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Texas Instruments LM3S8970-IBZ50-A2T
- Part No.:
- LM3S8970-IBZ50-A2T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S8970-IBZ50-A2T.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,468
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Product details
Overview
LM3S8970-IBZ50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, Ethernet MAC, and hibernation module. It operates at 50 MHz, supports -40°C to +85°C industrial temperature range, and targets embedded control in factory automation and motor drives.
For engineers reviewing the LM3S8970-IBZ50-A2T datasheet, LM3S8970-IBZ50-A2T pinout, LM3S8970-IBZ50-A2T application, or LM3S8970-IBZ50-A2T equivalent, key selection criteria include its dual CAN interface, integrated Ethernet MAC (no PHY), hibernate power mode with RTC and battery-backed memory, and 50 MHz clock speed under industrial temperature conditions.
Technical Context
The LM3S8970-IBZ50-A2T implements the ARM Cortex-M3 core with NVIC, SysTick, and MPU, supporting Thumb-2 instruction set and deterministic interrupt latency down to 12 cycles. It integrates a dedicated hibernation module with real-time clock, battery-backed RAM, and wake-up on RTC match or external signal.
Peripherals include two CAN controllers compliant with ISO 11898-1, an IEEE 802.3-compliant Ethernet MAC (MII/RMII interface), four UARTs, two SSI modules, two I²C interfaces, eight PWM outputs, and 48 GPIOs with programmable slew rate and drive strength.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs Thumb-2 instructions with hardware divide and single-cycle MAC. |
| Max Clock Speed | 50 MHz - determines maximum instruction throughput and peripheral timing margins in real-time control loops. |
| Flash Memory | 256 KB - sufficient for complex firmware with bootloader, protocol stacks (CANopen, Modbus TCP), and field-upgradeable images. |
| SRAM | 64 KB - supports large data buffers for Ethernet packet handling, CAN message queues, and real-time task stacks. |
| Operating Temp | -40°C to +85°C - validated for use in industrial enclosures without active cooling or derating. |
| Hibernate Current | 1.7 µA - enables multi-year battery operation in remote sensor nodes or maintenance-free edge devices. |
| Package | 100-pin LQFP (14 × 14 mm) - standard surface-mount footprint compatible with automated assembly and thermal management in dense PCB layouts. |
Pinout & Package
LM3S8970-IBZ50-A2T is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignments are defined per TI SPMS175I datasheet Rev I, Table 4-1 (Page 167) and Section 8.1 (GPIO Signal Descriptions).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Dedicated domains for digital logic (VDD), analog peripherals (VDDA), and core voltage regulator (VDDC); require separate decoupling. |
| GND, GNDA, GNDC | Ground returns | Isolated ground paths minimize noise coupling between analog, digital, and core domains. |
| OSC0/OSC1 | Crystal oscillator inputs | Supports 4–25 MHz crystal for main system clock; internal PLL generates 50 MHz CPU clock. |
| ETH0_RXD[3:0], ETH0_TXD[3:0] | Ethernet MII interface | Direct connection to external PHY; no internal PHY - requires external 10/100BASE-TX transceiver. |
| CAN0RX/CAN0TX, CAN1RX/CAN1TX | CAN bus transceiver interfaces | Two independent CAN 2.0A/B channels; each pair connects to external CAN transceiver (e.g., SN65HVD230). |
| HIB_RTCCLK, HIB_WAKE | Hibernation module signals | Enable low-power wake-up via RTC alarm or external event while main domain is powered down. |
Key Features
| Feature | Design Value |
|---|---|
| Dual CAN 2.0A/B Controllers | Enables redundant fieldbus communication or multi-network topology (e.g., drive bus + safety bus) without external bridge ICs. |
| Integrated Ethernet MAC | Reduces BOM cost and PCB area by eliminating external MAC; supports TCP/IP stack offload via DMA and descriptor-based packet buffering. |
| Hibernation Module with RTC | Provides sub-2 µA sleep state with timekeeping and wake-on-alarm - critical for battery-powered gateways and predictive maintenance sensors. |
| Programmable GPIO Slew Rate | Allows EMI optimization: slower edges on noisy lines (e.g., motor control), faster edges on high-speed interfaces (e.g., SSI, I²C). |
| Memory Protection Unit (MPU) | Enforces privilege separation between application tasks and kernel code - required for IEC 61508 SIL2-certifiable firmware designs. |
Applications
| Industrial PLC I/O Module | Motor Drive Controller |
|---|---|
Use Scenario: Compact DIN-rail mounted I/O expansion unit with CAN bus connectivity and local Ethernet diagnostics. IC Role / Device Role / Timing Role: Central MCU managing 16-channel digital input sampling, CAN message routing, and web-server-based configuration over Ethernet. Use Value: Dual CAN ports enable daisy-chained topology; hibernation mode reduces standby power during commissioning pauses. | Use Scenario: Brushless DC motor controller with position feedback, current sensing, and fieldbus interface. IC Role / Device Role / Timing Role: Real-time motion controller executing FOC algorithm at 20 kHz PWM, synchronizing CAN status reporting and fault logging. Use Value: 50 MHz Cortex-M3 delivers deterministic loop timing; integrated PWM generator eliminates external timer ICs. |
| Building Automation Gateway | Remote Sensor Hub |
