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Texas Instruments LM3S8970-IBZ50-A2

Part No.:
LM3S8970-IBZ50-A2
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
108-LFBGA
Datasheet:
AetrixLM3S8970-IBZ50-A2.pdf
Description:
IC MCU 32BIT 256KB FLASH 108BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,947

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Product details

Overview

LM3S8970-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0B controller, 10/100 Ethernet MAC, and hibernation module for ultra-low-power operation. It operates at 50 MHz, supports 3.3 V supply, and targets industrial control and networked sensor nodes requiring deterministic real-time response.

For engineers reviewing the LM3S8970-IBZ50-A2 datasheet, LM3S8970-IBZ50-A2 pinout, LM3S8970-IBZ50-A2 application, or LM3S8970-IBZ50-A2 equivalent, key selection criteria include its integrated Ethernet MAC (no external PHY required), dual CAN channels, hibernation current of 1.7 µA, and support for Thumb-2 instruction set with NVIC-based interrupt handling.

Technical Context

The LM3S8970-IBZ50-A2 implements the ARM Cortex-M3 core with Harvard bus architecture, nested vectored interrupt controller (NVIC), and memory protection unit (MPU). It integrates a dedicated hibernation module with battery-backed RTC and 2 KB SRAM, enabling wake-up from deep sleep in under 1.5 µs.

Peripherals include one 10/100 Ethernet MAC (MII/RMII interface), two CAN 2.0B controllers, four UARTs, two SSI modules, two I²C interfaces, eight PWM outputs, and six general-purpose timers - all clocked from a configurable PLL-driven system clock up to 50 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, 50 MHz max operation
Flash Memory256 KB on-chip flash with 128-bit wide access and single-cycle read at 50 MHz
SRAM64 KB general-purpose SRAM + 2 KB hibernation-mode battery-backed SRAM
Integrated CANTwo independent CAN 2.0B controllers supporting full CAN FD readiness via software configuration
Ethernet Interface10/100 Mbps MAC layer only (requires external PHY); MII and RMII support
Hibernation Current1.7 µA typical with RTC running and 2 KB SRAM retained
Supply Voltage3.3 V ±10%; internal LDO regulates core voltage to 1.2 V
Operating Temp–40°C to +85°C (Industrial grade, A2 suffix)

Pinout & Package

LM3S8970-IBZ50-A2 is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions are defined per TI SPMS175I datasheet Rev I, including dedicated JTAG/SWD debug pins, dual CAN TX/RX pairs, MII/RMII signal groups, and GPIOs multiplexed with peripheral functions.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDCPower supply inputsVDD = I/O supply (3.3 V); VDDA = analog supply for ADC; VDDC = core supply (regulated internally to 1.2 V)
PA0–PA7, PB0–PB7, etc.GPIO banks A–GEach bank supports alternate functions: UART0–3, SSI0–1, I²C0–1, CAN0–1, PWM, timer capture/compare
CRS, RXD0–3, TXD0–3UART serial I/OFour independent UARTs with FIFOs; CRS enables automatic flow control using CTS/RTS signals
CAN0RX/CAN0TX, CAN1RX/CAN1TXCAN transceiver interfaceDedicated differential pair pins for each CAN controller; require external transceivers for physical layer
EMAC0RXD0–3, EMAC0TXD0–3, etc.Ethernet MAC signalsMII interface: 4-bit RX/TX data, TXEN, RXDV, CRS, COL, RXER, TXER; RMII mode uses subset (REFCLK, TXD[1:0], RXD[1:0])
RTCCLK, HIBRST, HIBRTCHibernation module I/ORTCCLK = external 32.768 kHz crystal input; HIBRST = hibernate reset output; HIBRTC = hibernate RTC alarm output

Key Features

FeatureDesign Value
Hibernation Mode1.7 µA retention current with RTC and 2 KB SRAM active; wake-up latency <1.5 µs
Dual CAN ControllersIndependent CAN 2.0B modules with 32 message objects each; programmable bit timing and error handling
Ethernet MAC LayerFull-duplex 10/100 Mbps MAC supporting MII/RMII; integrated DMA and descriptor-based packet buffering
Peripheral IntegrationEight PWM generators, six 16/32-bit timers, four UARTs, two SSI, two I²C, analog comparator, and 8-channel 10-bit ADC
Debug & TraceSWD/JTAG interface with 4-pin SWD support; TPIU trace port for real-time instruction trace
Memory ProtectionConfigurable MPU with 8 regions, each supporting subregion disable and privilege access control

Applications

Industrial PLC NodeSmart Grid Sensor Hub

Use Scenario: Distributed I/O module in factory automation, collecting analog/digital sensor data and executing logic control over CAN bus.

IC Role / Device Role / Timing Role: Central MCU managing real-time I/O scanning, CAN messaging, and local PID loop execution at ≤1 ms cycle time.

Use Value: Integrated dual CAN eliminates external CAN controllers; hibernation mode enables battery backup during AC power loss without data loss.

Use Scenario: Field-deployed metering node aggregating voltage/current readings from multiple smart meters and relaying via Ethernet backbone.

IC Role / Device Role / Timing Role: Ethernet MAC host processor with deterministic timestamping of measurements using hardware RTC and 32-bit GPTM capture registers.

Use Value: On-chip 10/100 Ethernet MAC reduces BOM cost vs. external MAC+PHY; dual CAN supports legacy fieldbus integration.

Building Automation GatewayRemote Monitoring Terminal

Use Scenario: HVAC gateway bridging BACnet MS/TP (via UART + RS-485) and IP networks for centralized building management.

IC Role / Device Role / Timing Role: Protocol translation engine with concurrent UART, CAN, and Ethernet stacks; handles time-synchronized scheduling of zone temperature reports.

