My Inquiry
My Account
Texas Instruments LM3S8971-IBZ50-A2
- Part No.:
- LM3S8971-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S8971-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,116
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S8971-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, 12-bit ADC (8-channel), and hibernation module supporting RTC and battery-backed memory. It operates at up to 50 MHz and targets embedded control in industrial automation and motor drive systems.
For engineers reviewing the LM3S8971-IBZ50-A2 datasheet, LM3S8971-IBZ50-A2 pinout, LM3S8971-IBZ50-A2 application, or LM3S8971-IBZ50-A2 equivalent, key selection criteria include its 50 MHz CPU clock, on-chip CAN interface, hibernation power management, and QFP-100 package compatibility with legacy Stellaris designs.
Technical Context
The LM3S8971-IBZ50-A2 implements the ARMv7-M architecture with NVIC, SysTick, and MPU for deterministic real-time execution. It integrates a dedicated hibernation module with RTC, battery-backed RAM, and wake-on-external-interrupt capability.
Its peripheral set includes one CAN controller compliant with ISO 11898-1, two UARTs with IrDA/SIR support, two SSI interfaces, four 32-bit GPTMs (with PWM and RTC modes), and an 8-channel 12-bit ADC with hardware averaging and temperature sensor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs Thumb-2 instructions for compact code and high efficiency |
| Max Clock Speed | 50 MHz - enables real-time control loops with sub-20 µs interrupt latency |
| Flash / SRAM | 256 KB flash / 64 KB SRAM - supports complex firmware with bootloader, communication stacks, and data buffers |
| CAN Interface | One CAN 2.0A/B controller with 32 message objects - handles full automotive/industrial bus traffic without external transceiver logic |
| ADC | 12-bit, 1 MSPS, 8-channel with hardware averaging - suitable for precision analog sensing in motor current or temperature monitoring |
| Hibernation Mode | Sub-µA sleep with RTC, battery-backed RAM, and wake-on-pin/interrupt - extends battery life in remote sensors or metering devices |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard PCB assembly and thermal management for industrial environments |
Pinout & Package
LM3S8971-IBZ50-A2 is housed in a 100-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, rated for industrial temperature range (–40°C to +85°C). Pin functions are defined per TI SPMS176I datasheet revision I.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VDDA | Core & Analog Power Supply | 3.3 V nominal supply; separate analog rail reduces noise coupling into ADC and PLL circuits |
| GND / GNDA | Ground Reference | Dedicated analog ground plane improves ADC SNR and reference stability |
| OSC0 / OSC1 | Crystal Oscillator Input/Output | Supports 4–25 MHz crystal for main system clock; optional external clock input mode |
| RTCCLK | Real-Time Clock Input | Accepts 32.768 kHz watch crystal for low-power timekeeping during hibernation |
| CAN0RX / CAN0TX | CAN Bus Interface Signals | Differential receive/transmit pins for direct connection to external CAN transceiver (e.g., SN65HVD230) |
| PD0 / PD1 | UART0 Transmit/Receive | Default UART0 I/O pins; configurable as GPIO or alternate function via GPIO AFSEL register |
| PF0–PF4 | General-Purpose I/O | Five pins with NMI, user switch, and LED support; PF0 is non-maskable interrupt input |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Hibernation Module | Enables sub-1 µA deep-sleep state with RTC, battery-backed RAM, and wake-on-external-event - eliminates need for external PMIC in battery-powered nodes |
| Dual UART with IrDA/SIR | Supports infrared data transmission and serial IR protocols - enables wireless configuration and diagnostics without RF components |
| Hardware-Averaged ADC | Configurable 2x–64x oversampling and averaging - improves effective resolution to >13 bits for noisy industrial signal acquisition |
| Memory Protection Unit (MPU) | Eight-region MPU enforces privilege-level access control - isolates bootloader, application, and peripheral drivers for safety-critical firmware |
| GPIO Commit Registers | Write-once lock for GPIO configuration - prevents accidental reconfiguration of critical I/O (e.g., motor enable lines) during runtime |
Applications
| Industrial Motor Control | Building Automation Sensor Node |
|---|---|
Use Scenario: Closed-loop control of BLDC motors using PWM outputs, current sensing via ADC, and CAN-based command distribution across multi-axis drives. IC Role / Device Role / Timing Role: Real-time controller executing FOC algorithms, managing CAN bus arbitration, and synchronizing PWM timers to commutation events. Use Value: Integrated CAN and 50 MHz Cortex-M3 eliminate external protocol ICs and reduce loop latency below 50 µs for responsive torque control. | Use Scenario: Battery-powered HVAC sensor node measuring temperature, humidity, and CO₂, transmitting data over CAN to central BMS. IC Role / Device Role / Timing Role: Low-power system manager handling sensor reads, hibernation scheduling, RTC-triggered wake-ups, and CAN frame assembly. Use Value: Sub-µA hibernation with battery-backed RAM preserves sensor history and network state across months of operation on coin-cell power. |
| Automotive Diagnostic Tool | Programmable Logic Controller (PLC) I/O Module |
Use Scenario: Handheld OBD-II scanner interfacing with vehicle ECUs via CAN, displaying live PID data and fault codes on local LCD. IC Role / Device Role / Timing Role: CAN protocol handler, UART-to-LCD bridge, and button/LED interface controller with real-time response to diagnostic requests. Use Value: On-chip CAN controller and dual UARTs allow simultaneous vehicle bus communication and human interface without external level shifters or protocol converters. | Use Scenario: DIN-rail mounted I/O expansion module converting discrete 24 V inputs/outputs to CANopen network messages for centralized PLC control. IC Role / Device Role / Timing Role: Deterministic I/O scheduler with GPIO debouncing, edge-triggered interrupts, and CAN message queuing for fieldbus integration. Use Value: 100-pin LQFP provides sufficient GPIO count (up to 68 usable) and CAN+UART+SSI peripherals to support mixed digital/analog I/O and fieldbus bridging in one chip. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Tiva C TM4C123GH6PM | Successor part with same pinout, 80 MHz Cortex-M4F core, FPU, enhanced CAN filtering, and USB OTG - requires minor firmware update for FPU/USB use | Supports floating-point math and USB device/host roles; not qualified for extended hibernation with battery backup | Select when upgrading performance or adding USB connectivity; retain existing PCB layout |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, CAN 2.0B, but no hibernation module or integrated RTC battery switchover | Lacks sub-µA sleep with RTC; requires external RTC and power-switching circuitry for long-term battery operation | Select for higher clock speed and larger flash where ultra-low-power hibernation is not required |
Compared with TM4C123GH6PM and STM32F103VET6, the LM3S8971-IBZ50-A2 uniquely delivers certified hibernation with battery-backed RAM and integrated CAN in a mature, production-qualified industrial package - making it optimal for cost-sensitive, battery-constrained CAN nodes where firmware stability outweighs raw speed.