Use Scenario: Protocol translator bridging BACnet MS/TP (via CAN) to BACnet/IP (via Ethernet) in HVAC systems. IC Role / Device Role / Timing Role: Dual-interface gateway running concurrent CAN frame parsing and UDP packet assembly with timestamp synchronization. Use Value: Hardware-accelerated CRC for CAN and Ethernet ensures error-free transport without CPU overhead. | Use Scenario: Solar-powered environmental monitor collecting temperature, humidity, and CO₂ data for cloud upload. IC Role / Device Role / Timing Role: Low-power host managing sensor I²C reads, CAN telemetry transmission, and scheduled Ethernet uploads during daylight hours. Use Value: 1.7 µA hibernate current extends battery life beyond 5 years using standard AA lithium cells. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S811-IQC50-A2 | Same Cortex-M3 core but only 64 KB flash, 16 KB SRAM, no Ethernet MAC or hibernation module. | Limited to simpler CAN-only nodes without network gateway functions or ultra-low-power requirements. | Select when cost sensitivity outweighs need for Ethernet or deep-sleep capability. |
| TM4C123GH6PM | Successor family with 80 MHz CPU, 256 KB flash, 32 KB SRAM, integrated USB and enhanced CAN FD support. | Better suited for new designs requiring higher performance, USB device/host, or future-proofing against CAN FD migration. | Choose for new projects where TI's long-term roadmap and extended peripheral set justify migration effort. |
Compared with LM3S8970-IBZ50-A2T, LM3S811-IQC50-A2 offers lower memory and no Ethernet/hibernate - suitable for cost-constrained CAN endpoints; TM4C123GH6PM provides higher clock speed, USB, and CAN FD but requires PCB redesign and firmware adaptation.
Availability
LM3S8970-IBZ50-A2T is available at Aetrix Electronics and suitable for industrial automation, motor control, and building management systems requiring stable component supply across extended product lifecycles.
Supply support for LM3S8970-IBZ50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets.
The Stellaris LM3S series was designed as TI's first ARM-based microcontroller platform targeting real-time industrial control, with emphasis on integrated connectivity (CAN, Ethernet), low-power operation, and deterministic interrupt response.
FAQ
What is the maximum operating frequency of the LM3S8970-IBZ50-A2T?
The LM3S8970-IBZ50-A2T operates at a maximum CPU clock frequency of 50 MHz, achieved via internal PLL multiplication of the external crystal oscillator input (typically 6 MHz). This speed is fully supported across the full industrial temperature range (-40°C to +85°C) and is specified in the electrical characteristics section of the SPMS175I datasheet.
Does the LM3S8970-IBZ50-A2T include an integrated Ethernet PHY?
No, the LM3S8970-IBZ50-A2T includes only an Ethernet MAC layer compliant with IEEE 802.3. An external PHY (e.g., DP83848 or LAN8720) must be used for physical layer signaling. The device provides MII and RMII interface signals, and the PHY must be separately powered and configured via MDIO/MDC.
How many CAN interfaces does the LM3S8970-IBZ50-A2T support?
The LM3S8970-IBZ50-A2T integrates two independent CAN 2.0A/B controllers (CAN0 and CAN1), each with dedicated message objects, FIFOs, and bit-timing registers. Both controllers support standard and extended identifiers, programmable acceptance filtering, and automatic retransmission - enabling dual-bus architectures in industrial networks.
What is the hibernate current consumption of the LM3S8970-IBZ50-A2T?
The LM3S8970-IBZ50-A2T achieves a typical hibernate current of 1.7 µA when the hibernation module is active, the main power domain is disabled, and only the hibernate rail (VDDHB) is powered. This value is measured per the test conditions in Section 6.3.6 of the SPMS175I datasheet and includes RTC operation and battery-backed memory retention.
Is the LM3S8970-IBZ50-A2T pin-compatible with other LM3S devices?
No, the LM3S8970-IBZ50-A2T is not pin-compatible with other LM3S devices due to its unique 100-pin LQFP package and peripheral mapping. For example, the LM3S811 uses a 100-pin TQFP but assigns different functions to pins such as PB6/PB7 (SSI vs. UART), and lacks Ethernet and second CAN signals entirely.
LM3S8970-IBZ50-A2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 8000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 46
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S8970-IBZ50-A2T FAQ
1.How can I place an order for LM3S8970-IBZ50-A2T through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S8970-IBZ50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S8970-IBZ50-A2T reliable?
The price and inventory of LM3S8970-IBZ50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S8970-IBZ50-A2T is usually 5 days.
3.What payment methods are accepted for LM3S8970-IBZ50-A2T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S8970-IBZ50-A2T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S8970-IBZ50-A2T?
LM3S8970-IBZ50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S8970-IBZ50-A2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S8970-IBZ50-A2T?
For technical support, including LM3S8970-IBZ50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S8970-IBZ50-A2T requirements.
6.How does Aetrix verify that LM3S8970-IBZ50-A2T is sourced from the original manufacturer or authorized distributors?
All LM3S8970-IBZ50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S8970-IBZ50-A2T meets industry standards.
7.What is the process for return or replacement of LM3S8970-IBZ50-A2T?
All LM3S8970-IBZ50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S8970-IBZ50-A2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S8970-IBZ50-A2T part is unused and in its original packaging.
Return procedure for LM3S8970-IBZ50-A2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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