Use Value: Four UARTs enable simultaneous BACnet, Modbus, and debug ports; hibernation preserves configuration during brownouts.

Use Scenario: Solar-powered environmental monitor transmitting soil moisture, temperature, and humidity via CAN to edge gateway, then Ethernet to cloud.

IC Role / Device Role / Timing Role: Ultra-low-power sensor aggregator with wake-on-interrupt capability and burst Ethernet transmission every 15 minutes.

Use Value: 1.7 µA hibernation current extends battery life to >5 years; integrated ADC and comparators reduce external component count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM3S9B92-IQC50-A2Same Cortex-M3 core, 512 KB flash, 96 KB SRAM, adds USB 2.0 OTG controller; no Ethernet MACBetter suited for USB-hosted human interface devices; lacks Ethernet and second CAN channelSelect when USB connectivity is primary and Ethernet is unnecessary
Tiva TM4C123GH6PMSuccessor family: same pin-compatible footprint, 80 MHz Cortex-M4F, FPU, enhanced CAN/Ethernet peripherals, but requires layout revision for VDD/VSS redistributionHigher performance for floating-point math; supports IEEE 1588 PTP via Ethernet hardware timestampingChoose for new designs needing higher compute throughput and IEEE 1588 support; not drop-in compatible due to power pin reassignment

Compared with LM3S8970-IBZ50-A2, LM3S9B92-IQC50-A2 trades Ethernet for USB and larger memory, while TM4C123GH6PM offers higher clock speed and FPU but requires PCB redesign - making LM3S8970-IBZ50-A2 optimal for legacy industrial nodes where Ethernet + dual CAN + ultra-low-power hibernation are non-negotiable.

Availability

LM3S8970-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial PLC nodes, smart grid sensor hubs, building automation gateways, and remote monitoring terminals requiring stable component supply across extended product lifecycles.

Supply support for LM3S8970-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets since 1930.

The Stellaris LM3S series was designed specifically for cost-sensitive, real-time industrial control applications requiring integrated communication peripherals (CAN, Ethernet), deterministic low-latency interrupt response, and ultra-low-power hibernation - before the Tiva C series succeeded it.

FAQ

Does LM3S8970-IBZ50-A2 include an integrated Ethernet PHY?

No, the LM3S8970-IBZ50-A2 contains only the Ethernet MAC layer. An external PHY chip (e.g., DP83848 or LAN8720) is required for physical-layer signaling. The device supports both MII and RMII interfaces, allowing flexible PHY selection based on board space and cost constraints. This separation enables design reuse across different PHY vendors and speeds while maintaining consistent MAC firmware.

What is the hibernation current specification for LM3S8970-IBZ50-A2?

The LM3S8970-IBZ50-A2 achieves 1.7 µA typical hibernation current with the real-time clock running and 2 KB of SRAM retained. This value is measured at 3.3 V and 25°C per TI SPMS175I datasheet Section 6.3.6. Battery backup must be connected to the VBAT pin, and the hibernation module must be configured to retain RTC and memory - critical for battery-operated remote sensors needing multi-year operation.

How many CAN controllers does LM3S8970-IBZ50-A2 support?

The LM3S8970-IBZ50-A2 integrates two independent CAN 2.0B controllers (CAN0 and CAN1), each supporting up to 32 message objects, programmable bit timing, and hardware acceptance filtering. Both controllers operate concurrently and can be assigned to separate CAN buses - essential for applications like vehicle diagnostics (OBD-II on CAN0) and body control (CAN1) or industrial daisy-chain topologies.

Is LM3S8970-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?

No, LM3S8970-IBZ50-A2 is not pin-compatible with most other LM3S devices due to its unique 100-pin LQFP package and specific peripheral pin mapping - especially for Ethernet MII signals and dual CAN transceiver interfaces. While some smaller LM3S variants share GPIO pinouts, the LM3S8970's expanded peripheral set necessitates dedicated routing. Always verify against TI SPMS175I pin diagram before migration.

What debug interface does LM3S8970-IBZ50-A2 support?

The LM3S8970-IBZ50-A2 supports both JTAG and Serial Wire Debug (SWD) interfaces via dedicated pins (TCK, TMS, TDI, TDO, nTRST, SWDIO, SWCLK). SWD mode uses only two pins and is preferred for production programming and debugging. TI's Stellaris ICDI and third-party tools like Segger J-Link fully support this device, enabling real-time trace via the TPIU when enabled in the debug configuration.

LM3S8970-IBZ50-A2 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
108-LFBGA
Series:
Stellaris® ARM® Cortex®-M3S 8000
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LM3S8970-IBZ50-A2 FAQ

1.How can I place an order for LM3S8970-IBZ50-A2 through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S8970-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S8970-IBZ50-A2 reliable?

The price and inventory of LM3S8970-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S8970-IBZ50-A2 is usually 5 days.

3.What payment methods are accepted for LM3S8970-IBZ50-A2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S8970-IBZ50-A2 transactions.

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4.How is shipping managed for LM3S8970-IBZ50-A2?

LM3S8970-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S8970-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S8970-IBZ50-A2?

For technical support, including LM3S8970-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S8970-IBZ50-A2 requirements.

6.How does Aetrix verify that LM3S8970-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?

All LM3S8970-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S8970-IBZ50-A2 meets industry standards.

7.What is the process for return or replacement of LM3S8970-IBZ50-A2?

All LM3S8970-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S8970-IBZ50-A2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S8970-IBZ50-A2 part is unused and in its original packaging.

Return procedure for LM3S8970-IBZ50-A2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LM3S8970-IBZ50-A2 Tags

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