Availability
LM3S8971-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, building automation sensor nodes, automotive diagnostic tools, and programmable logic controller I/O modules requiring stable component supply and long-term lifecycle support.
Supply support for LM3S8971-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The Stellaris LM3S family was designed specifically for deterministic real-time control in resource-constrained industrial environments, emphasizing low-latency interrupt response, integrated communication peripherals, and robust power management - all implemented in silicon before ARM's Cortex-M4F era.
FAQ
What is the maximum operating frequency of the LM3S8971-IBZ50-A2?
The LM3S8971-IBZ50-A2 operates at a maximum CPU clock frequency of 50 MHz, as specified in the Texas Instruments SPMS176I datasheet. This speed is achieved using the internal PLL driven by the main oscillator (4–25 MHz crystal or external clock). The 50 MHz rating applies across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±10% supply voltage. The LM3S8971-IBZ50-A2 does not support overclocking beyond this specification.
Does the LM3S8971-IBZ50-A2 include a hardware CAN controller?
Yes, the LM3S8971-IBZ50-A2 integrates a single CAN 2.0A/B-compliant controller with 32 message objects, acceptance filtering, and bit-rate programming registers. It supports both standard (11-bit) and extended (29-bit) identifiers and includes dedicated transmit/receive FIFOs. The LM3S8971-IBZ50-A2 requires an external CAN transceiver (e.g., SN65HVD230) for physical layer interfacing, as the controller itself is protocol-only.
What power-saving features does the LM3S8971-IBZ50-A2 support?
The LM3S8971-IBZ50-A2 includes a dedicated hibernation module enabling sub-1 µA deep-sleep current with RTC, battery-backed RAM (up to 2 KB), and wake-on-external-pin or RTC alarm. It also supports sleep, deep-sleep, and shutdown modes managed by the Cortex-M3 SCB. The hibernation module uses a separate 32.768 kHz crystal input (RTCCLK) and internal battery switchover circuitry - a feature confirmed in Section 6 of the SPMS176I datasheet for the LM3S8971-IBZ50-A2.
Is the LM3S8971-IBZ50-A2 pin-compatible with other Stellaris devices?
The LM3S8971-IBZ50-A2 uses a 100-pin LQFP package identical to other LM3S8xx-series microcontrollers (e.g., LM3S811, LM3S818), enabling drop-in replacement within that family. However, it is not pin-compatible with Tiva C series (e.g., TM4C123GH6PM), despite shared footprint - differences in power sequencing, debug interface, and peripheral mapping require board-level validation. The LM3S8971-IBZ50-A2 datasheet confirms pinout consistency only across LM3S89xx variants.
What development tools are supported for the LM3S8971-IBZ50-A2?
Texas Instruments officially supports the LM3S8971-IBZ50-A2 with Keil MDK-ARM, IAR Embedded Workbench, and GCC-based toolchains (e.g., Sourcery CodeBench). Debugging is enabled via JTAG or SWD using TI XDS100v2/v3 emulators or third-party adapters. StellarisWare Peripheral Driver Library and example projects are provided in the LM3S8971-IBZ50-A2-specific SDK, maintained until TI's end-of-life transition to Tiva C.
LM3S8971-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 8000
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, Ethernet, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S8971-IBZ50-A2 FAQ
1.How can I place an order for LM3S8971-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S8971-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S8971-IBZ50-A2 reliable?
The price and inventory of LM3S8971-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S8971-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S8971-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S8971-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S8971-IBZ50-A2?
LM3S8971-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S8971-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S8971-IBZ50-A2?
For technical support, including LM3S8971-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S8971-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S8971-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S8971-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S8971-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S8971-IBZ50-A2?
All LM3S8971-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S8971-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S8971-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S8971-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S8971-IBZ50-A2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
