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Texas Instruments LM3S8970-IQC50-A2
- Part No.:
- LM3S8970-IQC50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
LM3S8970-IQC50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
LM3S8970-IQC50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, Ethernet MAC, and hibernation module. It operates at 50 MHz, supports -40°C to +85°C industrial temperature range, and targets embedded control in motor drives and industrial networking.
For engineers reviewing the LM3S8970-IQC50-A2 datasheet, LM3S8970-IQC50-A2 pinout, LM3S8970-IQC50-A2 application, or LM3S8970-IQC50-A2 equivalent, key selection factors include its dual CAN interface, integrated Ethernet MAC (no PHY), hibernate current of 1.7 µA, and QFP-100 package compatibility with legacy Stellaris designs.
Technical Context
The LM3S8970-IQC50-A2 implements the ARM Cortex-M3 core with NVIC, SysTick, and MPU, enabling deterministic real-time interrupt handling and memory protection. It integrates a full CAN 2.0B controller with 32 message objects and hardware acceptance filtering, plus an IEEE 802.3-compliant Ethernet MAC supporting 10/100 Mbps in MII mode.
Hibernation module provides RTC, battery-backed RAM (2 KB), and wake-up from deep-sleep with 1.7 µA typical current. Clock system includes PLL, internal RC oscillator, and external crystal support up to 25 MHz, with configurable dividers for peripheral clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 50 MHz max operation - enables deterministic real-time task scheduling and Thumb-2 instruction efficiency. |
| Flash Memory | 256 KB on-chip flash - sufficient for bootloader, protocol stacks, and application firmware with field-upgrade capability. |
| SRAM | 64 KB on-chip SRAM - supports large buffers for Ethernet packet handling and CAN message queuing without external memory. |
| CAN Interface | Dual CAN 2.0B controllers - allows simultaneous communication on two independent CAN buses, e.g., control bus + diagnostics bus. |
| Ethernet MAC | IEEE 802.3 10/100 Mbps MII interface - requires external PHY but eliminates need for external MAC logic or FPGA glue. |
| Hibernate Current | 1.7 µA typical - enables multi-year battery operation in remote sensor nodes with RTC wake-up capability. |
| Operating Temp | -40°C to +85°C - qualified for industrial automation, motor control cabinets, and outdoor equipment enclosures. |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard SMT reflow profiles and legacy Stellaris PCB footprints. |
Pinout & Package
LM3S8970-IQC50-A2 is housed in a 100-pin Low-Profile Quad Flat Package (LQFP) with 0.5 mm pitch, 14 mm × 14 mm body, and exposed thermal pad. Pinout supports full GPIO remapping, dual CAN transceivers, MII Ethernet signals, and dedicated hibernate I/O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Separate analog (VDDA), digital core (VDDC), and I/O (VDD) rails enable noise isolation for ADC and high-speed peripherals. |
| PA0–PA7, PB0–PB7, etc. | General-purpose I/O | 100 total GPIO pins with programmable pull-up/down, slew rate control, and interrupt-on-change capability per port. |
| CAN0RX / CAN0TX CAN1RX / CAN1TX | CAN physical layer interface | Dedicated differential signal pairs for two independent CAN controllers - no software multiplexing required. |
| EMAC0MII* | Ethernet MAC interface | Full MII pin set (TXD0–7, RXD0–7, TXEN, RXDV, CRS, COL, etc.) - connects directly to external PHY without glue logic. |
| HIBERNATE | Hibernate module control | Single pin enables entry into hibernate mode; asserts wake-up interrupt on external event or RTC match. |
| RTCCLK / HIBRTCVDD | Real-time clock domain | Supports external 32.768 kHz crystal or internal low-power oscillator for timekeeping during hibernate with battery backup. |
Key Features
| Feature | Design Value |
|---|---|
| Dual CAN 2.0B controllers | 32 message objects per controller with hardware ID filtering - reduces CPU load in automotive body control or industrial PLC backplane networks. |
| Integrated Ethernet MAC | MII interface with 8 transmit/receive descriptors - enables TCP/IP stack offload and deterministic packet timing without external MAC IC. |
| Hibernate module with RTC | 2 KB battery-backed SRAM + 32-bit RTC counter - preserves state and time across power cycles in smart meters or wireless gateways. |
| ARM Cortex-M3 with MPU | Memory Protection Unit with 8 regions - isolates firmware partitions (e.g., bootloader vs. application) to prevent corruption in safety-critical updates. |
| Peripheral register locking | Software-lockable configuration registers - prevents accidental reconfiguration of CAN bit timing or Ethernet MAC filters during runtime. |
| GPIO remapping | Alternate function assignment per pin via GPIOPeriphSelect - allows flexible board layout without signal congestion on fixed-function pins. |
Applications
| Industrial Motor Control | Building Automation Gateway |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors with position feedback, fault monitoring, and CAN-based command distribution. IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, managing CAN bus for master-slave coordination, and generating PWM via GPTM modules. Use Value: Dual CAN interfaces allow separate command and status channels; 50 MHz Cortex-M3 delivers <1 µs interrupt latency for current-loop timing. | Use Scenario: Protocol translation between BACnet MS/TP (RS-485) and BACnet/IP over Ethernet in HVAC control panels. IC Role / Device Role / Timing Role: Bridge processor running dual-stack firmware, with Ethernet MAC for IP traffic and UART/SSI for legacy fieldbus interfacing. Use Value: Integrated Ethernet MAC + multiple serial interfaces eliminate external bridge ICs; hibernate mode enables low-power occupancy sensing integration. |
| Smart Energy Metering | Remote Industrial I/O Node |
