CAN, USB, and enhanced peripheral set; same 100-pin LQFP footprintHigher performance and USB host/device support - ideal for next-generation designs requiring legacy upgrade pathChoose for new designs needing extended lifecycle, USB connectivity, or higher throughput without PCB redesign

Compared with LM3S8962-EQC50-A2, LM3S811-EQC50-A2 omits CAN and reduces memory for cost-sensitive roles, while TM4C123GH6PM offers higher clock speed, USB, and longer-term availability-making it a forward-compatible alternative where board layout reuse is valuable.

Availability

LM3S8962-EQC50-A2 is available at Aetrix Electronics and suitable for industrial motor control, building automation gateways, energy metering nodes, and PLC I/O modules requiring stable component supply across extended production cycles.

Supply support for LM3S8962-EQC50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and wireless technologies for industrial, automotive, and consumer markets.

The Stellaris LM3S series was designed as TI's first ARM-based microcontroller platform targeting deterministic real-time control in resource-constrained industrial environments, emphasizing integration of CAN, hibernation, and analog peripherals.

FAQ

What is the maximum operating temperature specification for the LM3S8962-EQC50-A2?

The LM3S8962-EQC50-A2 is rated for industrial temperature range operation from –40°C to +105°C. This specification applies to the full functional performance of all integrated peripherals including the Cortex-M3 core, CAN controller, ADC, and hibernation module. Thermal derating is not required within this range, and the device maintains timing compliance and flash reliability across the entire span. The LM3S8962-EQC50-A2 datasheet confirms this rating under the "Absolute Maximum Ratings" and "Recommended Operating Conditions" sections.

Does the LM3S8962-EQC50-A2 support in-system programming via UART or USB?

The LM3S8962-EQC50-A2 supports in-system programming exclusively through the JTAG/SWD interface-not via UART or USB, as it lacks native USB hardware. UART-based bootloading is not implemented in ROM; firmware updates require external debugger access or custom bootloader development. The LM3S8962-EQC50-A2 includes a built-in ROM bootloader that accepts commands over UART only after explicit hardware reset with BOOT0 pin asserted-but this mode does not support flash programming and is limited to peripheral initialization. Full flash reprogramming requires JTAG.

How many CAN message objects does the LM3S8962-EQC50-A2 support, and are they configurable?

The LM3S8962-EQC50-A2 supports 32 fully configurable CAN message objects, each independently programmable for identifier masking, direction (TX/RX), data length, and interrupt enable. These objects are organized in two banks and can be assigned to any of the 32 message buffers, enabling flexible filtering and prioritized transmission. The LM3S8962-EQC50-A2 datasheet specifies this in Section 15.3.2 ("Operation") and Table 15–1, confirming full CAN 2.0B compliance with acceptance filtering and FIFO-like buffering behavior.

Is the hibernation module in the LM3S8962-EQC50-A2 capable of retaining RAM contents during deep sleep?

Yes-the hibernation module in the LM3S8962-EQC50-A2 retains up to 256 bytes of battery-backed RAM while drawing less than 1 µA from the backup supply. This memory remains accessible upon wake-up and preserves critical state such as RTC time, calibration offsets, or fault logs. The LM3S8962-EQC50-A2 hibernation controller also supports wake-up events from external pins, RTC match, or low-battery detection, all documented in Section 6 of the datasheet.

What is the ADC sampling rate and resolution supported by the LM3S8962-EQC50-A2?

The LM3S8962-EQC50-A2 features a single 12-bit successive approximation register (SAR) ADC with up to 1 million samples per second (1 MSPS) conversion rate. It supports eight input channels, hardware sample averaging (2–64 samples), and an internal temperature sensor. The ADC uses a dedicated 3.3 V reference and achieves ±1 LSB INL/DNL across the full industrial temperature range. All specifications are verified in the "Analog-to-Digital Converter (ADC)" section (Section 11) of the LM3S8962-EQC50-A2 datasheet.

LM3S8962-EQC50-A2 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
100-LQFP
Series:
Stellaris® ARM® Cortex®-M3S 8000
Packaging:
Tray
Product Status:
Active
Programmable:
Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
42
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S8962-EQC50-A2 FAQ

1.How can I place an order for LM3S8962-EQC50-A2 through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S8962-EQC50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S8962-EQC50-A2 reliable?

The price and inventory of LM3S8962-EQC50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S8962-EQC50-A2 is usually 5 days.

3.What payment methods are accepted for LM3S8962-EQC50-A2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S8962-EQC50-A2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LM3S8962-EQC50-A2?

LM3S8962-EQC50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S8962-EQC50-A2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S8962-EQC50-A2?

For technical support, including LM3S8962-EQC50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S8962-EQC50-A2 requirements.

6.How does Aetrix verify that LM3S8962-EQC50-A2 is sourced from the original manufacturer or authorized distributors?

All LM3S8962-EQC50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S8962-EQC50-A2 meets industry standards.

7.What is the process for return or replacement of LM3S8962-EQC50-A2?

All LM3S8962-EQC50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S8962-EQC50-A2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S8962-EQC50-A2 part is unused and in its original packaging.

Return procedure for LM3S8962-EQC50-A2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LM3S8962-EQC50-A2 Tags

  • LM3S8962-EQC50-A2
  • LM3S8962-EQC50-A2 PDF
  • LM3S8962-EQC50-A2 Datasheet
  • LM3S8962-EQC50-A2 Specifications
  • LM3S8962-EQC50-A2 Images
  • Texas Instruments
  • Texas Instruments LM3S8962-EQC50-A2
  • Buy LM3S8962-EQC50-A2
  • LM3S8962-EQC50-A2 Price
  • LM3S8962-EQC50-A2 Distributor
  • LM3S8962-EQC50-A2 Supplier
  • LM3S8962-EQC50-A2 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER