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Texas Instruments LM3S8962-IBZ50-A2
- Part No.:
- LM3S8962-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S8962-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,214
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Product details
Overview
LM3S8962-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0B controller, 12-bit ADC (up to 1 MSPS), and hibernation module supporting RTC and battery-backed memory. It operates at 50 MHz and targets industrial motor control and embedded automation systems requiring deterministic real-time response.
For engineers reviewing the LM3S8962-IBZ50-A2 datasheet, LM3S8962-IBZ50-A2 pinout, LM3S8962-IBZ50-A2 application, or LM3S8962-IBZ50-A2 equivalent, key selection criteria include CAN interface support, hibernation power management, analog acquisition performance, and Cortex-M3 debug infrastructure compatibility.
Technical Context
The LM3S8962-IBZ50-A2 implements the ARMv7-M architecture with Thumb-2 instruction set, NVIC supporting up to 64 interrupt sources, and SysTick timer for OS scheduling. Its memory system includes tightly coupled flash with prefetch buffer and SRAM with bit-band aliasing for atomic peripheral register access.
Hardware peripherals are organized into clock-gated modules: dual UARTs with IrDA/SIR support, two SSI interfaces, I²C master/slave, four general-purpose timers (including RTC-capable 32-bit mode), and a dedicated hibernation module with separate LDO, RTC, and 2 KB battery-backed RAM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 50 MHz max operation - enables deterministic interrupt latency ≤12 cycles and efficient C/C++ execution in resource-constrained environments. |
| Flash Memory | 256 KB on-chip flash with 64-bit prefetch and erase/program capability - supports firmware updates without external memory and retains code across hibernation. |
| SRAM | 64 KB on-chip SRAM with bit-band region - allows atomic read-modify-write of peripheral registers and real-time data buffering. |
| ADC | 12-bit, 1 MSPS, 8-channel SAR ADC with hardware averaging and temperature sensor - delivers calibrated analog input for motor current/voltage monitoring. |
| CAN Interface | CAN 2.0B-compliant controller with 32 message objects and programmable FIFO - enables robust fieldbus communication in industrial networks without external transceiver logic. |
| Hibernation Module | Dedicated low-power domain with RTC, battery-backed 2 KB RAM, and wake-on-RTC/external-pin - reduces system standby current to 1.7 µA while preserving state and timekeeping. |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) - provides full peripheral pinout including CAN, UART, SSI, I²C, GPIO, and analog inputs for compact industrial PCB layouts. |
Pinout & Package
LM3S8962-IBZ50-A2 is housed in a 100-pin LQFP package (JEDEC MS-026AC) with exposed thermal pad. Pin assignments follow TI's standard Stellaris LM3S8962 pinout, validated against DS-LM3S8962-15852.2743 Rev I (July 2014).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | 3.3 V ±5% main supply for CPU, memory, and digital peripherals; requires local 100 nF decoupling. |
| VDDA | Analog power supply | 3.3 V analog reference for ADC and internal voltage references; must be filtered separately from digital VDD. |
| GPIO_A0–A7 | General-purpose I/O bank A | Configurable as digital I/O, UART0, SSI0, or timer capture; supports slew-rate control and weak pull-up/down. |
| CAN0RX / CAN0TX | CAN physical layer interface | Dedicated differential pair for CAN 2.0B bus communication; requires external CAN transceiver (e.g., SN65HVD230) for bus connection. |
| HIBRST | Hibernation reset input | Active-low signal that forces hibernation module reset independently of system reset; used for controlled wake-from-hibernate recovery. |
| RTCCLK | Real-time clock input | Accepts 32.768 kHz crystal or external clock for hibernation module RTC; enables time-of-day tracking during ultra-low-power sleep. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0B controller | Eliminates need for external CAN protocol IC; supports mailbox-based transmission and reception with automatic ID filtering and error handling. |
| Hibernation module with RTC | Enables <1.7 µA system standby with timekeeping and 2 KB retained RAM - critical for battery-powered remote sensors and metering applications. |
| ARM Cortex-M3 with NVIC | Provides deterministic interrupt response (<12 cycle latency), priority grouping, and vector table relocation - essential for hard real-time motor control loops. |
| 12-bit 1 MSPS ADC with hardware averaging | Delivers 12-bit effective resolution at full speed using on-chip averaging; supports simultaneous sampling across multiple channels via sequencer triggers. |
| Bit-band aliasing for SRAM & peripherals | Allows single-instruction atomic set/clear of individual bits in peripheral registers or SRAM - simplifies thread-safe flag management without disabling interrupts. |
Applications
| Industrial Motor Control | Building Automation Sensor Node |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers with current sensing, PWM generation, and CAN-based command feedback. IC Role / Device Role / Timing Role: Real-time execution host for FOC algorithm, ADC sampling trigger source, and CAN network node managing actuator coordination. Use Value: Deterministic 50 MHz Cortex-M3 timing ensures sub-µs PWM jitter; integrated CAN eliminates protocol translation overhead; hibernation enables maintenance-mode low-power monitoring. |
Use Scenario: Wireless-ready environmental sensor hub collecting temperature, humidity, and occupancy data with scheduled CAN reporting. IC Role / Device Role / Timing Role: Central data aggregator with RTC-scheduled wake-up, multi-channel ADC acquisition, and CAN message framing for building management systems. Use Value: Battery-backed RTC and 2 KB hibernation RAM retain time and last-read sensor values during mains loss; 12-bit ADC resolves 0.1°C temperature steps without external signal conditioning. |
| Programmable Logic Controller (PLC) I/O Module | Industrial Gateway with Fieldbus Bridge |
Use Scenario: DIN-rail mounted digital I/O expansion module with isolated inputs/outputs and CAN backbone connectivity. IC Role / Device Role / Timing Role: Local intelligence for debounce, edge detection, and status reporting; manages GPIO banks and synchronizes I/O state over CAN. Use Value: 64 KB SRAM buffers I/O state changes during CAN congestion; GPIO commit control prevents metastability on hot-plug events; hibernation preserves configuration during power cycling. |
Use Scenario: Protocol translator between Modbus RTU (RS-485) and CANopen networks in factory floor equipment. IC Role / Device Role / Timing Role: Dual-protocol bridge processor running concurrent UART (Modbus) and CAN stacks with time-synchronized message forwarding. Use Value: Two independent UARTs with IrDA/SIR and FIFOs handle Modbus ASCII/RTU framing; CAN controller manages object-based message arbitration and filtering without CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S811-IQC50-A2 | Same Cortex-M3 core, but only 64 KB flash, 256 KB SRAM, no CAN, no hibernation module. | Lacks CAN interface and ultra-low-power hibernation - unsuitable for fieldbus-connected or battery-backed designs. | Select when CAN and hibernation are unnecessary and cost sensitivity outweighs peripheral scalability. |
| TMS570LS0432PZQQ1 | ARM Cortex-R4F safety MCU with lockstep cores, 3 MB flash, ECC RAM, and ASIL-B certification - not pin-compatible. | Targets automotive safety-critical systems; requires ISO 26262 toolchain and qualification - overqualified for industrial non-safety use. | Choose only if functional safety compliance (ASIL-B) is mandatory; otherwise, LM3S8962-IBZ50-A2 offers better cost/performance for industrial CAN nodes. |
Compared with LM3S811-IQC50-A2, the LM3S8962-IBZ50-A2 adds CAN and hibernation at higher memory density; versus TMS570LS0432PZQQ1, it trades safety certification for lower BOM cost and simpler development flow in non-automotive industrial settings.
Availability
LM3S8962-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, building automation sensor nodes, PLC I/O modules, and fieldbus gateway applications requiring stable component supply and long-term obsolescence planning.
Supply support for LM3S8962-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 50 years of innovation in industrial and automotive electronics.
The Stellaris LM3S series was designed as Texas Instruments' first ARM-based microcontroller family targeting cost-sensitive, real-time industrial applications with integrated connectivity and low-power operation - preceding the TM4C123x migration path.
FAQ
What is the maximum operating frequency of the LM3S8962-IBZ50-A2?
The LM3S8962-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz, derived from its internal PLL or external crystal oscillator. This frequency is specified under industrial temperature range (–40°C to +85°C) and 3.3 V supply conditions per DS-LM3S8962-15852.2743. The Cortex-M3 core executes Thumb-2 instructions at this rate with predictable cycle counts for timing-critical code sections.
Does the LM3S8962-IBZ50-A2 include an integrated CAN transceiver?
No, the LM3S8962-IBZ50-A2 integrates only the CAN protocol controller (CAN 2.0B compliant), not the physical layer transceiver. External components such as the SN65HVD230 or TJA1050 are required to drive the CAN bus differential signals. The device provides CAN0RX and CAN0TX pins compatible with standard high-speed CAN transceivers.
What power modes does the LM3S8962-IBZ50-A2 support for low-energy operation?
The LM3S8962-IBZ50-A2 supports Sleep, Deep-Sleep, and Hibernation modes. Hibernation achieves the lowest power state (1.7 µA typical) by powering down the main domain while retaining RTC operation and 2 KB of battery-backed RAM. Wake-up sources include RTC match, external GPIO, or HIBRST assertion - all documented in Section 6 of the datasheet.
Is the LM3S8962-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
No, the LM3S8962-IBZ50-A2 is not universally pin-compatible across the LM3S family. While it shares the 100-pin LQFP footprint with LM3S811-IQC50-A2 and LM3S8530-IBZ50-A2, pin functions differ significantly - especially for CAN, hibernation, and peripheral multiplexing. Board layout must be verified against the specific LM3S8962-IBZ50-A2 pin map in Section 1.3 of the datasheet.
What debugging interfaces are supported by the LM3S8962-IBZ50-A2?
The LM3S8962-IBZ50-A2 supports JTAG and SWD (Serial Wire Debug) interfaces via dedicated pins (TCK, TMS, TDI, TDO, nTRST, SWCLK, SWDIO). It includes full CoreSight debug infrastructure: NVIC-integrated breakpoints, watchpoints, and real-time trace via TPIU. Debug access is enabled by default and requires no bootloader configuration.
LM3S8962-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 8000
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, Ethernet, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 42
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S8962-IBZ50-A2 FAQ
1.How can I place an order for LM3S8962-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S8962-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S8962-IBZ50-A2 reliable?
The price and inventory of LM3S8962-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S8962-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S8962-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S8962-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S8962-IBZ50-A2?
LM3S8962-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S8962-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S8962-IBZ50-A2?
For technical support, including LM3S8962-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S8962-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S8962-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S8962-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S8962-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S8962-IBZ50-A2?
All LM3S8962-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S8962-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S8962-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S8962-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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