Use Scenario: ANSI C12.19-compliant electricity meter with pulse counting, tamper detection, and secure firmware updates over CAN or Ethernet. IC Role / Device Role / Timing Role: System-on-chip handling metrology interface, secure boot, encrypted OTA updates, and time-stamped event logging. Use Value: 256 KB flash stores dual firmware images; hibernate RTC maintains billing timestamp accuracy during mains outage. | Use Scenario: DIN-rail mounted I/O module collecting analog/digital sensor data and forwarding via CANopen or Modbus TCP. IC Role / Device Role / Timing Role: Field controller aggregating 16-channel ADC inputs, executing local logic, and routing data over dual CAN or Ethernet uplinks. Use Value: 64 KB SRAM buffers burst sensor reads; dual CAN ports support redundant network topologies in harsh EMI environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TM4C123GH6PM | Successor part: Cortex-M4F core, 80 MHz, 256 KB flash, same pinout, adds FPU and USB OTG. | Requires updated toolchain and driver libraries; USB support enables HID-class device emulation not available on LM3S8970. | Select when floating-point math or USB device functionality is required; drop-in replacement only with firmware adaptation. |
| STM32F407VGT6 | ARM Cortex-M4F, 168 MHz, 1 MB flash, 192 KB SRAM, single CAN, no integrated Ethernet MAC. | Lacks native Ethernet MAC - requires external PHY + MAC logic or uses SPI-connected Ethernet controller, increasing BOM cost and latency. | Choose for higher compute throughput and larger memory; accept added complexity for Ethernet connectivity. |
Compared with TM4C123GH6PM and STM32F407VGT6, the LM3S8970-IQC50-A2 offers unique dual-CAN + Ethernet MAC integration in a mature industrial-qualified package, making it optimal for cost-sensitive, space-constrained networking nodes where legacy Stellaris ecosystem compatibility matters.
Availability
LM3S8970-IQC50-A2 is available at Aetrix Electronics and suitable for industrial motor control, building automation gateways, smart energy metering, and remote I/O nodes requiring stable component supply and long-term lifecycle support.
Supply support for LM3S8970-IQC50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with decades of industrial-grade product leadership.
The Stellaris LM3S series was designed as the first ARM Cortex-M3-based MCU family for deterministic real-time control in resource-constrained industrial and automotive applications, emphasizing peripheral integration and low-power hibernation.
FAQ
Does the LM3S8970-IQC50-A2 include an integrated Ethernet PHY?
No, the LM3S8970-IQC50-A2 integrates only the Ethernet MAC layer compliant with IEEE 802.3. An external PHY chip (e.g., DP83848) is required for physical layer signaling. The device provides full MII interface signals including TXD0–7, RXD0–7, TXEN, RXDV, CRS, and COL, enabling direct connection to industry-standard PHYs without glue logic.
What is the hibernate current specification for the LM3S8970-IQC50-A2?
The LM3S8970-IQC50-A2 achieves 1.7 µA typical hibernate current with RTC enabled and 2 KB of battery-backed SRAM retained. This value is measured at 3.3 V and 25°C with VBAT supplied and all non-hibernate power domains powered down. Actual current may vary slightly with temperature and supply voltage but remains within 2.5 µA maximum across the full -40°C to +85°C operating range.
Is the LM3S8970-IQC50-A2 pin-compatible with other Stellaris LM3S devices?
The LM3S8970-IQC50-A2 uses a 100-pin LQFP package identical to LM3S811, LM3S818, and LM3S8962 in footprint and pin assignment for power, ground, JTAG, and primary peripherals. However, certain alternate functions (e.g., Ethernet MII signals) are unique to the LM3S8970-IQC50-A2 and not bonded out on smaller variants - verify signal mapping before PCB reuse.
Does the LM3S8970-IQC50-A2 support CAN FD?
No, the LM3S8970-IQC50-A2 implements CAN 2.0A/B protocol only, with fixed 11-bit standard or 29-bit extended identifiers and 8-byte payload per frame. It does not support CAN FD features such as flexible data-rate switching, larger payloads (up to 64 bytes), or CRC enhancements. For CAN FD, consider TI's TCAN4550 or newer C2000 or Sitara devices.
What debug interface does the LM3S8970-IQC50-A2 use?
The LM3S8970-IQC50-A2 uses a 5-pin JTAG interface (TCK, TMS, TDI, TDO, nTRST) compliant with IEEE 1149.1, supporting full boundary-scan, flash programming, and real-time debugging via SWD-compatible adapters. TI's ICDI firmware and tools like Code Composer Studio or Keil MDK provide complete debug visibility into Cortex-M3 registers, memory, and peripheral states during development of LM3S8970-IQC50-A2 firmware.
LM3S8970-IQC50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- Stellaris® ARM® Cortex®-M3S 8000
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 46
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S8970-IQC50-A2 FAQ
1.How can I place an order for LM3S8970-IQC50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S8970-IQC50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S8970-IQC50-A2 reliable?
The price and inventory of LM3S8970-IQC50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S8970-IQC50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S8970-IQC50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S8970-IQC50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S8970-IQC50-A2?
LM3S8970-IQC50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S8970-IQC50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S8970-IQC50-A2?
For technical support, including LM3S8970-IQC50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S8970-IQC50-A2 requirements.
6.How does Aetrix verify that LM3S8970-IQC50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S8970-IQC50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S8970-IQC50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S8970-IQC50-A2?
All LM3S8970-IQC50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S8970-IQC50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S8970-IQC50-A2 part is unused and in its original packaging.
Return procedure for LM3S8970-IQC50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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